HP BladeSystem Enclosure technologies manual

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Manual background

Figure B-3. HP BladeSystem c3000 Enclosure – Full-height server blade device bay numbering. Full--height servers should be populated from bottom to top when viewing from the front of the enclosure. With four fans, only the bottom two device bays can be used; with six fans, all device bays can be used.

Figure B-4. HP BladeSystem c3000 Enclosure – Half-height server blade device bay numbering. Half--height servers should be populated from the bottom of the enclosure, in the following order: Device bays 1, 5, 2, 6, 3, 7, 4, 8.

IMPORTANT

When looking at the rear of the enclosure, device bay numbering is reversed.

CAUTION

To prevent improper cooling or thermal damage, do not operate the server blade or the enclosure unless all device bays are populated with either a component or a blank.

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Contents technology brief HP BladeSystem c3000 Enclosure technologiesOverview of HP BladeSystem c3000 Enclosure AbstractPage HP Thermal Logic technologies Active Cool fans Figure 4. HP BladeSystem c3000 self-sealing enclosure HP PARSEC architectureThermal Logic for the server blade and enclosure Power supplies and enclosure power subsystem HP BladeSystem Power Sizer Pooled power Connecting with no power redundancy configured Figure 9. Diagram of the HP BladeSystem c3000 signal midplane Interconnect options and infrastructureFabric connectivity and port mapping Several port types are referenced in Figures 12 and Mezzanine 1 and Interconnect Bay Virtual Connect Enclosure-based DVD ROM Onboard AdministratorPage Insight Display Onboard Administrator cabling Command-line interfaceWeb GUI Enclosure link cablingSummary RecommendationsThe following acronyms are used in the text of this document Appendix A. Acronyms in textAppendix B. Fan, power supply, and device bay population guidelines Number of power supplies Table B-1. Power supply placementPower supply bays used All power supply bays filledPage 8 half-height server blades with both full-height dividers installed Page Call to action For more informationFor additional information, refer to the resources listed below Send comments about this paper to TechCom@HP.com