Intel BX80646I74770S Processor Ball and Signal Information, Processor Ball List by Signal Name

Page 110
9.0Processor Ball and Signal Information
December 2013 Order No.: 328897-004

Processor—Processor Ball and Signal Information

9.0Processor Ball and Signal Information

This chapter provides processor ball information. The following table provides the ball list by signal name.

Note: References to SA_ECC_CB[7:0] and SB_ECC_CB[7:0] are for processor SKUs that support ECC. These signals are reserved on the Desktop 4th Generation Intel® Coreprocessor family.

Table 61.

Processor Ball List by Signal Name

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Signal Name

Ball #

 

Signal Name

Ball #

 

Signal Name

Ball #

 

 

 

 

 

 

 

 

 

 

BCLKN

V4

 

CFG3

W38

 

DDID_TXDN1

B16

 

 

 

 

 

 

 

 

 

 

BCLKP

V5

 

CFG4

V39

 

DDID_TXDN2

C17

 

 

 

 

 

 

 

 

 

 

BPM#0

G39

 

CFG5

U39

 

DDID_TXDN3

B18

 

 

 

 

 

 

 

 

 

 

BPM#1

J39

 

CFG6

U40

 

DDID_TXDP0

B15

 

 

 

 

 

 

 

 

 

 

BPM#2

G38

 

CFG7

V38

 

DDID_TXDP1

A16

 

 

 

 

 

 

 

 

 

 

BPM#3

H37

 

CFG8

T40

 

DDID_TXDP2

B17

 

 

 

 

 

 

 

 

 

 

BPM#4

H38

 

CFG9

Y35

 

DDID_TXDP3

A18

 

 

 

 

 

 

 

 

 

 

BPM#5

J38

 

DBR#

G40

 

DISP_INT

D18

 

 

 

 

 

 

 

 

 

 

BPM#6

K39

 

DDIB_TXBN0

F17

 

DMI_RXN0

T3

 

 

 

 

 

 

 

 

 

 

BPM#7

K37

 

DDIB_TXBN1

G18

 

DMI_RXN1

V1

 

 

 

 

 

 

 

 

 

 

CATERR#

M36

 

DDIB_TXBN2

H19

 

DMI_RXN2

V2

 

 

 

 

 

 

 

 

 

 

CFG_RCOMP

H40

 

DDIB_TXBN3

G20

 

DMI_RXN3

W3

 

 

 

 

 

 

 

 

 

 

CFG0

AA37

 

DDIB_TXBP0

E17

 

DMI_RXP0

U3

 

 

 

 

 

 

 

 

 

 

CFG1

Y38

 

DDIB_TXBP1

F18

 

DMI_RXP1

U1

 

 

 

 

 

 

 

 

 

 

CFG10

AA34

 

DDIB_TXBP2

G19

 

DMI_RXP2

W2

 

 

 

 

 

 

 

 

 

 

CFG11

V37

 

DDIB_TXBP3

F20

 

DMI_RXP3

Y3

 

 

 

 

 

 

 

 

 

 

CFG12

Y34

 

DDIC_TXCN0

E19

 

DMI_TXN0

AA5

 

 

 

 

 

 

 

 

 

 

CFG13

U38

 

DDIC_TXCN1

D20

 

DMI_TXN1

AB4

 

 

 

 

 

 

 

 

 

 

CFG14

W34

 

DDIC_TXCN2

E21

 

DMI_TXN2

AC4

 

 

 

 

 

 

 

 

 

 

CFG15

V35

 

DDIC_TXCN3

D22

 

DMI_TXN3

AC2

 

 

 

 

 

 

 

 

 

 

CFG16

Y37

 

DDIC_TXCP0

D19

 

DMI_TXP0

AA4

 

 

 

 

 

 

 

 

 

 

CFG17

Y36

 

DDIC_TXCP1

C20

 

DMI_TXP1

AB3

 

 

 

 

 

 

 

 

 

 

CFG18

W36

 

DDIC_TXCP2

D21

 

DMI_TXP2

AC5

 

 

 

 

 

 

 

 

 

 

CFG19

V36

 

DDIC_TXCP3

C22

 

DMI_TXP3

AC1

 

 

 

 

 

 

 

 

 

 

CFG2

AA36

 

DDID_TXDN0

C15

 

DP_RCOMP

R4

 

 

 

 

 

 

 

 

 

 

 

continued...

 

 

continued...

 

 

continued...

