Intel CM8064601466200, CM8064601466003, BX80637I73770K THERMTRIP# Signal, Digital Thermal Sensor

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5.7THERMTRIP# Signal
December 2013 Order No.: 328897-004

Processor—Thermal Management

a backup in case of system cooling failure. The system thermal design should allow the power delivery circuitry to operate within its temperature specification even while the processor is operating at its Thermal Design Power.

5.7THERMTRIP# Signal

Regardless of whether or not Adaptive Thermal Monitor is enabled, in the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in Error and Thermal Protection Signals on page 88). THERMTRIP# activation is independent of processor activity. The temperature at which THERMTRIP# asserts is not user configurable and is not software visible.

5.8Digital Thermal Sensor

Each processor execution core has an on-die Digital Thermal Sensor (DTS) that detects the core's instantaneous temperature. The DTS is the preferred method of monitoring processor die temperature because:

•It is located near the hottest portions of the die.

•It can accurately track the die temperature and ensure that the Adaptive Thermal Monitor is not excessively activated.

Temperature values from the DTS can be retrieved through:

•A software interface using processor Model Specific Register (MSR).

•A processor hardware interface as described in Platform Environmental Control Interface (PECI) on page 37.

When temperature is retrieved by the processor MSR, it is the instantaneous temperature of the given core. When temperature is retrieved using PECI, it is the average of the highest DTS temperature in the package over a 256 ms time window. Intel recommends using the PECI reported temperature for platform thermal control that benefits from averaging, such as fan speed control. The average DTS temperature may not be a good indicator of package Adaptive Thermal Monitor activation or rapid increases in temperature that triggers the Out of Specification status bit within the PACKAGE_THERM_STATUS MSR 1B1h and IA32_THERM_STATUS MSR 19Ch.

Code execution is halted in C1 or deeper C-states. Package temperature can still be monitored through PECI in lower C-states.

Unlike traditional thermal devices, the DTS outputs a temperature relative to the maximum supported operating temperature of the processor (TjMAX), regardless of TCC activation offset. It is the responsibility of software to convert the relative temperature to an absolute temperature. The absolute reference temperature is readable in the TEMPERATURE_TARGET MSR 1A2h. The temperature returned by the DTS is an implied negative integer indicating the relative offset from TjMAX. The DTS does not report temperatures greater than TjMAX. The DTS-relative temperature readout directly impacts the Adaptive Thermal Monitor trigger point. When a package DTS indicates that it has reached the TCC activation (a reading of 0h, except when the TCC activation offset is changed), the TCC will activate and indicate an Adaptive Thermal Monitor event. A TCC activation will lower both IA core and graphics core frequency, voltage, or both. Changes to the temperature can be detected using two programmable thresholds located in the processor thermal MSRs. These thresholds

Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

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Contents Datasheet - Volume 1 of DecemberDatasheet - Volume 1 of 2 Revision History Contents4.0 Power Management 1.0 Introduction6.0 Signal Description Processor-Contents5.0 Thermal Management 9.0 Processor Ball and Signal Information 7.0 Electrical Specifications8.0 Package Mechanical Specifications 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsFigures Tables Tables-ProcessorProcessor-Tables Revision History Revision History-Processor1.0 Introduction Processor-IntroductionProcessor Figure 1. Platform Block Diagram1.1 Supported Technologies Platform Controller Hub PCHProcessor Core 1.3 Power Management Support1.2 Interfaces System1.6 Terminology 1.4 Thermal Management Support1.5 Package Support Terminologywith Virtual Machine Monitor software, enables multiple, robust independent software Description Document 1.7 Related DocumentsRelated Documents Number / Locationproducts/processor specificationshttp manuals/index.htm2.0 Interfaces 2.1 System Memory InterfaceSupported UDIMM Module Configurations 2.1.1 System Memory Technology SupportedProcessor DIMM Support by Product Supported SO-DIMM Module Configurations AIO Only 2.1.2 System Memory Timing SupportDDR3 / DDR3L System Memory Timing Support Dual-Channel Mode - Intel Flex Memory Technology Mode 2.1.3 System Memory Organization ModesSingle-Channel Mode Figure 2. Intel Flex Memory Technology OperationsCommand Overlap 2.1.3.2 Intel Fast Memory Access Intel FMA Technology EnhancementsJust-in-Time Command Scheduling 2.1.3.1 System Memory Frequency2.2.1 PCI Express* Support Table 7. PCI Express* Supported Configurations in Desktop Products2.2 PCI Express* Interface 2.1.3.3 Data Scrambling2.2.3 PCI Express* Configuration Mechanism 2.2.2 PCI Express* ArchitecturePCI Express* Related Register Structures in the Processor PCI Express* PortPCI Express* Lanes Connection 1 X 4 Controller 2.3 Direct Media Interface DMIFigure 4. PCI Express* Typical Operation 16 Lanes Mapping 1 X 8 ControllerDMI Error Flow DMI Link Down2.4 Processor Graphics 2.5 Processor Graphics Controller GT3D Pipeline Figure 5. Processor Graphics Controller Unit Block Diagram2.5.1 3D and Video Engines for Graphics Processing 3D Engine Execution UnitsClip Stage Vertex Shader VS StageGeometry Shader GS Stage Strips and Fans SF Stage2.6 Digital Display Interface DDI 2.5.2 Multi Graphics Controllers Multi-Monitor SupportLogical 128-Bit Fixed BLT and 256 Fill Engine Figure 6. Processor Display Architecture DisplayPort Source DeviceSink Device Figure 7. DisplayPort* OverviewFigure 8. HDMI* Overview HDMI SourceHDMI Sink HDMI TxIntegrated Audio Multiple Display Configurationsembedded DisplayPort Table 8. Processor Supported Audio Formats over HDMI*and DisplayPortValid Three Display Configurations through the Processor High-bandwidth Digital Content Protection HDCP2.7 Intel Flexible Display Interface Intel FDI 2.8 Platform Environmental Control Interface PECI2.8.1 PECI Bus Architecture Host / Originator Figure 9. PECI Host-Clients Connection ExamplePECI PECI ClientIntel VT-x Objectives 3.0 Technologies3.1 Intel Virtualization Technology Intel VT ing=VTIntel VT-x Features Intel VT-d Objectives Intel VT-d Features Figure 10. Device to Domain Mapping Structures3.2 Intel Trusted Execution Technology Intel TXT 3.3 Intel Hyper-Threading Technology Intel HT Technology 3.4 Intel Turbo Boost Technology 3.5 Intel Advanced Vector Extensions 2.0 Intel AVX2Intel Turbo Boost Technology 2.0 Frequency 3.6 Intel Advanced Encryption Standard New Instructions Intel AES-NI PCLMULQDQ InstructionIntel Secure Key 3.8 Intel 64 Architecture x2APIC 3.9 Power Aware Interrupt Routing PAIR 3.10 Execute Disable Bit3.11 Supervisor Mode Execution Protection SMEP Note Power states availability may vary between the different SKUs 4.0 Power ManagementFigure 11. Processor Power States S0 - Processor Fully powered on full on mode / connected standby modeProcessor Core / Package State Support 4.1 Advanced Configuration and Power Interface ACPI States SupportedSystem States Integrated Memory Controller StatesDirect Media Interface DMI States 4.2 Processor Core Power Management4.2.1 Enhanced Intel SpeedStep Technology Key Features G, S, and C Interface State CombinationsThread 4.2.2 Low-Power Idle StatesFigure 12. Idle Power Management Breakdown of the Processor Cores Core 0 State4.2.3 Requesting Low-Power Idle States Coordination of Thread Power States at the Core LevelFigure 13. Thread and Core C-State Entry and Exit Core C1/C1E State 4.2.4 Core C-State RulesCore C0 State Core C3 StateCore C7 State 4.2.5 Package C-StatesCore C6 State C-State Auto-DemotionCoordination of Core Power States at the Package Level Figure 14. Package C-State Entry and Exit Package C0 StatePackage C1/C1E State Package C6 State Package C2 StatePackage C3 State Package C7 State4.2.6 Package C-States and Display Resolutions Deepest Package C-State Available4.3 Integrated Memory Controller IMC Power Management 4.3.1 Disabling Unused System Memory Outputs4.3.2 DRAM Power Management and Initialization No power-down CKE disable4.3.2.3 Dynamic Power-Down 4.3.2.1 Initialization Role of CKE4.3.2.2 Conditional Self-Refresh 4.3.3 DRAM Running Average Power Limitation RAPL 4.4 PCI Express* Power Management4.5 Direct Media Interface DMI