Appendix B Specifications
Technology
Standards IEEE802.3, 802.3u, 802.3x, 802.1D, 802.1w, 802.1Q, 802.1p
Protocols IGMP V1/V2/V3 device, GVRP, SNMP V1/V2c/V3, DHCP
Server/Client, BOOTP, TFTP, SNTP, SMTP, RARP and
EDS-SNMP OPC server Pro (Optional)
MIB MIB-II, Ethernet-Like MIB, P-BRIDGE MIB, Q-BRIDGE
MIB, Bridge MIB, RSTP MIB, RMON MIB Group 1,2.3,9
Interface
RJ45 Ports 10/100/1000BaseT(X) auto negotiation speed, F/H duplex
mode, and auto MDI/MDI-X connection
Fiber Ports Optional 1000BaseSX/LX/LHX/ZX (LC connector)
Console RS-232 (RJ45)
LED Indicators PWR1, PWR2, FAULT, 10/100M (TP port), 1000M, Ring
Master, and Ring Coupler
Alarm Contact Two relay outputs with current carrying capacity of 1A @ 24
VDC
Digital Input Two inputs with the same ground, but electrically isolated from
the electronics
• For state “1”: +13 to +30V
• For state “0”: -30 to +3V
• Max. input current: 8 mA
1000BaseSX/LX/LHX/ZX
Distance:
Multi mode:
‧1000BaseSX 0 to 500m, 850 nm (50/125 µm, 400 MHz*km)
0 to 275m, 850 nm (62.5/125 µm, 200 MHz*km)
‧1000BaseLX 0 to 1100m, 1310 nm (50/125 µm, 800 MHz*km)
0 to 550m, 1310 nm (62.5.125 µm, 500 MHz*km)
Single mode:
‧1000BaseLX 0 to 10 km, 1310 nm (9/125 µm, 3.5 PS/(nm*km))
‧1000BaseLHX 0 to 40 km, 1310 nm ((9/125 µm, 3.5 PS/(nm*km)))
‧1000BaseZX 0 to 80 km, 1550 nm ((9/125 µm, 19 PS/(nm*km))