Thermal and air flow performance

Maximum thermal and air flow

Single rack

Dual rack

performance parameters

 

(Specification per rack)

 

 

 

Air temperature—inlet to rack-

25ºC (68ºF)

25ºC (68ºF)

mounted components

 

 

 

 

 

Chilled water temperature

7º–15°C (45º–57°F)

7º–15°C (45º–57°F)

 

 

 

Total rack-mounted component air

2,600 cfm or less at 0 or more

1,300 cfm or less at 0 or more

flow

pressure drop across the rack-

pressure drop across the rack-

 

mounted components

mounted components

 

 

 

Chilled water flow rate

15.5 gal/min (60 l/min)

7.9 gal/min (30 l/min)

 

 

 

Chilled water pressure differential at

1.0 bar delta pressure

1.0 bar delta pressure

flow needed to meet thermal

 

 

specifications

 

 

 

 

 

Heat lost to room

Approximately 10% maximum

Approximately 10% maximum

 

depending on the MCS settings

depending on the MCS settings

 

and room temperature

and room temperature

 

 

 

Server heat load

35 kW maximum

17.5 kW maximum

 

 

 

Environmental specifications

Features

Specifications

 

 

Operating temperature

5ºC to 35ºC (41ºF to 95ºF)

 

 

Non-operating temperature

0ºC to 60ºC (32ºF to 140ºF)

 

 

Transit temperature

-30ºC to 60ºC (-22ºF to 140ºF), up to 72 hours

 

 

Storage temperature

-20ºC to 60ºC (-4ºF to 140ºF)

 

 

Operating humidity

20 to 80% relative humidity (non-condensing)

 

 

Non-operating humidity

5 to 95% relative humidity (non-condensing)

 

 

Operating altitude

-76.2 to 3,048 m (-250 to 10,000 ft)

 

 

Non-operating altitude

-76.2 to 9,144 m (-250 to 30,000 ft)

 

 

HP 10642 G2 Rack specifications

U height

Width

Depth

Dynamic load (gross)

Static load

 

 

 

 

 

42U

600 mm

1,000 mm

907.2 kg (2,000 lb)

1,360.8 kg (3,000

 

(23.8 in)

(39.4 in)

 

lb)

 

 

 

 

 

Specifications 80

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HP Modular Cooling System HP 10642 G2 Rack specifications, Thermal and air flow performance, Environmental specifications

Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

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The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.