CY7C1310BV18, CY7C1910BV18

CY7C1312BV18, CY7C1314BV18

Package Diagram

Figure 6. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180

15.00±0.10

A

TOP VIEW

PIN 1 CORNER

1

2

3

4

5

6

7

8

9

10

11

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

1.00

15.00±0.10

14.00

 

7.00

A

BOTTOM VIEW

PIN 1 CORNER

Ø0.05 M C

Ø0.25 M C A B

-0.06

Ø0.50 (165X)

+0.14

11

10

9

8

7

6

5

4

3

2

1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

1.00

5.00

10.00

0.25 C

 

B

0.53±0.05

 

0.36

C

 

13.00±0.10

 

 

1.40MAX.

 

 

 

 

 

 

 

 

 

0.15C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SEATING PLANE

0.35±0.06

B 13.00±0.10

0.15(4X)

NOTES :

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC

51-85180-*A

Document #: 38-05619 Rev. *F

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Cypress CY7C1910BV18, CY7C1314BV18, CY7C1310BV18, CY7C1312BV18 manual Package Diagram, Ball Fbga 13 x 15 x 1.4 mm