Desktop 4th Generation Intel® CoreProcessor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

Datasheet – Volume 1 of 2 110

Image 110
Contents Datasheet - Volume 1 of DecemberDatasheet - Volume 1 of 2 Revision History Contents4.0 Power Management 1.0 Introduction5.0 Thermal Management 6.0 Signal DescriptionProcessor-Contents 9.0 Processor Ball and Signal Information 7.0 Electrical Specifications8.0 Package Mechanical Specifications 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsFigures Tables Tables-ProcessorProcessor-Tables Revision History Revision History-Processor1.0 Introduction Processor-IntroductionProcessor Figure 1. Platform Block Diagram1.1 Supported Technologies Platform Controller Hub PCHProcessor Core 1.3 Power Management Support1.2 Interfaces System1.6 Terminology 1.4 Thermal Management Support1.5 Package Support Terminologywith Virtual Machine Monitor software, enables multiple, robust independent software Description Document 1.7 Related DocumentsRelated Documents Number / Locationproducts/processor specificationshttp manuals/index.htm2.0 Interfaces 2.1 System Memory InterfaceProcessor DIMM Support by Product Supported UDIMM Module Configurations2.1.1 System Memory Technology Supported DDR3 / DDR3L System Memory Timing Support Supported SO-DIMM Module Configurations AIO Only2.1.2 System Memory Timing Support Dual-Channel Mode - Intel Flex Memory Technology Mode 2.1.3 System Memory Organization ModesSingle-Channel Mode Figure 2. Intel Flex Memory Technology OperationsCommand Overlap 2.1.3.2 Intel Fast Memory Access Intel FMA Technology EnhancementsJust-in-Time Command Scheduling 2.1.3.1 System Memory Frequency2.2.1 PCI Express* Support Table 7. PCI Express* Supported Configurations in Desktop Products2.2 PCI Express* Interface 2.1.3.3 Data Scrambling2.2.3 PCI Express* Configuration Mechanism 2.2.2 PCI Express* ArchitecturePCI Express* Lanes Connection PCI Express* Related Register Structures in the ProcessorPCI Express* Port 1 X 4 Controller 2.3 Direct Media Interface DMIFigure 4. PCI Express* Typical Operation 16 Lanes Mapping 1 X 8 ControllerDMI Error Flow DMI Link Down2.4 Processor Graphics 2.5 Processor Graphics Controller GT3D Pipeline Figure 5. Processor Graphics Controller Unit Block Diagram2.5.1 3D and Video Engines for Graphics Processing 3D Engine Execution UnitsClip Stage Vertex Shader VS StageGeometry Shader GS Stage Strips and Fans SF StageLogical 128-Bit Fixed BLT and 256 Fill Engine 2.6 Digital Display Interface DDI2.5.2 Multi Graphics Controllers Multi-Monitor Support Figure 6. Processor Display Architecture DisplayPort Source DeviceSink Device Figure 7. DisplayPort* OverviewFigure 8. HDMI* Overview HDMI SourceHDMI Sink HDMI TxIntegrated Audio Multiple Display Configurationsembedded DisplayPort Table 8. Processor Supported Audio Formats over HDMI*and DisplayPortValid Three Display Configurations through the Processor High-bandwidth Digital Content Protection HDCP2.8.1 PECI Bus Architecture 2.7 Intel Flexible Display Interface Intel FDI2.8 Platform Environmental Control Interface PECI Host / Originator Figure 9. PECI Host-Clients Connection ExamplePECI PECI ClientIntel VT-x Objectives 3.0 Technologies3.1 Intel Virtualization Technology Intel VT ing=VTIntel VT-x Features Intel VT-d Objectives Intel VT-d Features Figure 10. Device to Domain Mapping Structures3.2 Intel Trusted Execution Technology Intel TXT 3.3 Intel Hyper-Threading Technology Intel HT Technology Intel Turbo Boost Technology 2.0 Frequency 3.4 Intel Turbo Boost Technology3.5 Intel Advanced Vector Extensions 2.0 Intel AVX2 Intel Secure Key 3.6 Intel Advanced Encryption Standard New Instructions Intel AES-NIPCLMULQDQ Instruction 3.8 Intel 64 Architecture x2APIC 3.11 Supervisor Mode Execution Protection SMEP 3.9 Power Aware Interrupt Routing PAIR3.10 Execute Disable Bit Note Power states availability may vary between the different SKUs 4.0 Power ManagementFigure 11. Processor Power States S0 - Processor Fully powered on full on mode / connected standby modeProcessor Core / Package State Support 4.1 Advanced Configuration and Power Interface ACPI States SupportedSystem States Integrated Memory Controller StatesDirect Media Interface DMI States 4.2 Processor Core Power Management4.2.1 Enhanced Intel SpeedStep Technology Key Features G, S, and C Interface State CombinationsThread 4.2.2 Low-Power Idle StatesFigure 12. Idle Power Management Breakdown of the Processor Cores Core 0 StateFigure 13. Thread and Core C-State Entry and Exit 4.2.3 Requesting Low-Power Idle StatesCoordination of Thread Power States at the Core Level Core C1/C1E State 4.2.4 Core C-State RulesCore C0 State Core C3 StateCore C7 State 4.2.5 Package C-StatesCore C6 State C-State Auto-DemotionCoordination of Core Power States at the Package Level Package C1/C1E State Figure 14. Package C-State Entry and ExitPackage C0 State Package C6 State Package C2 StatePackage C3 State Package C7 State4.2.6 Package C-States and Display Resolutions Deepest Package C-State