Freescale Semiconductor 56F8122, 56F8322 Table 10-4 Recommended Operating Conditions

56F8322 Techncial Data, Rev. 10.0

102 Freescale Semiconductor

Preliminary

Note: The 56F8122 device is guaranteed to 40MHz and specified to meet Industrial requirements only; PWM, CAN and Quad Decoder are NOT available on the 56F8122 device.

Note: Total chip source or sink current cannot exceed 150mA.

Note: Pins in italics are NOT available in the 56F8122 device.

See Pin Groups in Table10-1

Table 10-4 Recommended Operating Conditions

(VREFLO = 0V, VSS = VSSA_ADC = 0V, VDDA = VDDA_ADC = VDDA_OSC_PLL )

Characteristic Symbol Notes Min Typ Max Unit

Supply voltage VDD_IO 33.33.6

V

ADC Supply Voltage VDDA_ADC,

VREFH

VREFH must be less than

or equal to VDDA_ADC

33.33.6

V

Oscillator / PLL Supply Voltage VDDA_OSC

_PLL

33.33.6

V

Internal Logic Core Supply Voltage VDD_CORE OCR_DIS is High 2.25 2.5 2. 75 V

Device Clock Frequency FSYSCLK 0—60/40

MHz

Input High Voltage (digital) VIN Pin Groups 1, 3 ,4, 5 2—5.5

V

Input High Voltage (XTAL/EXTAL,

XTAL is not driven by an external clock)

VIHC Pin Group 6 VDDA-0.8 — VDDA+0.3 V

Input high voltage (XTAL/EXTAL,

XTAL is driven by an external clock)

VIHC Pin Group 6 2—V

DDA+0.3 V

Input Low Voltage VIL Pin Groups 1, 3, 4, 5, 6 -0.3 — 0.8 V

Output High Source Current

VOH = 2.4V (VOH min.)

IOH Pin Groups 1, 2 ——-4

mA

Pin Group 3 ——-12

Output Low Sink Current

VOL = 0.4V (VOL max)

IOL Pin Groups 1, 2 —— 4mA

Pin Group 3 —— 12

Ambient Operating Temperature

(Automotive)

TA-40 — 125 -

(RθJA X PD)

°C

Ambient Operating Temperature

(Industrial)

TA-40 — 105 -

(RθJA X PD)

°C

Flash Endurance (Automotive)

(Program Erase Cycles)

NFTA = -40°C to 125°C 10,000 — — Cycles

Flash Endurance (Industrial)

(Program Erase Cycles)

