HP BladeSystem Enclosure technologies manual

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The Onboard Administrator aggregates up to eight iLO 2 ports in a c3000 Enclosure, simplifying cable management and providing a graphical interface to launch individual server iLO management interfaces.

The rear of each module has an LED (blue unit identification) that can be enabled locally or remotely and can be used to identify the enclosure from the back of the rack.

The c3000 Enclosure currently supports one Onboard Administrator module. Enclosure devices continue to operate normally in the event of a hardware failure or removal; however, management capabilities of the enclosure are lost. Enclosure fans run at full speed to ensure adequate cooling when no Onboard Administrator is present.

Onboard Administrator collects system parameters related to thermal and power status, system configuration, and managed network configuration. It manages these variables cohesively and intelligently so that IT personnel can configure the HP BladeSystem c-Class and manage it in a fraction of the time that other solutions require.

Onboard Administrator retrieves thermal information from the components in the enclosure. If the enclosure’s thermal load increases, the Onboard Administrator’s thermal logic feature instructs the fan controllers to increase fan speeds to accommodate the additional demand. Individual fan speeds can be adjusted to reduce noise and power consumption, and to compensate for airflow differences within the enclosure. Performance of each subsystem is proactively monitored, and any failures or warnings can be reported to the system log and to broader infrastructure management tools such as HP Systems Insight Manager (when SNMP is enabled). The Onboard Administrator manages subsystem failure by taking appropriate action, including adjusting fan speed or reducing power consumption, to maintain the enclosure’s ability to operate.

The Onboard Administrator uses sophisticated power measurement sensors to accurately monitor exactly how much power is being consumed and how much power is available. Because Onboard Administrator uses real-time measured power data instead of maximum power envelopes, customers can deploy as many servers and interconnect modules as possible for the available power.

Onboard Administrator includes logic to manage multiple enclosures in a rack. The Onboard Administrator allows single-point access for up to four enclosures. Thus, an IT administrator can use a single sign-on to log into a single Onboard Administrator and use the web GUI to graphically view and manage all the c-Class components within the linked enclosures. For example, an IT administrator could automatically propagate management commands—such as putting an upper limit on power levels for all server blades—throughout the linked enclosures.

A major advantage of the HP BladeSystem c-Class is its configuration flexibility. The configuration logic resides in the management controller module in the front of the enclosure. The Onboard Administrator module communicates with the iLO 2 management processor on each server blade to form the core of the management architecture for HP BladeSystem c-Class. The configuration logic powers up the interconnect modules first. Server blades are not powered up until the Onboard Administrator has verified that the configuration is correct. If there is a configuration issue, the Insight Display identifies the issue and possible remedies.

To assist IT administrators in the configuration and setup process, the Onboard Administrator verifies four attributes for each server blade and interconnect module as they are added to the enclosure:

Electronic keying—The Onboard Administrator automatically queries all mezzanine cards and interconnect modules as they are deployed to check whether the interconnect fabric types match. If they do not, the Onboard Administrator issues a warning with suggested corrective action.

Power—The Onboard Administrator ensures that sufficient power is available to power up a server blade or interconnect module.

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Contents HP BladeSystem c3000 Enclosure technologies technology briefAbstract Overview of HP BladeSystem c3000 EnclosurePage HP Thermal Logic technologies Active Cool fans HP PARSEC architecture Figure 4. HP BladeSystem c3000 self-sealing enclosureThermal Logic for the server blade and enclosure Power supplies and enclosure power subsystem HP BladeSystem Power Sizer Pooled power Connecting with no power redundancy configured Interconnect options and infrastructure Figure 9. Diagram of the HP BladeSystem c3000 signal midplaneFabric connectivity and port mapping Several port types are referenced in Figures 12 and Mezzanine 1 and Interconnect Bay Virtual Connect Onboard Administrator Enclosure-based DVD ROMPage Insight Display Web GUI Command-line interfaceOnboard Administrator cabling Enclosure link cablingRecommendations SummaryAppendix A. Acronyms in text The following acronyms are used in the text of this documentAppendix B. Fan, power supply, and device bay population guidelines Power supply bays used Table B-1. Power supply placementNumber of power supplies All power supply bays filledPage 8 half-height server blades with both full-height dividers installed Page For additional information, refer to the resources listed below For more informationCall to action Send comments about this paper to TechCom@HP.com