Intel Q35 Express Development Kit Board Specification, Internal I/O headers, Technology

Development Kit Hardware Features—Intel Core 2 Duo Processor and Intel Q35 Express Chipset

Table 4. Development Kit Board Specification

1 PCI Express x16, 2 PCIe x1, 1 PCI expansion slots

1394a

•1 front panel headers for support of 1 port

•1 back panel port

Universal Serial Bus 2.0

•2 front panel headers for support of 4 ports

•1 internal header for support of 2 ports

•6 back panel ports

6 SATA 3 Gb/sec ports (1 port used for eSATA)

Table 5.	Internal I/O headers
	2x5	Front Panel I/O header
	2x7	Front Panel audio header
	1x2	Chassis intrusion header
	3 four-wire fan headers
	2x8	High Definition audio header

Table 6.	Supported Intel Technologies (Sheet 1 of 2)
Technology		Features/support	Reference Documentation
		• Enables remote, down-the-wire management
		of out-of-band networked systems regardless
		of system state, helping improve efficiency,
Intel® Active Management		asset management and system security and
Technology with System		availability.	http://www.intel.com/technology/
Defense feature (Intel®		• System Defense Feature can help block	platform-technology/intel-amt/
ICH8 DO only)		incoming software attacks, isolate a device
		from the network if infected, and proactively
		alert embedded system vendors if critical
		software agents are missing.
		• Dual independent display expands viewable
		workspace for devices such as point-of-sale
		terminals with two monitors.
Intel® Graphics Media		• Provides next-generation graphics	http://www.intel.com/products/chipsets/
		performance for advanced embedded
Accelerator 3000			gma3000/demo/demo.html
		operating systems.
		• Delivers richer visual color and picture clarity
		without the need for additional discrete
		graphics cards.

	Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit
October 2007	User’s Manual
Order Number: 318476001US	13