4

Holes for

Mounting screw

3

2

1

In case of using a center hole, use it in combination with the holes of both ends.

Holes for mounting screw

Use four holes (No.1 to No.4) to mount.

Figure 4.5 Limitation of side-mounting

(3)Limitation of bottom-mounting

Use all 4 mounting holes on the bottom face.

(4)Environmental temperature

Temperature condition at installed in a cabinet is indicated with ambient temperature measured 30 mm from the disk drive. At designing the system cabinet, consider following points.

•Make a suitable air flow so that the DE surface temperature does not exceed 60°C.

•Cool the PCA side especially with air circulation inside the cabinet. Confirm the cooling effect by measuring the surface temperature of specific ICs and the DE. These measurement results must satisfy the temperature condition listed in Table 4.1.

 

Table 4.1

Surface temperature check point

 

 

 

 

No.

Measurement point

Max. temperature on

package

 

 

 

 

 

 

1

Center of DE cover

60°C

 

 

 

2

Read channel LSI

80°C

 

 

 

3

VCM/SPM Driver

92°C

 

 

 

 

4

HDC

 

91°C

 

 

 

 

5

MPU

 

88°C

 

 

 

 

4-6

C141-E205

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Fujitsu MAU3036NC/NP, MAU3073NC/NP, MAU3147NC/NP manual Surface temperature check point, Hdc, Mpu
Page 55 Page 57

MAU3036NC/NP, MAU3147NC/NP, MAU3073NC/NP specifications

The Fujitsu MAU3036NC/NP, MAU3147NC/NP, and MAU3073NC/NP are advanced models designed to offer high performance and reliability in various computing environments. These models are particularly notable for their optimized efficiency and robust feature set, making them suitable for a range of applications from enterprise servers to high-performance computing.

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In summary, the Fujitsu MAU3036NC/NP, MAU3147NC/NP, and MAU3073NC/NP series exemplify the blend of performance, reliability, and efficiency. With features tailored to meet the evolving needs of modern businesses, these models stand out in the competitive landscape of computing solutions, ensuring that users can address both current and future challenges in data management and processing.
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