NFTA = -40°C to 105°C 10,000 — — Cycles

Flash Data Retention TRTJ <= 70°C avg 15 — — Years

Contents

Main Document Revision History Please see http://www.freescale.com for the most current Data Sheet revision. 56F8322/56F8122 Block Diagram 56F8322 Technical Data, Rev. 10.0 Freescale Semiconductor 3 16-Bit 56800E Core 56F8322/56F8122 General Description Note: Features in italics are NOT available in the 56F8122 device. Table of Contents Part 1: Overview . . . . . . . . . . . . . . . . . . . . . . 5 Part 2: Signal/Connection Descriptions . . 14 Part 13: Ordering Information . . . . . . . . . 135 Part 3: On-Chip Clock Synthesis (OCCS) . 26 Part 1 Overview 1.1 56F8322/56F8122 Features 1.1.1 Hybrid Controller Core 1.1.2 Differences Between Devices 1.1.3 Memory Note: Features in italics are NOT available in the 56F8122 device. 1.1.4 Peripheral Circuits Note: Features in italics are NOT available in the 56F8122 device. 1.1.5 Energy Information 1.2 Device Description 1.2.1 56F8322 Features 1.2.2 56F8122 Features 1.3 Award-Winning Development Environment 1.4 Architecture Block Diagram Figure 1-1 System Bus Interfaces 56800E Figure 1-2 Peripheral Subsystem To/From IPBus Bridge Table 1-2 Bus Signal Names 1.5 Product Documentation Table 1-3 This data sheet uses the following conventions: The documents listed in . Table 1-3 Chip Documentation Part 2 Signal/Connection Descriptions 2.1 Introduction Table2-1 Functional Group Pin Allocations 56F8322 Figure 2-1 56F8322 Signals Identified by Functional Group (48-Pin LQFP) Note: VREFH is tied to VDDA and VREFLO is tied to VSSA inside this package 56F8322 Technical Data, Rev. 10.0 Freescale Semiconductor 15 56F8122 Figure 2-2 56F8122 Signals Identified by Functional Group (48-Pin LQFP) 56F8322 Techncial Data, Rev. 10.0 16 Freescale Semiconductor 2.2 Signal Pins Page Page Page Page Page Page Page Page Part 3 On-Chip Clock Synthesis (OCCS) 3.1 Introduction 3.2 External Clock Operation 3.2.1 Crystal Oscillator 3.2.2 Ceramic Resonator (Default) 3.2.3 External Clock Source 3.3 Use of On-Chip Relaxation Oscillator 3.4 Internal Clock Operation Figure 3-4 Internal Clock Operation 3.5 Registers Part 4 Memory Map 4.1 Introduction 4.2 Program Map 4.3 Interrupt Vector Table Page Table 4-3 Interrupt Vector Table Contents1 (Continued) 4.4 Data Map 4.5 Flash Memory Map Page 4.6 EOnCE Memory Map 4.7 Peripheral Memory Mapped Registers Table 4-6 EOnCE Memory Map Table 4-8 Quad Timer A Registers Address Map (TMRA_BASE = $00 F040) Table 4-8 Quad Timer A Registers Address Map (Continued) (TMRA_BASE = $00 F040) Table 4-9 Quad Timer C Registers Address Map (TMRC_BASE = $00 F0C0) Table 4-9 Quad Timer C Registers Address Map (Continued) (TMRC_BASE = $00 F0C0) Table 4-12 Interrupt Control Registers Address Map Table 4-13 Analog to Digital Converter Registers Address Map (ADCA_BASE = $00 F200) Table 4-12 Interrupt Control Registers Address Map (Continued) Page Page Table 4-20 Clock Generation Module Registers Address Map (CLKGEN_BASE = $00 F2D0) Table 4-21 GPIOA Registers Address Map (GPIOA_BASE = $00 F2E0) Table 4-22 GPIOB Registers Address Map (GPIOB_BASE = $00 F300) Table 4-23 GPIOC Registers Address Map (GPIOC_BASE = $00F310) Table 4-24 System Integration Module Registers Address Map (SIM_BASE = $00 F350) Table 4-25 Power Supervisor Registers Address Map (LVI_BASE = $00 F360) Table 4-26 Flash Module Registers Address Map (FM_BASE = $00 F400) Table 4-27 FlexCAN Registers Address Map Page Page Page Page 4.8 Factory-Programmed Memory Part 5 Interrupt Controller (ITCN) 5.1 Introduction 5.2 Features 5.3 Functional Description 5.3.1 Normal Interrupt Handling 5.3.2 Interrupt Nesting 5.3.3 Fast Interrupt Handling 5.4 Block Diagram Figure 5-1 Interrupt Controller Block Diagram 5.5 Operating Modes The ITCN module design contains two major modes of operation: 5.6 Register Descriptions Figure 5-2 ITCN Register Map Summary 56F8322 Techncial Data, Rev. 10.0 56 Freescale Semiconductor 5.6.1 Interrupt Priority Register 0 (IPR0) 5.6.1.1 ReservedBits 1514 5.6.1.2 EOnCE Breakpoint Unit 0 Interrupt Priority Level (BKPT_U0 IPL) Bits1312 5.6.1.3 EOnCE Step Counter Interrupt Priority Level (STPCNT IPL) 5.6.1.4 ReservedBits 90 5.6.3 Interrupt Priority Register 2 (IPR2) Page 5.6.3.5 Low Voltage Detector Interrupt Priority Level (LVI IPL)Bits 76 5.6.3.6 ReservedBits 52 5.6.3.7 External IRQ A Interrupt Priority Level (IRQA IPL)Bits 10 5.6.4 Interrupt Priority Register 3 (IPR3) 5.6.4.1 ReservedBits 1510 5.6.4.2 FlexCAN Message Buffer Interrupt Priority Level (FCMSGBUF IPL)Bits 98 5.6.4.3 FlexCAN Wake Up Interrupt Priority Level (FCWKUP IPL) Bits 76 5.6.4.4 FlexCAN Error Interrupt Priority Level (FCERR IPL) Bits 54 5.6.5 Interrupt Priority Register 4 (IPR4) Page 5.6.5.6 GPIO_B Interrupt Priority Level (GPIOB IPL)Bits 32 5.6.5.7 GPIO_C Interrupt Priority Level (GPIOC IPL)Bits 10 5.6.6 Interrupt Priority Register 5 (IPR5) Figure 5-8 Interrupt Priority Register 5 (IPR5) 5.6.6.1 ReservedBits 1512 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.6.2 SCI1 Receiver Full Interrupt Priority Level (SCI1_RCV IPL) Bits 1110 Page 5.6.7 Interrupt Priority Register 6 (IPR6) 5.6.7.1 Timer C, Channel 0 Interrupt Priority Level (TMRC_0 IPL) Bits 1514 5.6.7.2 ReservedBits 134 5.6.7.3 Quadrature Decoder 0, INDEX Pulse Interrupt Priority Level (DEC0_XIRQ IPL)Bits 32 5.6.8 Interrupt Priority Register 7 (IPR7) 5.6.8.1 Timer A, Channel 0 Interrupt Priority Level (TMRA0 IPL) Bits 1514 5.6.8.2 ReservedBits 136 5.6.8.3 Timer C, Channel 3 Interrupt Priority Level (TMRC3 IPL)Bits 54 5.6.8.4 Timer C, Channel 2 Interrupt Priority Level (TMRC2 IPL)Bits 32 5.6.9 Interrupt Priority Register 8 (IPR8) 5.6.9.1 SCI0 Receiver Full Interrupt Priority Level (SCI0_RCV IPL) Bits 1514 5.6.9.2 SCI0 Receiver Error Interrupt Priority Level (SCI0_RERR IPL) Bits 1312 5.6.9.3 ReservedBits 1110 Page 5.6.9.8 Timer A, Channel 1 Interrupt Priority Level (TMRA1 IPL)Bits 10 5.6.10 Interrupt Priority Register 9 (IPR9) 5.6.10.1 PWM A Fault Interrupt Priority Level (PWMAF IPL)Bits 1514 5.6.10.2 ReservedBits 1312 5.6.10.3 Reload PWM A Interrupt Priority Level (PWMA_RL IPL) Bits 1110 5.6.10.4 ReservedBits 98 5.6.11 Vector Base Address Register (VBA) 5.6.12 Fast Interrupt 0 Match Register (FIM0) 5.6.12.1 ReservedBits 157 5.6.12.2 Fast Interrupt 0 Vector Number (FAST INTERRUPT 0)Bits 60 5.6.13 