Technical Reference Guide
Compaq iPAQ Family of Internet Devices
First Edition - March 2000
2-11
2.4.1.3 Processor Upgrading
All models of the Compaq iPAQ use the PGA370 zero-insertion force (ZIF) socket for processor
mounting as shown in Figure 2-7. Raising the Lock/Unlock handle of the socket in the vertical
position allows the processor to be removed or inserted into the socket. Lowering the
Lock/Unlock handle in the down (horizontal) position locks the processor in place. Factory
configurations use processors fitted with passive heat sinks. Upgrade (boxed) processors may be
fitted with a heat sink/fan assembly with a power cable that attaches to the fan power header
provided on the system board .
Figure 27. Processor Assembly and Mounting
The processor clock frequency is automatically set by chipset logic, eliminating the need for
setting DIP switches when upgrading the processor.
WARNING: The system board is designed handle a maximum processor current load
of 18 amps. Installing a replacement processor that draws more than 18 amps of current
may damage the processor and/or the system board.
!
Heat Sink
Processor
PPGA370
Socket
Heat Sink
Retaining Clip
Lock/Unlock
Handle