Sun Microsystems 10GBE XFP manual Configuring Link Aggregation in a Linux Environment

5. Use the dladm show-aggr-Lcommand to display LACP specific information:

# dladm show-aggr -L
key: 33 (0x0021)		policy:		L4	address: 0:3:ba:d8:9d:e8 (auto)
	LACP mode: off			LACP timer: short
device	activity timeout aggregatable sync					coll dist defaulted expired
nxge0	passive	short	yes		no	no	no	no	no
nxge1	passive	short	yes		no	no	no	no	no

For more information refer to the man pages for dladm, man dladm.

Configuring Link Aggregation in a

Linux Environment

This section explains how to configure link aggregation in a Linux environment.

▼To Configure Bonding for Multiple nxge Interfaces

1.Modify the /etc/modprobe.conf file for 2.6 kernels file by adding these lines:

alias bond0 bonding

options bonding max_bonds=2 mode=4 miimon=1000

where:

■bond0 is the bonding device.

■max_bonds is the number of bond interfaces to be created.

■mode specifies the bonding policies.

■miimon is the frequency in milliseconds that MII link monitoring will occur.

Refer to Linux documentation for more information.

2.Load the bonding driver:

#modprobe bonding

64 Sun Dual 10GbE XFP PCI Express Card User’s Guide • January 2009