U p g r a d i n g

Instead, separate the heat sink from the processor by twisting the heat sink back and forth to loosen the grip of the thermal bonding compound, then slide the heat sink off to one side of the processor.

Warning

There will be a residual deposit of thermal bonding compound on the bottom of the heat sink and the top of the processor. This compound can cause skin irritation and stain clothing. Avoid prolonged or repeated contact with skin. Wash your hands thoroughly with soap and water after handling. Avoid contact with eyes and inhalation of fumes. Do not ingest.

Fitting the new processor

To fit the upgrade processor:

1.Ensure that the securing lever on the ZIF socket is still in the upright position.

2.Take the upgrade processor out of its anti-static packaging. Hold the processor by its edges and avoid touching the metal pins.

The upgrade processor and the ZIF socket are keyed to ensure that the processor is installed in the correct orientation. One corner of the socket has a key hole. The corresponding corner of the processor is slightly bevelled and has a positioning guide in the form of a coloured dot.

3.Place the processor in the socket, making sure that it is correctly aligned and that you do not bend or otherwise damage the pins.

If the processor is not big enough to occupy the entire socket it should be positioned centrally.

Caution

If the processor is misaligned it will not go into the socket, and any attempt to force it will damage the processor, or the socket, or both.

4.Move the securing lever to the locked position. Apply just enough pressure to overcome the resistance offered by the lever.

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