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CY7C1361C, CY7C1363C manual
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Contents
Main
9-Mbit
(
256K x 36/512K x 18
)
Flow-Throu
Logic Block Diagram CY7C1361C (256K x 36)
ADDRESS REGISTER ADV CLK BURST COUNTER AND LOGIC CLR
ZZ
A
BWE
CY7C1361C CY7C1363C
Document #: 38-05541 Rev. *F Page 3 of 31
Pin Configurations
CY7C1361C (256K x 36)
CY7C1363C (512K x 18)
100-Pin TQFP Pinout (2 Chip Enables) (AJ Version)
CY7C1363C (512K x 18)
CY7C1361C (256K x 36)
119-Ball BGA Pinout (2 Chip Enables with JTAG)
CY7C1361C CY7C1363C
165-Ball FBGA Pinout (3 Chip Enable)
CY7C1363C (512K x 18)
CY7C1361C (256K x 36)
2345671 A B C D E F G H J K L M N P R
CY7C1361C CY7C1363C
Pin Definitions
Functional Overview
Burst Sequences
Interleaved Burst Address Table (MODE = Floating or VDD)
Linear Burst Address Table (MODE = GND)
ZZ Mode Electrical Characteristics
Truth Table
Partial Truth Table for Read/Write
Truth Table for Read/Write
IEEE 1149.1 Serial Boundary Scan (JTAG)
TAP Controller State Diagram
TAP Controller Block Diagram
CY7C1361C CY7C1363C
TAP Ti ming
TAP AC Switching Characteristics
3.3V TAP AC Test Conditions
3.3V TAP AC Output Load Equivalent
F
DO
T
Scan Register Sizes
Identification Codes
119-Ball BGA Boundary Scan Order
165-Ball FBGA Boundary Scan Order
Maximum Ratings
Operating Range
Electrical Characteristics
Capacitance
Thermal Resistance
Switching Characteristics
Timing Diagrams
Read Cycle Timing
Write Cycle Timing
Note: 23.Full width write can be initiated by either GW LOW; or by GW HIGH, BWE LOW and BWX LOW.
Read/Write Cycle Timing
ZZ Mode Timing
Page
Ordering Information
Package Diagrams
A
100-Pin TQFP (14 x 20 x 1.4 mm) (51-85050)
Package Diagrams
0.900.05
51-85115-*B
0.56
119-Ball BGA (14 x 22 x 2.4 mm) (51-85115)
Package Diagrams
51-85180-*A
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
1.40 MAX.
51-85180-*A
Document History Page