Intel manual Glossary SE7221BK1-E Technical Product Specification, Term Definition

Glossary SE7221BK1-E Technical Product Specification

Glossary

This appendix contains important terms used in the preceding chapters. For ease of use, numeric entries are listed first (e.g., “82460GX”) with alpha entries following (e.g., “AGP 4x”). Acronyms are then entered in their respective place, with non-acronyms following.

		Term	Definition
ACPI			Advanced Configuration and Power Interface
ANSI			American National Standards Institute
AP			Application Processor
ASIC			Application Specific Integrated Circuit
ASR			Asynchronous Reset
BGA			Ball-grid Array
BIOS			Basic input/output system
Byte			8-bit quantity.
CMOS			In terms of this specification, this describes the PC-AT compatible region of battery-backed 128
			bytes of memory, which normally resides on the server board.
DCD			Data Carrier Detect
DMA			Direct Memory Access
DMTF			Distributed Management Task Force
ECC			Error Correcting Code
EMC			Electromagnetic Compatibility
EPS			External Product Specification
ESCD			Extended System Configuration Data
FDC			Floppy Disk Controller
FIFO			First-In, First-Out
FRU			Field replaceable unit
GB			1024 MB.
GPIO			General purpose I/O
GUID			Globally Unique ID
Hz			Hertz (1 cycle/second)
HDG			Hardware Design Guide
I	2	C	Inter-integrated circuit bus
IA			Intel® architecture
ICMB			Intelligent Chassis Management Bus
IERR			Internal error
IMB			Inter Module Bus
IP			Internet Protocol
IRQ			Interrupt Request
ITP			In-target probe
KB			1024 bytes
KCS			Keyboard Controller Style
LAN			Local area network
LBA			Logical Block Address
LCD			Liquid crystal display

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