Fast Interrupt 0 Vector Address Low Register (FIVAL0) 5.6.13.1 Fast Interrupt 0 Vector Address Low (FIVAL0)Bits 150 5.6.15 Fast Interrupt 1 Match Register (FIM1) 5.6.15.1 ReservedBits 157 5.6.15.2 Fast Interrupt 1 Vector Number (FAST INTERRUPT 1)Bits 60 5.6.16 Fast Interrupt 1 Vector Address Low Register (FIVAL1) 5.6.16.1 Fast Interrupt 1 Vector Address Low (FIVAL1)Bits 150 5.6.18 IRQ Pending 0 Register (IRQP0) 5.6.18.1 IRQ Pending (PENDING)Bits 162 5.6.18.2 ReservedBit 0 5.6.19 IRQ Pending 1 Register (IRQP1) 5.6.19.1 IRQ Pending (PENDING)Bits 3217 5.6.20 IRQ Pending 2 Register (IRQP2) 5.6.20.1 IRQ Pending (PENDING)Bits 4833 5.6.21 IRQ Pending 3 Register (IRQP3) 5.6.21.1 IRQ Pending (PENDING)Bits 6449 5.6.22 IRQ Pending 4 Register (IRQP4) 5.6.23 IRQ Pending 5 Register (IRQP5) Page 5.7 Resets 5.7.1 Reset Handshake Timing 5.7.2 ITCN After Reset Part 6 System Integration Module (SIM) 6.1 Introduction 6.2 Features The SIM has the following features: 6.3 Operating Modes 6.4 Operating Mode Register 6.5 Register Descriptions 56F8322 Techncial Data, Rev. 10.0 80 Freescale Semiconductor Figure 6-2 SIM Register Map Summary 6.5.1 SIM Control Register (SIM_CONTROL) This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. Figure 6-3 SIM Control Register (SIM_CONTROL) 6.5.1.1 ReservedBits 156 Base + $0 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Read 6.5.2 SIM Reset Status Register (SIM_RSTSTS) 6.5.2.1 ReservedBits 156 6.5.2.2 Software Reset (SWR)Bit 5 6.5.2.3 COP Reset (COPR)Bit 4 6.5.2.4 External Reset (EXTR)Bit 3 6.5.3 SIM Software Control Registers (SIM_SCR0, SIM_SCR1, SIM_SCR2, and SIM_SCR3) 6.5.3.1 Software Control Data 1 (FIELD)Bits 150 6.5.4 Most Significant Half of JTAG ID (SIM_MSH_ID) 6.5.5 Least Significant Half of JTAG ID (SIM_LSH_ID) 6.5.6 SIM Pull-up Disable Register (SIM_PUDR) 6.5.6.1 ReservedBits 1512 6.5.6.2 RESETBit 11 6.5.7 CLKO Select Register (SIM_CLKOSR) 6.5.7.1 ReservedBits 1510 6.5.7.2 PHASEA0 (PHSA)Bit 9 6.5.7.3 PHASEB0 (PHSB)Bit 8 6.5.7.4 INDEX0 (INDEX)Bit 7 6.5.8 SIM GPIO Peripheral Select Register (SIM_GPS) 6.5.8.1 ReservedBits 158 6.5.8.2 GPIO C6 (C6)Bit 7 6.5.8.3 GPIOC5 (C5)Bit 6 6.5.8.4 GPIOB1 (B1)Bit 5 6.5.8.5 GPIOB0 (B0)Bit 4 6.5.9 Peripheral Clock Enable Register (SIM_PCE) Page 6.5.10 I/O Short Address Location Register (SIM_ISALH and SIM_ISALL) 6.5.10.1 Input/Output Short Address Low (ISAL[23:22])Bit 10 6.5.10.2 Input/Output Short Address Low (ISAL[21:6])Bit 150 6.6 Clock Generation Overview 6.7 Power-Down Modes 6.8 Stop and Wait Mode Disable Function 6.9 Resets Part 7 Security Features 7.1 Operation with Security Enabled 7.2 Flash Access Blocking Mechanisms 7.2.1 Forced Operating Mode Selection 7.2.2 Disabling EOnCE Access 7.2.3 Flash Lockout Recovery 7.2.4 Product Analysis Part 8 General Purpose Input/Output (GPIO) 8.1 Introduction 8.2 Configuration Table 8-3 GPIO External Signals Map 8.3 Memory Maps Part 9 Joint Test Action Group (JTAG) 9.1 JTAG Information Part 10 Specifications 10.1 General Characteristics Table 10-1 Absolute Maximum Ratings Table 10-2 56F8322/56F8122 ElectroStatic Discharge (ESD) Protection Table 10-3 Thermal Characteristics Unit Notes Table 10-4 Recommended