PCA9665_2 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 7 December 2006 82 of 91
NXP Semiconductors PCA9665
Fm+ parallel bus to I2C-bus controller

Fig 48. Package outline SOT662-1 (HVQFN20)

0.651
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 5.1
4.9
Dh
3.25
2.95
y1
5.1
4.9 3.25
2.95
e1
2.6
e2
2.6
0.38
0.23
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT662-1 MO-220- - - - - -
0.75
0.50
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT662-1HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;20 terminals; body 5 x 5 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
610
20 16
15
11
5
1
X
D
E
C
BA
e2
terminal 1
index area
terminal 1
index area
01-08-08
02-10-22
AC
C
B
vM
wM
E(1)
D(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.