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Intel Core 2 Duo, Q35 Express user manual Setting Up and Configuring the Development Kit, Overview

Models: Q35 Express Core 2 Duo

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3.0Setting Up and Configuring the Development Kit

Intel Core 2 Duo Processor and Intel Q35 Express Chipset—Setting Up and Configuring the Development Kit

3.0Setting Up and Configuring the Development Kit

This chapter discusses basic board set up and operation. Please refer to Chapter 2.0 for the board layout, jumper setting location and the component reference designator.

3.1Overview

The board consists of a baseboard populated with one Intel® Core™ 2 Duo processor E6400, the Intel® Q35 Express chipset, and other system board components and peripheral connectors.

Note: This board is shipped as an open system allowing for maximum flexibility in changing hardware configuration and peripherals. Since the board is not in a protective chassis, take extra precaution when handling and operating the system.

Figure 16. Intel® Q35 Development Kits

3.2Installing Board Standoffs

Caution: The evaluation board in this development kit is shipped as an open system allowing for maximum flexibility in changing hardware configuration and peripherals in the lab

Intel® CoreTM 2 Duo Processor and Intel ® Q35 Express Chipset Development Kit
User’s Manual	October 2007
26	Order Number: 318476001US

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Intel Core 2 Duo, Q35 Express Setting Up and Configuring the Development Kit, Overview, Installing Board Standoffs

Contents

Development Kit User’s ManualIntel CoreTM 2 Duo Processor and Intel Q35 Express Chipset OctoberUser’s Manual OctoberContents FiguresTables Intel Core 2 Duo Processor and Intel Q35 Express Chipset-ContentsRevision Revision HistoryDate DescriptionChapter 3.0, “Setting Up and Configuring the Development Kit” 1.1 Content OverviewChapter 2.0, “Development Kit Hardware Features” 1.0 About This ManualSheet 1 of 1.3 Glossary of Terms and AcronymsDefinition 1.4.1 Electronic Support Systems 1.4 Support Options1.5 Product Literature 1.4.2 Additional Technical SupportIntel Literature Centers 2.0 Development Kit Hardware Features 2.1 Intel Q35 Express Chipset Development Kit Overview2.2 System Block Diagram Board FeaturesTable 3. Development Kit Hardware Items 2.3 Development Kit Inventory ChecklistsFigure 2. Intel Q35 Express Chipset Development Kit block diagram Supported Intel Technologies Sheet 1 of Table 4. Development Kit Board SpecificationInternal I/O headers Features/support2.5 System Memory Table 7. Additional Features2.4 Processor Support Supported Intel Technologies Sheet 2 of2.5.1 Dual Channel Interleaved Mode Configurations Figure 3. Memory Channel and DIMM ConfigurationFigure 4. Dual Channel Interleaved Mode Configuration with 2x DIMMs Figure 5. Dual Channel Interleaved Mode Configuration with 3x DIMMsFigure 7. Single Channel Asymmetric Mode Configuration with 1x DIMM 2.5.2 Single Channel Asymmetric Mode ConfigurationsFigure 6. Dual Channel Interleaved Mode Configuration with 4x DIMMs Figure 8. Single Channel Asymmetric Mode Configuration with 3x DIMMs 2.6 Back-Panel Connectors2.6.1 Audio-Connectors Figure 9. Back-panel ConnectorsFigure 10. LAN Connector LED locations 2.6.2 RJ-45 LAN Connector with Integrated LEDs2.6.4 Coaxial S/PDIF In/Out Connector LAN Connector LED statusFigure 11. ITP-XDP Connector location J2BC 2.7 Debug Features2.7.2 Power LEDs 2.7.1 Extended Debug Probe XDPVoltage Reference detail 2.8 Development Kit Major Connectors and Jumpers2.7.4 Voltage Reference Figure 12. Major Jumper and Header Locations2.8.3 1394a Header 2.8.1 Jumper Functions2.8.2 USB 2.0 Front Panel Table 11. USB Front PanelTable 12. 1394a Header 2.9 SPI Removal / Installation TechniqueFigure 13. Location for 1394a Header and USB Front Panel Pin NumberFigure 14. SPI Socket with Retaining Clip 2.9.2 SPI Device Installation2.9.1 SPI Device Removal 1. Place the fresh IC into the Figure 15. SPI Device Installation2. Close the cover socket. Match pin 1. on the IC3.1 Overview 3.0 Setting Up and Configuring the Development Kit3.2 Installing Board Standoffs Figure 16. Intel Q35 Development KitsFigure 17. Mounting Hole Locations Figure 18. Mounting the Standoff for BTX Heatsink 3.3 BTX Heatsink Setup with SRM3.3.1 SRM Alignment on any BTX Board Figure 19. Casing with “Support and Retention Module”Figure 20. BTX board alignment on SRM Figure 21. Heatsink Alignment3.4 Board Setup and Configuration before Boot Figure 22. Tightening Heatsink on the SRM and BoardFigure 23. CPU Fan location 3.5.1 Normal Post Codes Figure 24. 2x12 Standard power supply and 2x2 power supply3.5 Post Codes Definitions Uncompressed INIT code checkpointsOEM memory detection/configuration error. Range reserved for Boot Block Recovery Code CheckpointsRuntime POST Code Checkpoints Set up floppy controller and data. Attempt to read from floppyof KB and MS Prepare runtime image for different BIOS modules. Initialize MS Order Number 318476001US User’s ManualOctober