CY7C1345G
Document Number: 38-05517 Rev. *E Page 11 of 20
CapacitanceTested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Max
119 BGA
Max Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V.
VDDQ = 3.3V
55pF
CCLK Clock Input Capacitance 5 5 pF
CIO Input or Output Capacitance 5 7 pF
Thermal ResistanceTested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Package
119 BGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Test conditions follow
standard test methods and
procedures for measuring
thermal impedance, per
EIA/JESD51.
30.32 34.1 °C/W
ΘJC Thermal Resistance
(Junction to Case)
6.85 14.0 °C/W
AC Test Loads and Waveforms
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤1ns ≤1ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤1 ns ≤1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load