Operating Conditions 10.2 DC Electrical Characteristics Table 10-5 DC Electrical Characteristics Table 10-6 Power-On Reset Low Voltage Parameters Table 10-7 Current Consumption per Power Supply Pin (Typical) On-Chip Regulator Enabled (OCR_DIS = Low) 10.2.1 Voltage Regulator Specifications Table 10-8 Current Consumption per Power Supply Pin (Typical) On-Chip Regulator Disabled (OCR_DIS = High) Table 10-9. Regulator Parameters Table 10-10. PLL Parameters 10.2.2 Temperature Sense Note: Temperature Sensor is NOT available in the 56F8122 device. 10.3 AC Electrical Characteristics Table 10-11 Temperature Sense Parametrics Figure 10-2 Signal States 10.4 Flash Memory Characteristics Table 10-12 Flash Timing Paramete rs T 10.5 External Clock Operation Timing Figure 10-3 External Clock Timing Table 10-13 External Clock Operation Timing Requirements External Clock 10.6 Phase Locked Loop Timing 10.7 Oscillator Parameters Table 10-14 PLL Timing Table 10-15 Crystal Oscillator Parameters Table 10-16 Relaxation Oscillator Parameters Figure 10-4 Frequency versus Temperature 10.8 Reset, Stop, Wait, Mode Select, and Interrupt Timing Note: All address and data buses described here are internal. First Fetch Figure 10-6 External Interrupt Timing (Negative Edge-Sensitive) Figure 10-5 Asynchronous Reset Timing Figure 10-7 External Level-Sensitive Interrupt Timing Figure 10-8 Recovery from Stop State Using Asynchronous Interrupt Timing 10.9 Serial Peripheral Interface (SPI) Timing Table 10-18 SPI Timing Figure 10-9 SPI Master Timing (CPHA = 0) Figure 10-10 SPI Master Timing (CPHA = 1) Figure 10-11 SPI Slave Timing (CPHA = 0) Figure 10-12 SPI Slave Timing (CPHA = 1) 10.10 Quad Timer Timing Figure 10-13 Timer Timing Note: The Quadrature Decoder is NOT available in the 56F8122 device. 10.11 Quadrature Decoder Timing Table 10-19 Timer Timing 10.12 Serial Communication Interface (SCI) Timing Figure 10-15 RXD Pulse Width Figure 10-16 TXD Pulse Width Table 10-21 SCI Timing 10.13 Controller Area Network (CAN) Timing Note: CAN is NOT available in the 56F8122 device. 10.14 JTAG Timing Figure 10-17 Bus Wakeup Detection Table 10-22 CAN Timing Figure 10-18 Test Clock Input Timing Diagram Figure 10-19 Test Access Port Timing Diagram 10.15 Analog-to-Digital Converter (ADC) Parameters Table 10-24 ADC Parameters Table 10-24 ADC Parameters (Continued) Page 10.16 Equivalent Circuit for ADC Inputs 10.17 Power Consumption Page Part 11 Packaging 11.1 56F8322 Package and Pin-Out Information PIN 1 Figure 11-1 Top View, 56F8322 48-Pin LQFP Package Freescale 56F8322 Table 11-1 56F8322 48-Pin LQFP Package Identification by Pin Number 11.2 56F8122 Package and Pin-Out Information PIN 1 Figure 11-2 Top View, 56F8122 48-Pin LQFP Package ORIENTATION MARK Freescale 56F8122 Table 11-2 56F8122 48-Pin LQFP Package Identification by Pin Number Figure 11-3 48-Pin LQFP Mechanical Information 56F8322 Technical Data, Rev. 10.0 Freescale Semiconductor 131 Part 12 Design Considerations 12.1 Thermal Design Considerations 12.2 Electrical Design Considerations 12.3 Power Distribution and I/O Ring Implementation Figure 12-1 Power Management Part 13 Ordering Information How to Reach Us: