PRELIMINARY

CY14B102L, CY14B102N

Pinouts

 

Figure 1. Pin Diagram - 48 FBGA

48-FBGA

48-FBGA

(x8)

(x16)

Top View

Top View

(not to scale)

(not to scale)

1

2

3

4

5

6

 

NC

OE

A0

A1

A2

NC

A

NC

NC

A3

A4

CE

NC

B

DQ0

NC

A5

A6

NC

DQ4

C

VSS

DQ1

A17

A7

DQ5

VCC

D

VCC

DQ2

VCAP

A16

DQ6

VSS

E

DQ3

NC

A14

A15

NC

DQ7

F

[6]

HSB

A12

A13

WE

NC

G

NC

[4]

A8

A9

A10

A11

[5]

H

NC

NC

1

2

3

4

5

6

 

BLE

OE

A0

A1

A2

NC

A

DQ8

BHE

A

A

CE

DQ0

B

 

 

3

4

DQ9 DQ10

A5

A6

DQ1

DQ2

C

VSS

DQ11

[4]

A7

DQ3

VCC

D

NC

VCC DQ12 VCAP

A16

DQ4

VSS

E

DQ14 DQ13

A14

A15

DQ5

DQ6

F

DQ15 HSB

A12

A13

WE

DQ7

G

[5]

A8

A9

A10

A11

[6]

H

NC

NC

Figure 2. Pin Diagram - 44 Pin TSOP II

44-TSOP II

 

 

 

 

 

 

 

 

 

 

(x8)

 

 

 

 

 

 

NC

 

 

 

 

 

 

 

 

 

 

 

 

1

 

44

 

 

 

 

 

 

 

 

HSB

NC[6]

 

 

2

 

43

 

NC[5]

 

 

 

 

 

 

 

 

 

 

 

 

 

A0

 

 

3

 

42

 

NC

 

 

 

 

A1

 

 

4

 

41

 

NC[4]

 

 

 

 

 

A2

 

 

5

 

40

 

A17

 

 

 

 

 

 

 

 

 

A3

 

 

6

 

39

 

A

 

 

A4

 

 

7

 

38

 

16

 

 

 

 

 

 

 

A

 

 

 

 

 

 

 

 

 

8

 

 

 

15

 

 

 

CE

 

 

 

 

37

 

 

 

 

 

 

 

 

OE

DQ0

 

 

9

(x8)

36

 

DQ7

 

 

DQ1

 

 

 

 

10

35

 

DQ6

 

 

 

 

 

 

VCC

 

 

11

(Not to Scale)

34

 

VSS

 

 

 

 

 

VSS

 

 

12

 

33

 

VCC

 

 

 

 

DQ2

 

 

13

 

32

 

DQ5

DQ3

 

 

14

 

31

 

DQ4

 

 

 

 

 

 

 

 

 

 

15

 

 

 

 

 

 

 

WE

 

 

 

 

30

 

VCAP

 

 

 

 

 

 

 

A5

 

 

 

16

 

 

 

 

 

 

 

 

29

 

A14

 

 

 

 

 

 

 

 

 

 

 

 

A6

 

 

 

17

 

28

 

A13

 

 

 

 

 

 

 

A7

 

 

 

18

 

27

 

A12

 

 

 

 

 

 

 

 

 

 

 

 

A8

 

 

 

19

 

26

 

A11

 

 

 

 

 

 

 

 

 

 

 

A9

 

 

 

20

 

25

 

A10

 

 

 

 

 

 

 

 

 

NC

 

 

21

 

24

 

NC

 

 

 

 

NC

 

 

22

 

23

 

NC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes

4.Address expansion for 4 Mbit. NC pin not connected to die.

5.Address expansion for 8 Mbit. NC pin not connected to die.

6.Address expansion for 16 Mbit. NC pin not connected to die.

7.HSB pin is not available in 44-TSOP II (x16) package.

