CY7C1471BV25 CY7C1473BV25, CY7C1475BV25

Maximum Ratings

Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested.

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.5V to +3.6V

Supply Voltage on VDDQ Relative to GND

–0.5V to +VDD

DC Voltage Applied to Outputs

 

 

in Tri-State

–0.5V to VDDQ + 0.5V

Electrical Characteristics

Over the Operating Range [12, 13]

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

20 mA

Static Discharge Voltage

>2001V

(MIL-STD-883, Method 3015)

 

Latch Up Current

>200 mA

Operating Range

Range

Ambient

VDD

VDDQ

Temperature

Commercial

0°C to +70°C

2.5V –5%/+5%

2.5V–5% to

 

 

 

VDD

Industrial

–40°C to +85°C

 

Parameter

Description

Test Conditions

Min

Max

Unit

VDD

Power Supply Voltage

 

 

2.375

2.625

V

VDDQ

IO Supply Voltage

For 2.5V IO

 

2.375

VDD

V

VOH

Output HIGH Voltage

For 2.5V IO, IOH = –1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

For 2.5V IO, IOL= 1.0 mA

 

 

0.4

V

VIH

Input HIGH Voltage[12]

For 2.5V IO

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage[12]

For 2.5V IO

 

–0.3

0.7

V

IX

Input Leakage Current

GND VI VDDQ

 

–5

5

μA

 

except ZZ and MODE

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

μA

 

 

Input = VDD

 

 

5

μA

 

Input Current of ZZ

Input = VSS

 

–5

 

μA

 

 

Input = VDD

 

 

30

μA

IOZ

Output Leakage Current

GND VI VDDQ, Output Disabled

 

–5

5

μA

IDD [14]

VDD Operating Supply

VDD = Max, IOUT = 0 mA,

6.5 ns cycle, 133 MHz

 

305

mA

 

Current

f = fMAX = 1/tCYC

 

 

 

 

 

8.5 ns cycle, 100 MHz

 

275

mA

ISB1

Automatic CE

VDD = Max, Device Deselected,

6.5 ns cycle, 133 MHz

 

170

mA

 

Power Down

VIN VIH or VIN VIL

 

 

 

 

 

8.5 ns cycle, 100 MHz

 

170

mA

 

Current—TTL Inputs

f = fMAX, inputs switching

 

 

 

 

ISB2

Automatic CE

VDD = Max, Device Deselected,

All speeds

 

120

mA

 

Power Down

VIN 0.3V or VIN > VDD – 0.3V,

 

 

 

 

 

Current—CMOS Inputs

f = 0, inputs static

 

 

 

 

ISB3

Automatic CE

VDD = Max, Device Deselected, or

6.5 ns cycle, 133 MHz

 

170

mA

 

Power Down

VIN 0.3V or VIN > VDDQ – 0.3V

 

 

 

 

 

8.5 ns cycle, 100 MHz

 

170

mA

 

Current—CMOS Inputs

f = fMAX, inputs switching

 

 

 

 

ISB4

Automatic CE

VDD = Max, Device Deselected,

All Speeds

 

135

mA

 

Power Down

VIN VDD – 0.3V or VIN 0.3V,

 

 

 

 

 

Current—TTL Inputs

f = 0, inputs static

 

 

 

 

Notes

12.Overshoot: VIH(AC) < VDD +1.5V (pulse width less than tCYC/2). Undershoot: VIL(AC) > –2V (pulse width less than tCYC/2).

13.TPower-up: assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

14.The operation current is calculated with 50% read cycle and 50% write cycle.

Document #: 001-15013 Rev. *E

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Cypress CY7C1475BV25 manual Maximum Ratings, Electrical Characteristics, Operating Range, Range Ambient, GND ≤ VI ≤ Vddq

CY7C1475BV25, CY7C1473BV25, CY7C1471BV25 specifications

Cypress Semiconductor, a leader in specialized memory solutions, offers a range of high-performance SRAM products, including the CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25. These devices are designed to provide high-speed data processing capabilities along with impressive power efficiency, making them ideal choices for a variety of applications in telecommunications, networking, automotive, and consumer electronics.

The CY7C1471BV25 features a 1-Mbit density, while the CY7C1473BV25 and CY7C1475BV25 support densities of 3-Mbits and 5-Mbits respectively. All three models utilize a 3.3V power supply, and deliver fast access times of 5 ns (for CY7C1471BV25) and 6 ns (for CY7C1473BV25 and CY7C1475BV25). This rapid access enables quicker data retrieval and overall enhanced system performance.

One of the standout features of these SRAM devices is their asynchronous operation, which allows for straightforward integration into existing systems without the need for complex timing protocols. They can be easily interfaced with various microcontrollers and digital signal processors, providing flexibility and ease of use. Additionally, the devices are available in multiple package options, including the widely used TSOP and BGA formats, enabling designers to choose the best fit for their specific layouts.

In terms of technology, these SRAMs leverage advanced CMOS manufacturing processes, which contribute to their low power consumption and high reliability. With sleep modes and low standby current, they are particularly suited for battery-operated devices that demand energy efficiency.

Cypress products are renowned for their reliability and robustness, ensuring that the CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 can withstand the demands of harsh environments and extended usage. The devices also incorporate features such as high-speed data ports, which facilitate bidirectional data flow, making them optimal for both read and write operations.

In summary, the CY7C1471BV25, CY7C1473BV25, and CY7C1475BV25 SRAMs by Cypress are excellent choices for those seeking high-performance, low-power memory solutions. Their advanced technology, combined with a variety of features and options, caters to the needs of many industries, paving the way for innovative designs in modern electronics.