Cypress CY7C1471BV25, CY7C1473BV25, CY7C1475BV25 manual Capacitance, Thermal Resistance

CY7C1471BV25

CY7C1473BV25, CY7C1475BV25

Capacitance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Max	Max	Max
CADDRESS	Address Input Capacitance	TA = 25°C, f = 1 MHz,	6	6	6	pF
		VDD = 2.5V
CDATA	Data Input Capacitance		5	5	5	pF
		VDDQ = 2.5V
CCTRL	Control Input Capacitance		8	8	8	pF
CCLK	Clock Input Capacitance		6	6	6	pF
CIO	Input-Output Capacitance		5	5	5	pF

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description		Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
				Package	Package	Package
ΘJA	Thermal Resistance		Test conditions follow	24.63	16.3	15.2	°C/W
	(Junction to Ambient)		standard test methods and
			procedures for measuring
ΘJC	Thermal Resistance			2.28	2.1	1.7	°C/W
			thermal impedance,
	(Junction to Case)		according to EIA/JESD51.
		Figure 7. AC Test Loads and Waveforms

2.5V IO Test Load

OUTPUT

2.5V

R = 1667Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL = 50Ω

10%

90%

5 pF

R = 1538Ω

GND

≤ 1 ns

VL = 1.25V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

90%

10%

≤ 1 ns

Document #: 001-15013 Rev. *E Page 21 of 30

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