EonStor
and will consequently lead to the system overheating, which can cause irreparable damage.
•If a module fails, leave it in place until you have a replacement unit and you are ready to replace it.
•Airflow Consideration: The subsystem requires an airflow clearance, especially at the front and rear. The airflow direction is from front to back.
•Handle subsystem modules using the retention screws, eject levers, and the metal frames/face plates. Avoid touching PCB boards and connector pins.
•To comply with safety, emission, or thermal requirements, none of the covers or replaceable modules should be removed. Make sure that all enclosure modules and covers are securely in place during operation.
•Be sure that the rack cabinet into which the subsystem chassis will be installed provides sufficient ventilation channels and airflow circulation around the subsystem.
•Provide a soft, clean surface to place your subsystem on before working on it. Servicing on a rough surface may damage the exterior of the chassis.
•If it is necessary to transport the subsystem, repackage all drives separately.
•
Observe all conventional
This manual:
Introduces the EonStor A16E Subsystem series.
Describes all the active components in the system.
Provides recommendations and details about the hardware installation process of the subsystem.
ix