Cypress CY7C1482V25, CY7C1486V25 Capacitance14, Thermal Resistance14, AC Test Loads and Waveforms

CY7C1480V25

CY7C1482V25

CY7C1486V25

Capacitance[14]

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Package	Package	Package
CADDRESS	Address Input Capacitance	TA = 25°C, f = 1 MHz,	6	6	6	pF
		VDD = 2.5V
CDATA	Data Input Capacitance		5	5	5	pF
		VDDQ = 2.5V
CCTRL	Control Input Capacitance		8	8	8	pF
CCLK	Clock Input Capacitance		6	6	6	pF
CI/O	Input/Output Capacitance		5	5	5	pF

Thermal Resistance[14]

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Max.	Max.	Max.
ΘJA	Thermal Resistance	Test conditions follow	24.63	16.3	15.2	°C/W
	(Junction to Ambient)	standard test methods and
		procedures for measuring
ΘJC	Thermal Resistance		2.28	2.1	1.7	°C/W
		thermal impedance, per
	(Junction to Case)	EIA/JESD51.

AC Test Loads and Waveforms

2.5V I/O Test Load

OUTPUT

2.5V

R = 1667Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL = 50Ω

10%

90%

5 pF

R = 1583Ω

GND

≤ 1 ns

VL = 1.25V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

1.8V I/O Test Load

OUTPUT

1.8V

R = 14KΩ

ALL INPUT PULSES

VDDQ-0.2

Z0

= 50Ω

OUTPUT

RL = 50Ω

10%

90%

5 pF

R = 14KΩ

0.2

≤ 1 ns

VL = 0.9V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

90%

10%

≤ 1 ns

90%

10%

≤ 1 ns

Note

14. Tested initially and after any design or process change that may affect these parameters.

Document #: 38-05282 Rev. *H Page 20 of 32

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