User’s Manual
1.6.5Winbond
The Winbond W83627F/HF is made to fully comply with Microsoft PC98 and PC99 Hardware Design Guide. Moreover, W83627F/HF is made to meet the specification of PC98/PC99’s requirement in the power management: ACPI and DPM (Device Power Management). Super I/O chip provides features as the following:
•Meet LPC Spec. 1.0
•Support LDRQ# (LPC DMA), SERIRQ (serial IRQ)
•Include all features of Winbond I/O W83977TF and W83977EF
•Integrate Hardware Monitor functions
•Compliant with Microsoft PC98/PC99 Hardware Design Guide.
•Support DPM (Device Power Management), ACPI
•Programmable configuration settings
•Single 24 or 48 MHz clock input
1.6.6Winbond W83977EF ISA Super I/O
The Winbond W83627F/HF is made to fully comply with Microsoft PC98 Hardware Design Guide. Moreover, W83627F/HF is made to meet the specification of PC98’s requirement in the power management: ACPI and DPM (Device Power Management). Super I/O chip provides features as the following:
•Plug & Play 1.0A compatible
•Supports 12 IRQs, 4 DMA channels, full
•Capable of ISA Bus IRQ Sharing
•Compliant with Microsoft PC98 Hardware Design Guide
•Supports DPM (Device Power Management), ACPI
•Reports ACPI status interrupt by SCI# signal issued from any of the 12 IRQs pins or GPIO xx
•Programmable configuration settings
•Single 24/48 Mhz clock input