44-TSOP II

(x16)[7]

 

 

A0

 

 

1

 

44

 

NC[4]

 

 

 

 

 

 

 

 

 

 

 

A1

 

 

2

 

43

 

A16

 

 

 

 

 

 

 

 

 

 

 

 

 

A2

 

 

3

 

42

 

A

 

 

 

 

A3

 

 

4

 

41

 

15

 

 

 

 

 

 

 

 

 

OE

 

 

 

A4

 

 

5

 

40

 

 

 

 

 

 

 

 

 

 

BHE

 

 

 

 

 

 

6

 

39

 

 

 

 

 

 

 

CE

 

 

 

 

 

 

 

 

 

 

 

 

BLE

 

 

 

 

DQ0

 

 

7

 

38

 

DQ15

 

 

 

DQ1

 

 

8

 

37

 

DQ14

 

 

 

DQ2

 

 

9

(x16)

36

 

DQ13

 

 

DQ3

 

 

 

 

10

35

 

DQ12

 

 

 

 

 

V

 

 

11

(Not to Scale)

34

 

V

 

 

CC

 

 

 

 

 

VSS

 

 

12

 

 

 

SS

 

 

 

33

 

VCC

 

 

 

 

DQ4

 

 

13

 

32

 

DQ11

DQ5

 

 

14

 

31

 

DQ10

 

 

 

 

DQ6

 

 

 

15

 

30

 

DQ9

 

 

 

 

 

 

 

 

 

 

DQ7

 

 

 

16

 

29

 

DQ8

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

17

 

 

 

 

 

 

 

 

WE

 

 

 

 

28

 

VCAP

 

 

 

 

 

 

 

 

 

 

 

A5

 

 

 

18

 

27

 

A14

 

 

 

 

 

 

 

 

 

 

 

 

A6

 

 

 

19

 

26

 

A13

 

 

 

 

 

 

 

A7

 

 

 

 

 

 

 

 

 

 

20

 

25

 

A12

 

 

 

 

 

 

 

 

 

 

 

A8

 

 

21

 

24

 

A

 

 

 

 

 

 

A9

 

 

22

 

 

 

11

 

 

 

 

 

 

 

23

 

A10

 

 

 

 

 

 

 

 

Document #: 001-45754 Rev. *B

Page 2 of 24

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Image 2
Cypress nvSRAM, CY14B102L manual Pinouts, Top View, Not to scale

CY14B102L, nvSRAM specifications

Cypress nvSRAM CY14B102L is a sophisticated memory solution designed to bridge the gap between volatile and non-volatile memory technologies. This device offers a unique blend of SRAM speed with the non-volatility of Flash memory, making it an ideal choice for applications that require data retention without the need for continuous power.

One of the standout features of the CY14B102L is its ability to retain data for over 20 years without power, thanks to its innovative non-volatile SRAM technology. This means that critical information can be stored safely during power outages or system failures, ensuring data integrity in mission-critical applications. The device uses a reliable, self-timed write process, which simplifies the write operation and enhances system efficiency by eliminating the need for complex write management processes.

With a capacity of 1 megabit (128 K x 8), the CY14B102L offers ample storage for a wide variety of applications. Its fast access times, typically around 45 ns, make it suitable for high-speed operations typically associated with SRAMs. This rapid access is paramount for real-time applications where delays can lead to critical failures or data corruption.

The CY14B102L utilizes a CMOS process technology that not only contributes to its low power consumption but also ensures high reliability and durability. Operating in the wide temperature range of -40°C to +125°C, this nvSRAM is well-suited for automotive, industrial, and telecommunications applications.

In terms of connectivity, the CY14B102L supports a standard SRAM interface, simplifying integration into existing systems. Additionally, its ease of use is further enhanced by being available in a variety of package options, allowing designers to select the best fit for their needs without compromising on performance.

In conclusion, the Cypress nvSRAM CY14B102L is a powerful memory device that combines the speed of SRAM with non-volatile storage capabilities. With its extended data retention, fast access times, efficient write processes, and robust design, it is an excellent choice for applications that demand both speed and reliability, making it an invaluable asset for engineers looking to optimize system performance while maintaining data integrity.