Available4.3 Integrated Memory Controller IMC Power Management 4.3.1 Disabling Unused System Memory Outputs4.3.2 DRAM Power Management and Initialization No power-down CKE disable4.3.2.2 Conditional Self-Refresh 4.3.2.3 Dynamic Power-Down4.3.2.1 Initialization Role of CKE 4.3.3 DRAM Running Average Power Limitation RAPL 4.4 PCI Express* Power Management4.5 Direct Media Interface DMI Power Management 4.3.4 DDR Electrical Power Gating EPG4.6.2 Graphics Render C-State 4.6 Graphics Power Management4.6.1 Intel Rapid Memory Power Management Intel RMPM 4.6.3 Intel Graphics Dynamic Frequency5.0 Thermal Management Thermal Management-ProcessorProcessor-Thermal Management Desktop Processor Thermal Specifications5.1 Desktop Processor Thermal Profiles ProfileTTV Power W 5.1.1 Processor PCG 2013D Thermal ProfileTCASE = 0.33 * Power + Case5.1.2 Processor PCG 2013C Thermal Profile 5.1.3 Processor PCG 2013B Thermal Profile 5.1.4 Processor PCG 2013A Thermal Profile Measure TCASE at the geometric center of the package 5.2 Thermal Metrology5.3 Fan Speed Control Scheme with Digital Thermal Sensor DTS 37.5 37.5Figure 20. Digital Thermal Sensor DTS 1.1 Definition Points ΨCA = TCASE-MAX - TAMBIENT-TARGET / TDP5.4 Fan Speed Control Scheme with Digital Thermal Sensor DTS Thermal Margin Slope 5.5 Processor TemperatureFigure 21. Digital Thermal Sensor DTS Thermal Profile Definition 5.6 Adaptive Thermal Monitor Frequency ControlCritical Temperature Flag Clock ModulationImmediate Transition to Combined TM1 and TM2 PROCHOT# Signal 5.7 THERMTRIP# Signal 5.8 Digital Thermal Sensor5.8.1 Digital Thermal Sensor Accuracy Taccuracy 5.9.1 Intel Turbo Boost Technology Power Control and Reporting5.9 Intel Turbo Boost Technology Thermal Considerations 5.9.2 Package Power Control Intel Turbo Boost Technology 2.0 Package Power Control SettingsFigure 22. Package Power Control 5.9.3 Turbo Time ParameterSignal Description Buffer Types 6.0 Signal Description6.1 System Memory Interface Signals Memory Channel A SignalsMemory Channel B Signals Signal Description-ProcessorDDR3/DDR3L Reference Voltage This signal is used as 6.2 Memory Reference and Compensation SignalsMemory Reference and Compensation Signals System Memory Impedance CompensationCFG3 MSR Privacy Bit Feature 6.3 Reset and Miscellaneous SignalsReset and Miscellaneous Signals CFG65 PCI Express* BifurcationPCI Express* Graphics Interface Signals 6.4 PCI Express*-Based Interface Signals6.5 Display Interface Signals Display Interface SignalsPhase Locked Loop PLL Signals 6.7 Phase Locked Loop PLL Signals6.8 Testability Signals Testability SignalsError and Thermal Protection Signals 6.9 Error and Thermal Protection Signals6.10 Power Sequencing Signals Power Sequencing Signals6.13 Ground and Non-Critical to Function NCTF Signals 6.11 Processor Power Signals6.12 Sense Signals Processor Power Signals7.1 Integrated Voltage Regulator 7.0 Electrical Specifications7.2 Power and Ground Lands 7.3 VCC Voltage Identification VIDTable 45. Voltage Regulator VR 12.5 Voltage Identification Electrical Specifications-Processorcontinued Processor-Electrical Specificationscontinued continued Electrical Specifications-Processorcontinued Processor-Electrical Specifications Signal Groups 7.4 Reserved or Unused Signals7.5 Signal Groups Power / Ground / Other DDR3 / DDR3L Data SignalsDDR3 / DDR3L Reference Voltage Signals DDR3 / DDR3L CompensationPCI Express* Graphics 7.6 Test Access Port TAP Connection7.7 DC Specifications Digital Media Interface DMI7.8 Voltage and Current Specifications Electrical Specifications-Processor DDR3 / DDR3L Signal Group DC Specifications VCCIOOUT, VCOMPOUT, and VCCIOTERMDigital Display Interface Group DC Specifications GTL Signal Group and Open Drain Signal Group DC Specifications embedded DisplayPort* eDP* Group DC SpecificationsCMOS Signal Group DC Specifications 7.8.1 Platform Environment Control Interface PECI DC Characteristics PCI Express* DC Specifications7.8.2 Input Device Hysteresis Figure 23. Input Device HysteresisFigure 24. Processor Package Assembly Sketch 8.0 Package Mechanical Specifications8.2 Package Loading Specifications 8.1 Processor Component Keep-Out ZoneProcessor Loading Specifications 8.4 Package Insertion Specifications8.5 Processor Mass Specification 8.3 Package Handling GuidelinesProcessor Materials 8.7 Processor Markings8.8 Processor Land Coordinates Figure 25. Processor Top-Side MarkingsFigure 26. Processor Package Land Coordinates 8.9 Processor Storage SpecificationsProcessor Storage Specifications RHsustained storage TIMEsustained storage9.0 Processor Ball and Signal Information Processor Ball List by Signal NameProcessor Ball and Signal Information-Processor Processor-Processor Ball and Signal Information Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name AU20 Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #
Related manuals
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BX80633I74960X, BX80646I34130, BX80646I54430, BX80646I74770K, BX80646I74770 specifications

