HP BladeSystem Enclosure technologies manual For more information, Call to action

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For more information

For more information

For additional information, refer to the resources listed below.

Resource description

Web address

 

 

General HP BladeSystem information

http://www.hp.com/go/bladesystem/

 

 

HP BladeSystem c-Class

http://h71028.www7.hp.com/enterprise/cache/316735-0-0-0-

121.html

documentation

 

 

 

HP BladeSystem c3000 Enclosure

http://h20000.www2.hp.com/bc/docs/support/SupportManual/

c01126895/c01126895.pdf

Maintenance and Service Guide

 

 

 

HP BladeSystem c3000 Enclosure

http://h18004.www1.hp.com/products/quickspecs/12790_div/1

2790_div.html

QuickSpecs

 

 

 

HP BladeSystem Onboard

http://h20000.www2.hp.com/bc/docs/support/SupportManual/

c00705292/c00705292.pdf

Administrator User Guide

 

 

 

HP BladeSystem c-Class interconnects

www.hp.com/go/bladesystem/interconnects

 

 

 

Technology briefs about HP

http://h18004.www1.hp.com/products/servers/technology/white

papers/proliant-servers.html

BladeSystem

 

 

 

HP BladeSystem Power Sizer

http://www.hp.com/go/bladesystem/powercalculator

 

 

 

HP BladeSystem c-Class firmware

http://www.hp.com/go/bladesystemupdates

 

compatibility matrix

 

 

 

Call to action

Send comments about this paper to TechCom@HP.com.

© 2007 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Intel and Xeon are trademarks or registered trademarks of Intel Corporation in the U.S. and other countries and are used under license.

Linux is a U.S registered trademark of Linus Torvalds. TC071001TB, October 2007

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Contents HP BladeSystem c3000 Enclosure technologies technology briefAbstract Overview of HP BladeSystem c3000 EnclosurePage HP Thermal Logic technologies Active Cool fans HP PARSEC architecture Figure 4. HP BladeSystem c3000 self-sealing enclosureThermal Logic for the server blade and enclosure Power supplies and enclosure power subsystem HP BladeSystem Power Sizer Pooled power Connecting with no power redundancy configured Interconnect options and infrastructure Figure 9. Diagram of the HP BladeSystem c3000 signal midplaneFabric connectivity and port mapping Several port types are referenced in Figures 12 and Mezzanine 1 and Interconnect Bay Virtual Connect Onboard Administrator Enclosure-based DVD ROMPage Insight Display Command-line interface Onboard Administrator cablingWeb GUI Enclosure link cablingRecommendations SummaryAppendix A. Acronyms in text The following acronyms are used in the text of this documentAppendix B. Fan, power supply, and device bay population guidelines Table B-1. Power supply placement Number of power suppliesPower supply bays used All power supply bays filledPage 8 half-height server blades with both full-height dividers installed Page For more information Call to actionFor additional information, refer to the resources listed below Send comments about this paper to TechCom@HP.com