Cypress Package Diagram, CY7C1316JV18, CY7C1916JV18 CY7C1318JV18, CY7C1320JV18, + Feedback

CY7C1316JV18, CY7C1916JV18

CY7C1318JV18, CY7C1320JV18

Package Diagram

Figure 4. 165-ball FBGA (13 x 15 x 1.40 mm), 51-85180

15.00±0.10

A

TOP VIEW

PIN 1 CORNER

1 2 3 4 5 6 7 8 9 10 11

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

1.00

15.00±0.10 14.00

7.00

A

BOTTOM VIEW

PIN 1 CORNER

Ø0.05 M C

Ø0.25 M C A B

-0.06

Ø0.50 (165X)

+0.14

11 10 9 8 7 6 5 4 3 2 1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

1.00

5.00

10.00

0.25 C

	B
0.53±0.05
0.36	C

13.00±0.10

1.40MAX.
	0.15C

SEATING PLANE

0.35±0.06

B 13.00±0.10

0.15(4X)

NOTES :

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC

51-85180-*A

Document Number: 001-15271 Rev. *B Page 25 of 26

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