The Intel CM8063701159502, or BX80637I53470, is a powerful CPU designed for modern computing needs. This processor belongs to Intel's 4th generation of Core i5 processors, commonly known as "Haswell". It showcases Intel's commitment to enhancing performance, increasing energy efficiency, and delivering an enriching user experience.

One of the main features of the Intel Core i5-3470 is its quad-core architecture. This allows the processor to handle multiple threads simultaneously, making it adept at multitasking and running demanding applications efficiently. With a base clock speed of 3.2 GHz, it can boost up to 3.6 GHz using Intel’s Turbo Boost technology, providing additional power when needed for intensive tasks like gaming or video editing.

The Intel i5-3470 features Intel's HD Graphics 2500, which offers decent graphics performance for everyday tasks and casual gaming. This integrated graphics solution is capable of delivering high-definition visuals and supports DirectX 11, making it suitable for lightweight gaming experiences without the need for an additional dedicated graphics card.

Another standout characteristic of the BX80637I53470 is its support for Intel Smart Cache, which is an advanced caching technology. It provides a shared cache pool that enhances performance by reducing the time it takes to access frequently used data. This feature, coupled with Intel's instruction set architecture, allows for improved processing agility and efficiency across applications.

The processor is built on a 22nm manufacturing process, which results in reduced power consumption and heat generation compared to its predecessors. It has a thermal design power (TDP) of 77 watts, making it energy efficient while still delivering robust performance. Additionally, the Core i5-3470 supports DDR3 memory, with speeds up to 1600 MHz, enabling quick data retrieval and improved system responsiveness.

Security is another important aspect of the Intel i5-3470, featuring Intel Secure Key and Intel AES New Instructions (AES-NI), which protect sensitive data and enhance encryption performance.

In conclusion, the Intel CM8063701159502, or BX80637I53470, encapsulates modern computing technology with its powerful quad-core performance, integrated graphics, energy efficiency, and robust security features, making it a versatile choice for a wide range of computing tasks. Whether users are engaging in casual gaming, productivity tasks, or multimedia consumption, this processor demonstrates a solid balance of performance and efficiency, providing an excellent computing experience overall.