3.4 Mounting 3.4.1 Ocarina
The Ocarina was designed for mounting on a printed circuit board (PCB). It is connected by
2 mm pitch 0.51 mm square pins. When designing the Ocarina into a device, be sure to leave
about 1 cm (0.4") outward from the heatsink to enable free air convection around the Ocarina.
We recommend that the Ocarina be soldered directly to the board. Alternatively, the Ocarina
can be attached to socket connectors mounted on the PCB. If the PCB is enclosed in a metal
chassis, we recommend that the Ocarina be screw-mounted to it as well to help with heat
dissipation. The Ocarina has screw-mount holes on each corner of the heatsink for this purpose.
3.4.2 Castanet
The Castanet was designed for mounting on a printed circuit board (PCB). It is connected by
2mm pitch 0.51 mm square pins. When designing the Castanet into a device, be sure to leave
about 1 cm (0.4") outward from the lower board to enable free air convection around the
Castanet. We recommend that the Castanet be soldered directly to the board. Alternatively, the
Castanet can be attached to socket connectors mounted on the PCB.
Note: Elmo recommends you leave approximately 1 cm (0.4 in) of space on the side opposite
the terminals to allow for free air convection.
Ocarina/Castanet Installation Guide Installation
MAN-OCSIG (Ver. 1.2)
3-3