PCA9665_2 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 7 December 2006 83 of 91
NXP Semiconductors PCA9665
Fm+ parallel bus to I2C-bus controller
16. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However,to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
17. Soldering

17.1 Introduction

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs,but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.

17.2 Through-hole mount packages

17.2.1 Soldering by dipping or by solder wave

Typicaldwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.

17.2.2 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seatingplane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5seconds.

17.3 Surface mount packages

17.3.1 Reflow soldering

Key characteristics in reflow soldering are:
•Lead-freeversus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 49) than a PbSn process, thus
reducing the process window
•Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
•Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperatureis high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the