Contents
Main
18-Mbit QDR-II SRAM 2-Word Burst Architecture
CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18
Features
Configurations
Functional Description
CY7C1312BV18, CY7C1314BV18
Document #: 38-05619 Rev. *F Page 2 of 29
Logic Block Diagram (CY7C1310BV18)
Logic Block Diagram (CY7C1910BV18)
CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18
Document #: 38-05619 Rev. *F Page 3 of 29
Logic Block Diagram (CY7C1312BV18)
Logic Block Diagram (CY7C1314BV18)
CY7C1312BV18, CY7C1314BV18
Pin Configuration
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout
Pin Configuration
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout
Pin Definitions
CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18
Pin Definitions
CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18
Functional Overview
Read Operations
Write Operations
Byte Write Operations
CY7C1310BV18, CY7C1910BV18
Programmable Impedance
Echo Clocks
DLL
Application Example
CY7C1310BV18, CY7C1910BV18
Truth Table
Write Cycle Descriptions
Page
CY7C1312BV18, CY7C1314BV18
IEEE 1149.1 Serial Boundary Scan (JTAG)
Disabling the JTAG Feature
Test Access PortTest Clock
Test Mode Select (TMS)
CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18
CY7C1312BV18, CY7C1314BV18
TAP Controller State Diagram
TAP Controller Block Diagram
TAP Electrical Characteristics
TAP AC Switching Characteristics
TAP Timing and Test Conditions
Identification Register Definitions
Scan Register Sizes
Instruction Codes
CY7C1310BV18, CY7C1910BV18 CY7C1312BV18, CY7C1314BV18
Boundary Scan Order
CY7C1310BV18, CY7C1910BV18
Power Up Sequence in QDR-II SRAM
VV
Power Up Sequence
DLL Constraints
Maximum Ratings
Operating Range
Electrical Characteristics
DC Electrical Characteristics
AC Electrical Characteristics
Electrical Characteristics
DC Electrical Characteristics
Capacitance
Thermal Resistance
Switching Characteristics
Document #: 38-05619 Rev. *F Page 24 of 29
Switching Waveforms
Figure 5. Read/Write/Deselect Sequence
1234 5810 67
READ READ WRITE WRITEWRITE NOPREAD WRITE NOP 9
Page
Ordering Information
Document #: 38-05619 Rev. *F Page 27 of 29
Package Diagram
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SOLDERPAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
1.40MAX.
Figure 6. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180
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