CY7C1361C
CY7C1363C
Document #: 38-05541 Rev. *F Page 8 of 31
VSS Ground Ground for the core of the device.
VSSQ I/O Ground Ground for the I/O circuitry.
TDO JTAG serial output
Synchronous Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the
JTAG feature is not being utilized, this pin should be left unconnected. This pin is not
available on TQFP packages.
TDI JTAG serial input
Synchronous Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG
feature is not being utilized, this pin can be left floating or connected to VDD through a pull
up resistor. This pin is not available on TQFP packages.
TMS JTAG serial input
Synchronous Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG
feature is not being utilized, this pin can be disconnected or connected to VDD. This pin
is not available on TQFP packages.
TCK JTAG-
Clock Clock input to the JTAG circuitry. If the JTAG feature is not being utilized, this pin must
be connected to VSS. This pin is not available on TQFP packages.
NC – No Connects. Not internally connected to the die. 18M, 36M, 72M, 144M, 288M, 576M
and 1G are address expansion pins and are not internally connected to the die.
VSS/DNU Ground/DNU This pin can be connected to Ground or should be left floating.
Pin Definitions (continued)
Name I/O Description
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