HP BladeSystem Enclosure technologies manual

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Manual background

Table 1. Comparison of components supported by HP BladeSystem c-Class Enclosures

Enclosure	c3000	c7000

Height	6U	10U

Blade orientation	Horizontal	Vertical

Blades supported	8 HH , 4 FH, 6HH/1FH	16 HH, 8 FH

Interconnect bays	4	8

Power supplies	6 at up to 1200 watts each	6 at 2250 watts each

Active Cool fans	6	10

Enclosure KVM support	Yes	No

CD/DVD support	Enclosure-based available	External

OA support	Single (now)	Single or dual
		Single or dual
	Dual (future)

Midplane speed	Tested up to 10 Gbit on Midplane	Tested up to 10 Gbit on midplane

OA Serial/USB connections	In front	In rear

Figures 1 and 2 show the front and rear view of the HP BladeSystem c3000 Enclosure.

Figure 1. HP BladeSystem c3000 Enclosure – front view

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Contents technology brief HP BladeSystem c3000 Enclosure technologiesOverview of HP BladeSystem c3000 Enclosure AbstractPage HP Thermal Logic technologies Active Cool fans Figure 4. HP BladeSystem c3000 self-sealing enclosure HP PARSEC architectureThermal Logic for the server blade and enclosure Power supplies and enclosure power subsystem HP BladeSystem Power Sizer Pooled power Connecting with no power redundancy configured Figure 9. Diagram of the HP BladeSystem c3000 signal midplane Interconnect options and infrastructureFabric connectivity and port mapping Several port types are referenced in Figures 12 and Mezzanine 1 and Interconnect Bay Virtual Connect Enclosure-based DVD ROM Onboard AdministratorPage Insight Display Enclosure link cabling Command-line interfaceOnboard Administrator cabling Web GUISummary RecommendationsThe following acronyms are used in the text of this document Appendix A. Acronyms in textAppendix B. Fan, power supply, and device bay population guidelines All power supply bays filled Table B-1. Power supply placementNumber of power supplies Power supply bays usedPage 8 half-height server blades with both full-height dividers installed Page Send comments about this paper to TechCom@HP.com For more informationCall to action For additional information, refer to the resources listed below