CY7C1471BV25
CY7C1473BV25, CY7C1475BV25
Document #: 001-15013 Rev. *E Page 21 of 30
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Max 165 FBGA
Max 209 FBGA
Max Unit
CADDRESS Address Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 2.5V
VDDQ = 2.5V
6 6 6 pF
CDATA Data Input Capacitance 5 5 5 pF
CCTRL Control Input Capacitance 8 8 8 pF
CCLK Clock Input Capacitance 6 6 6 pF
CIO Input-Output Capacitance 5 5 5 pF
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions 100 TQFP
Package 165 FBGA
Package 209 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow
standard test methods and
procedures for measuring
thermal impedance,
according to EIA/JESD51.
24.63 16.3 15.2 °C/W
ΘJC Thermal Resistance
(Junction to Case) 2.28 2.1 1.7 °C/W
Figure 7. AC Test Loads and Waveforms
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VL= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
2.5V IO Test Load
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