HP BladeSystem Enclosure technologies manual HP BladeSystem Power Sizer

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HP BladeSystem Power Sizer

Figure 7. HP BladeSystem c3000 Enclosure supports up to six power supplies

The new, high efficiency HP c3000 power supplies provide greater than 90 percent efficiency in AC to DC conversion. These power supplies use the ProLiant universal form factor so they can also be used in other ProLiant servers. Each AC power supply ships with a standard power distribution unit (PDU) power cord (C13 to C14 ). By purchasing proper wall outlet cords, users can connect the power supplies to standard wall outlets.

NOTE

Wall outlet power cords should only be used with low-line (100 to 120 VAC) power sources. If high-line (200 to 240 VAC) power outlets are required, safety regulations require the use of a PDU or a UPS between the c3000 Enclosure power supplies and wall outlets.

The enclosure can contain up to six 1200-wattself-cooled power supplies. A pair of PDUs is required for AC line redundancy. A variety of PDUs can be chosen, as indicated in the c3000 QuickSpecs available at this URL: http://h18004.www1.hp.com/products/quickspecs/12790_div/12790_div.html. The HP BladeSystem Power Sizer should be used to size the PDU appropriately for the c3000 storage and server configuration.

HP expects that in the markets targeted for the c3000 Enclosure (midmarket and remote sites), the c3000 will be connected to an uninterruptible power supply (UPS) for power backup instead of to a PDU. Use the HP BladeSystem Power Sizer to determine the UPS capacity requirement.

NOTE

The rack-mountable HP R5500 UPS (5000VA/4500 watts) supports four power supplies in the power supply redundant (N+1) power mode.

HP BladeSystem Power Sizer

The HP BladeSystem Power Sizer is a tool that assists facilities teams and IT staff in sizing their power and cooling infrastructure to meet the needs of an HP BladeSystem solution. The BladeSystem Power Sizer is based on actual component-level power measurements of a system stressed to maximum capability. The sizer allows a customer to select the type and number of components within each server blade and enclosure and to see the effect of changes on power consumption and heat loading.

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Contents technology brief HP BladeSystem c3000 Enclosure technologiesOverview of HP BladeSystem c3000 Enclosure AbstractPage HP Thermal Logic technologies Active Cool fans Figure 4. HP BladeSystem c3000 self-sealing enclosure HP PARSEC architectureThermal Logic for the server blade and enclosure Power supplies and enclosure power subsystem HP BladeSystem Power Sizer Pooled power Connecting with no power redundancy configured Figure 9. Diagram of the HP BladeSystem c3000 signal midplane Interconnect options and infrastructureFabric connectivity and port mapping Several port types are referenced in Figures 12 and Mezzanine 1 and Interconnect Bay Virtual Connect Enclosure-based DVD ROM Onboard AdministratorPage Insight Display Onboard Administrator cabling Command-line interfaceWeb GUI Enclosure link cablingSummary RecommendationsThe following acronyms are used in the text of this document Appendix A. Acronyms in textAppendix B. Fan, power supply, and device bay population guidelines Number of power supplies Table B-1. Power supply placementPower supply bays used All power supply bays filledPage 8 half-height server blades with both full-height dividers installed Page Call to action For more informationFor additional information, refer to the resources listed below Send comments about this paper to TechCom@HP.com