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Q35 Express user manual User’s Manual, Development Kit, October, Order Number 318476-001US
Models:
Q35 Express
Core 2 Duo
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Specs
Install
System Block Diagram
Memory Channel and DIMM Configuration
BTX Heatsink Setup with SRM
Checklist
Boot Block Recovery Code Checkpoints
Power LEDs
Prepare runtime image for different BIOS modules. Initialize MS
Back-Panel Connectors
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Intel
®
Core
TM
2 Duo Processor and
Intel
®
Q35 Express Chipset
Development Kit
User’s Manual
October 2007
Order Number:
318476-001US
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Page 1
Image 1
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Contents
Intel CoreTM 2 Duo Processor and Intel Q35 Express Chipset
User’s Manual
Development Kit
October
October
User’s Manual
Figures
Contents
Intel Core 2 Duo Processor and Intel Q35 Express Chipset-Contents
Tables
Date
Revision History
Revision
Description
Chapter 2.0, “Development Kit Hardware Features”
1.1 Content Overview
Chapter 3.0, “Setting Up and Configuring the Development Kit”
1.0 About This Manual
Definition
1.3 Glossary of Terms and Acronyms
Sheet 1 of
1.5 Product Literature
1.4 Support Options
1.4.1 Electronic Support Systems
1.4.2 Additional Technical Support
Intel Literature Centers
2.1 Intel Q35 Express Chipset Development Kit Overview
2.0 Development Kit Hardware Features
Board Features
2.2 System Block Diagram
Figure 2. Intel Q35 Express Chipset Development Kit block diagram
2.3 Development Kit Inventory Checklists
Table 3. Development Kit Hardware Items
Internal I/O headers
Table 4. Development Kit Board Specification
Supported Intel Technologies Sheet 1 of
Features/support
2.4 Processor Support
Table 7. Additional Features
2.5 System Memory
Supported Intel Technologies Sheet 2 of
Figure 3. Memory Channel and DIMM Configuration
2.5.1 Dual Channel Interleaved Mode Configurations
Figure 5. Dual Channel Interleaved Mode Configuration with 3x DIMMs
Figure 4. Dual Channel Interleaved Mode Configuration with 2x DIMMs
Figure 6. Dual Channel Interleaved Mode Configuration with 4x DIMMs
2.5.2 Single Channel Asymmetric Mode Configurations
Figure 7. Single Channel Asymmetric Mode Configuration with 1x DIMM
2.6.1 Audio-Connectors
2.6 Back-Panel Connectors
Figure 8. Single Channel Asymmetric Mode Configuration with 3x DIMMs
Figure 9. Back-panel Connectors
2.6.4 Coaxial S/PDIF In/Out Connector
2.6.2 RJ-45 LAN Connector with Integrated LEDs
Figure 10. LAN Connector LED locations
LAN Connector LED status
2.7.2 Power LEDs
2.7 Debug Features
Figure 11. ITP-XDP Connector location J2BC
2.7.1 Extended Debug Probe XDP
2.7.4 Voltage Reference
2.8 Development Kit Major Connectors and Jumpers
Voltage Reference detail
Figure 12. Major Jumper and Header Locations
2.8.2 USB 2.0 Front Panel
2.8.1 Jumper Functions
2.8.3 1394a Header
Table 11. USB Front Panel
Figure 13. Location for 1394a Header and USB Front Panel
2.9 SPI Removal / Installation Technique
Table 12. 1394a Header
Pin Number
2.9.1 SPI Device Removal
2.9.2 SPI Device Installation
Figure 14. SPI Socket with Retaining Clip
2. Close the cover
Figure 15. SPI Device Installation
1. Place the fresh IC into the
socket. Match pin 1. on the IC
3.2 Installing Board Standoffs
3.0 Setting Up and Configuring the Development Kit
3.1 Overview
Figure 16. Intel Q35 Development Kits
Figure 17. Mounting Hole Locations
3.3.1 SRM Alignment on any BTX Board
3.3 BTX Heatsink Setup with SRM
Figure 18. Mounting the Standoff for BTX Heatsink
Figure 19. Casing with “Support and Retention Module”
Figure 21. Heatsink Alignment
Figure 20. BTX board alignment on SRM
Figure 22. Tightening Heatsink on the SRM and Board
3.4 Board Setup and Configuration before Boot
Figure 23. CPU Fan location
3.5 Post Codes Definitions
Figure 24. 2x12 Standard power supply and 2x2 power supply
3.5.1 Normal Post Codes
Uncompressed INIT code checkpoints
Runtime POST Code Checkpoints
Boot Block Recovery Code Checkpoints
OEM memory detection/configuration error. Range reserved for
Set up floppy controller and data. Attempt to read from floppy
of KB and MS
Prepare runtime image for different BIOS modules. Initialize MS
October
User’s Manual
Order Number 318476001US
