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Intel Core 2 Duo, Q35 Express user manual Board Setup and Configuration before Boot

Models: Q35 Express Core 2 Duo

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Figure 22. Tightening Heatsink on the SRM and Board

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Setting Up and Configuring the Development Kit

Figure 22. Tightening Heatsink on the SRM and Board

3.4Board Setup and Configuration before Boot

Follow the steps below to operate the board.

Warning: Before starting, ensure the power supply is not connected to the board.

Ensure a safe and static-free work environment before removing any components from their anti-static packaging. The Development Platform is susceptible to electrostatic discharge, which may cause failure or unpredictable operation.

The Development Platform must be operated on a flame retardant surface because a chassis is not included with the platform.

Caution: Connecting the wrong cable or reversing a cable may damage the board and may damage the device being connected. Since the board is not in a protective chassis, use caution when connecting cables to the board.

Caution: The power supply cord is the main disconnect device to main power (AC power). The socket outlet should be installed near the equipment and should be readily accessible. To avoid shock, ensure that the power cord is connected to a properly wired and grounded receptacle. Do not connect/disconnect any cables or perform installation/ maintenance of the boards in this product during an electrical storm. Ensure that any equipment to which this product will be attached is also connected to properly wired and grounded receptacles.

Note: Ensure that setting up the ATX power supply is the final step performed in the process of assembly.

1.Physically inspect the motherboard for obvious defects. Note that each reference board has been tested prior to distribution, but a visual check should be performed to ensure no damage has occurred during shipping.

Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit
User’s Manual	October 2007
30	Order Number: 318476001US

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Intel Core 2 Duo, Q35 Express Board Setup and Configuration before Boot, Tightening Heatsink on the SRM and Board

Contents

Development Kit User’s ManualIntel CoreTM 2 Duo Processor and Intel Q35 Express Chipset OctoberUser’s Manual OctoberContents FiguresTables Intel Core 2 Duo Processor and Intel Q35 Express Chipset-ContentsRevision Revision HistoryDate DescriptionChapter 3.0, “Setting Up and Configuring the Development Kit” 1.1 Content OverviewChapter 2.0, “Development Kit Hardware Features” 1.0 About This Manual1.3 Glossary of Terms and Acronyms DefinitionSheet 1 of 1.4.1 Electronic Support Systems 1.4 Support Options1.5 Product Literature 1.4.2 Additional Technical SupportIntel Literature Centers 2.0 Development Kit Hardware Features 2.1 Intel Q35 Express Chipset Development Kit Overview2.2 System Block Diagram Board Features2.3 Development Kit Inventory Checklists Figure 2. Intel Q35 Express Chipset Development Kit block diagramTable 3. Development Kit Hardware Items Supported Intel Technologies Sheet 1 of Table 4. Development Kit Board SpecificationInternal I/O headers Features/support2.5 System Memory Table 7. Additional Features2.4 Processor Support Supported Intel Technologies Sheet 2 of2.5.1 Dual Channel Interleaved Mode Configurations Figure 3. Memory Channel and DIMM ConfigurationFigure 4. Dual Channel Interleaved Mode Configuration with 2x DIMMs Figure 5. Dual Channel Interleaved Mode Configuration with 3x DIMMs2.5.2 Single Channel Asymmetric Mode Configurations Figure 6. Dual Channel Interleaved Mode Configuration with 4x DIMMsFigure 7. Single Channel Asymmetric Mode Configuration with 1x DIMM Figure 8. Single Channel Asymmetric Mode Configuration with 3x DIMMs 2.6 Back-Panel Connectors2.6.1 Audio-Connectors Figure 9. Back-panel ConnectorsFigure 10. LAN Connector LED locations 2.6.2 RJ-45 LAN Connector with Integrated LEDs2.6.4 Coaxial S/PDIF In/Out Connector LAN Connector LED statusFigure 11. ITP-XDP Connector location J2BC 2.7 Debug Features2.7.2 Power LEDs 2.7.1 Extended Debug Probe XDPVoltage Reference detail 2.8 Development Kit Major Connectors and Jumpers2.7.4 Voltage Reference Figure 12. Major Jumper and Header Locations2.8.3 1394a Header 2.8.1 Jumper Functions2.8.2 USB 2.0 Front Panel Table 11. USB Front PanelTable 12. 1394a Header 2.9 SPI Removal / Installation TechniqueFigure 13. Location for 1394a Header and USB Front Panel Pin Number2.9.2 SPI Device Installation 2.9.1 SPI Device RemovalFigure 14. SPI Socket with Retaining Clip 1. Place the fresh IC into the Figure 15. SPI Device Installation2. Close the cover socket. Match pin 1. on the IC3.1 Overview 3.0 Setting Up and Configuring the Development Kit3.2 Installing Board Standoffs Figure 16. Intel Q35 Development KitsFigure 17. Mounting Hole Locations Figure 18. Mounting the Standoff for BTX Heatsink 3.3 BTX Heatsink Setup with SRM3.3.1 SRM Alignment on any BTX Board Figure 19. Casing with “Support and Retention Module”Figure 20. BTX board alignment on SRM Figure 21. Heatsink Alignment3.4 Board Setup and Configuration before Boot Figure 22. Tightening Heatsink on the SRM and BoardFigure 23. CPU Fan location 3.5.1 Normal Post Codes Figure 24. 2x12 Standard power supply and 2x2 power supply3.5 Post Codes Definitions Uncompressed INIT code checkpointsOEM memory detection/configuration error. Range reserved for Boot Block Recovery Code CheckpointsRuntime POST Code Checkpoints Set up floppy controller and data. Attempt to read from floppyof KB and MS Prepare runtime image for different BIOS modules. Initialize MS User’s Manual OctoberOrder Number 318476001US