Cypress CY7C1361C, CY7C1363C - page 20

CY7C1361C
CY7C1363C
Document #: 38-05541 Rev. *F Page 20 of 31
Capacitance[15]
Parameter Description Test Conditions 100 TQFP Max. 119 BGA Max. 165 FBGA Max. Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V
VDDQ = 2.5V
555pF
CCLK Clock Input Capacitance 5 5 5 pF
CI/O Input/Output Capacitance 5 7 7 pF
Thermal Resistance[15]
Parameter Description Test Conditions 100 TQFP Package 119 BGA Package 165 FBGA Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard test methods and procedures
for measuring thermal
impedance, per EIA/JESD51
29.41 34.1 16.8 °C/W
ΘJC Thermal Resistance
(Junction to Case) 6.31 14.0 3.0 °C/W
AC Test Loads and Waveforms
Note:
15.Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
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