CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18

18-Mbit QDR™-II SRAM 2-Word Burst Architecture

Features

Separate independent read and write data ports

Supports concurrent transactions

250 MHz clock for high bandwidth

2-word burst on all accesses

Double Data Rate (DDR) interfaces on both read and write ports (data transferred at 500 MHz) at 250 MHz

Two input clocks (K and K) for precise DDR timing

SRAM uses rising edges only

Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches

Echo clocks (CQ and CQ) simplify data capture in high-speed systems

Single multiplexed address input bus latches address inputs for both read and write ports

Separate port selects for depth expansion

Synchronous internally self-timed writes

Available in x8, x9, x18, and x36 configurations

Full data coherency, providing most current data

Core VDD = 1.8V (±0.1V); IO VDDQ = 1.4V to VDD

Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

Variable drive HSTL output buffers

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Functional Description

The CY7C1310BV18, CY7C1910BV18, CY7C1312BV18, and CY7C1314BV18 are 1.8V Synchronous Pipelined SRAMs, equipped with QDR™-II architecture. QDR-II architecture consists of two separate ports: the read port and the write port to access the memory array. The read port has data outputs to support read operations and the write port has data inputs to support write operations. QDR-II architecture has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus required with common IO devices. Access to each port is accomplished through a common address bus. The read address is latched on the rising edge of the K clock and the write address is latched on the rising edge of the K clock. Accesses to the QDR-II read and write ports are completely independent of one another. To maximize data throughput, both read and write ports are provided with DDR interfaces. Each address location is associated with two 8-bit words (CY7C1310BV18), 9-bit words (CY7C1910BV18), 18-bit words (CY7C1312BV18), or 36-bit words (CY7C1314BV18) that burst sequentially into or out of the device. Because data can be trans- ferred into and out of the device on every rising edge of both input clocks (K and K and C and C), memory bandwidth is maximized while simplifying system design by eliminating bus “turn-arounds”.

Depth expansion is accomplished with port selects, which enables each port to operate independently.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C (or K or K in a single clock domain) input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Configurations

CY7C1310BV18 – 2M x 8

CY7C1910BV18 – 2M x 9

CY7C1312BV18 – 1M x 18

CY7C1314BV18 – 512K x 36

Selection Guide

Description

 

250 MHz

200 MHz

167 MHz

Unit

Maximum Operating Frequency

 

250

200

167

MHz

 

 

 

 

 

 

Maximum Operating Current

x8

735

630

550

mA

 

 

 

 

 

 

 

x9

735

630

550

 

 

 

 

 

 

 

 

x18

800

675

600

 

 

 

 

 

 

 

 

x36

900

750

650

 

 

 

 

 

 

 

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document #: 38-05619 Rev. *F

 

 

Revised June 2, 2008

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Cypress CY7C1310BV18, CY7C1314BV18, CY7C1312BV18 manual Features, Functional Description, Configurations, Selection Guide