CY7C1364C
Document #: 38-05689 Rev. *E Page 17 of 18
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsib ility f or the u se
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
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i486 is a trademark, and Intel and Pentium are registered trademarks, of Intel Corporation. PowerPC is a registered trademark

of IBM Corporation. All product and company names mentioned in this document may be trademarks of their respective holders.

Package Diagram
NOTE:
1.JEDEC STD REF MS-026
2.BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH
MOLDPROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE
3.DIMENSIONS IN MILLIMETERS
BODYLENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH
0.30±0.08
0.65
20.00±0.10
22.00±0.20
1.40±0.05
12°±1°
1.60MAX.
0.05MIN.
0.60±0.15
0°MIN.
0.25
0°-7°
(8X)
STAND-OFF
R0.08 MIN.
TYP.
0.20MAX.
0.15MAX.
0.20MAX.
R0.08 MIN.
0.20MAX.
14.00±0.10
16.00±0.20
0.10
SEEDETAIL A
DETAIL

A

1
100
30
31 50
51
80
81
GAUGEPLANE
1.00REF.
0.20MIN.
SEATINGPLANE

100-Pin TQFP (14 x 20 x 1.4 mm) (51-85050)

51-85050-*B
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