HP BladeSystem Enclosure technologies manual

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•8 half-height server blades with both full-height dividers installed

Figure B-5. The c3000 Enclosure is divided by sheet metal panels into 2 full-height zones. Each horizontal zone is divided vertically by a removable shelf to make a maximum of 8 half-height device bays. These zones reflect the PCIe bus mapping in the signal midplane and limit placement of the server blade/storage blade combination. The signal midplane has a direct PCIe link connecting adjacent paired device bays. Important: The server blade/storage blade relationship cannot extend horizontally beyond the vertical dividers between full height device bays, nor can it span the removable bay shelf dividing the zone into half-height device bays

.Manual background

The enclosure comes preinstalled with removable full-height dividers between the top four device bays and the bottom four device bays. In addition, there is a half-height divider available for use between device bays 4 and 8 if the full-height divider is removed. Using these combinations of dividers, the following combinations of server blades can be installed:

8 half-height server blades with both full-height dividers installed

4 full-height server blades with both full-height dividers removed

4 half-height server blades in the bottom half of the enclosure with 1 full-height divider installed

2 full-height server blades in the bottom half of the enclosure with 1 full-height divider removed

4 half-height server blades in the top half with 1 full-height divider installed

2 full-height server blades in the top half with 1 full-height divider removed

1 full-height server blade and 2 half-height server blades in the top half with 1 full-height divider removed and the half-height divider installed

CAUTION

If a full-height server blade is installed in device bay 1/5 and half-height server blades are installed in device bays 2 or 6, removing the full-height server blade leaves server blades installed in device bays 2 and 6 unsupported. This might cause damage to the server blades and the enclosure connectors.

Removing the full-height divider in the bottom half of the enclosure allows only full-height server blades to be installed in the bottom half of the enclosure.

Removing the full-height divider in the top half of the enclosure requires either installing only full-height server blades in the top half of the enclosure or installing the half-height divider between device bays 4 and 8. Installing the half-height divider enables installation of two half-height devices (two server blades, one companion blade and one server blade, or one blade blank and one companion blade or server blade) in device bays 4 and 8 and 1 full-height server blade in device bay 3/7.

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Contents HP BladeSystem c3000 Enclosure technologies technology briefAbstract Overview of HP BladeSystem c3000 EnclosurePage HP Thermal Logic technologies Active Cool fans HP PARSEC architecture Figure 4. HP BladeSystem c3000 self-sealing enclosureThermal Logic for the server blade and enclosure Power supplies and enclosure power subsystem HP BladeSystem Power Sizer Pooled power Connecting with no power redundancy configured Interconnect options and infrastructure Figure 9. Diagram of the HP BladeSystem c3000 signal midplaneFabric connectivity and port mapping Several port types are referenced in Figures 12 and Mezzanine 1 and Interconnect Bay Virtual Connect Onboard Administrator Enclosure-based DVD ROMPage Insight Display Web GUI Command-line interfaceOnboard Administrator cabling Enclosure link cablingRecommendations SummaryAppendix A. Acronyms in text The following acronyms are used in the text of this documentAppendix B. Fan, power supply, and device bay population guidelines Power supply bays used Table B-1. Power supply placementNumber of power supplies All power supply bays filledPage 8 half-height server blades with both full-height dividers installed Page For additional information, refer to the resources listed below For more informationCall to action Send comments about this paper to TechCom@HP.com