Power Management 4.3.4 DDR Electrical Power Gating EPG4.6.2 Graphics Render C-State 4.6 Graphics Power Management4.6.1 Intel Rapid Memory Power Management Intel RMPM 4.6.3 Intel Graphics Dynamic Frequency5.0 Thermal Management Thermal Management-ProcessorProcessor-Thermal Management Desktop Processor Thermal Specifications5.1 Desktop Processor Thermal Profiles ProfileTTV Power W 5.1.1 Processor PCG 2013D Thermal ProfileTCASE = 0.33 * Power + Case5.1.2 Processor PCG 2013C Thermal Profile 5.1.3 Processor PCG 2013B Thermal Profile 5.1.4 Processor PCG 2013A Thermal Profile Measure TCASE at the geometric center of the package 5.2 Thermal Metrology5.3 Fan Speed Control Scheme with Digital Thermal Sensor DTS 37.5 37.5Figure 20. Digital Thermal Sensor DTS 1.1 Definition Points ΨCA = TCASE-MAX - TAMBIENT-TARGET / TDP5.4 Fan Speed Control Scheme with Digital Thermal Sensor DTS 5.5 Processor Temperature Figure 21. Digital Thermal Sensor DTS Thermal Profile DefinitionThermal Margin Slope 5.6 Adaptive Thermal Monitor Frequency ControlClock Modulation Immediate Transition to Combined TM1 and TM2Critical Temperature Flag PROCHOT# Signal 5.7 THERMTRIP# Signal 5.8 Digital Thermal Sensor5.9.1 Intel Turbo Boost Technology Power Control and Reporting 5.9 Intel Turbo Boost Technology Thermal Considerations5.8.1 Digital Thermal Sensor Accuracy Taccuracy 5.9.2 Package Power Control Intel Turbo Boost Technology 2.0 Package Power Control SettingsFigure 22. Package Power Control 5.9.3 Turbo Time ParameterSignal Description Buffer Types 6.0 Signal Description6.1 System Memory Interface Signals Memory Channel A SignalsMemory Channel B Signals Signal Description-ProcessorDDR3/DDR3L Reference Voltage This signal is used as 6.2 Memory Reference and Compensation SignalsMemory Reference and Compensation Signals System Memory Impedance CompensationCFG3 MSR Privacy Bit Feature 6.3 Reset and Miscellaneous SignalsReset and Miscellaneous Signals CFG65 PCI Express* BifurcationPCI Express* Graphics Interface Signals 6.4 PCI Express*-Based Interface Signals6.5 Display Interface Signals Display Interface SignalsPhase Locked Loop PLL Signals 6.7 Phase Locked Loop PLL Signals6.8 Testability Signals Testability SignalsError and Thermal Protection Signals 6.9 Error and Thermal Protection Signals6.10 Power Sequencing Signals Power Sequencing Signals6.13 Ground and Non-Critical to Function NCTF Signals 6.11 Processor Power Signals6.12 Sense Signals Processor Power Signals7.1 Integrated Voltage Regulator 7.0 Electrical Specifications7.2 Power and Ground Lands 7.3 VCC Voltage Identification VIDTable 45. Voltage Regulator VR 12.5 Voltage Identification Electrical Specifications-ProcessorProcessor-Electrical Specifications continuedcontinued Electrical Specifications-Processor continuedcontinued Processor-Electrical Specifications 7.4 Reserved or Unused Signals 7.5 Signal GroupsSignal Groups Power / Ground / Other DDR3 / DDR3L Data SignalsDDR3 / DDR3L Reference Voltage Signals DDR3 / DDR3L CompensationPCI Express* Graphics 7.6 Test Access Port TAP Connection7.7 DC Specifications Digital Media Interface DMI7.8 Voltage and Current Specifications Electrical Specifications-Processor DDR3 / DDR3L Signal Group DC Specifications VCCIOOUT, VCOMPOUT, and VCCIOTERMDigital Display Interface Group DC Specifications embedded DisplayPort* eDP* Group DC Specifications CMOS Signal Group DC SpecificationsGTL Signal Group and Open Drain Signal Group DC Specifications 7.8.1 Platform Environment Control Interface PECI DC Characteristics PCI Express* DC Specifications7.8.2 Input Device Hysteresis Figure 23. Input Device HysteresisFigure 24. Processor Package Assembly Sketch 8.0 Package Mechanical Specifications8.2 Package Loading Specifications 8.1 Processor Component Keep-Out ZoneProcessor Loading Specifications 8.4 Package Insertion Specifications8.5 Processor Mass Specification 8.3 Package Handling GuidelinesProcessor Materials 8.7 Processor Markings8.8 Processor Land Coordinates Figure 25. Processor Top-Side Markings8.9 Processor Storage Specifications Processor Storage SpecificationsFigure 26. Processor Package Land Coordinates RHsustained storage TIMEsustained storage9.0 Processor Ball and Signal Information Processor Ball List by Signal NameProcessor Ball and Signal Information-Processor Processor-Processor Ball and Signal Information Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name AU20 Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #
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BX80633I74960X, BX80646I34130, BX80646I54430, BX80646I74770K, BX80646I74770 specifications

The Intel CM8063701159502, or BX80637I53470, is a powerful CPU designed for modern computing needs. This processor belongs to Intel's 4th generation of Core i5 processors, commonly known as "Haswell". It showcases Intel's commitment to enhancing performance, increasing energy efficiency, and delivering an enriching user experience.

One of the main features of the Intel Core i5-3470 is its quad-core architecture. This allows the processor to handle multiple threads simultaneously, making it adept at multitasking and running demanding applications efficiently. With a base clock speed of 3.2 GHz, it can boost up to 3.6 GHz using Intel’s Turbo Boost technology, providing additional power when needed for intensive tasks like gaming or video editing.

The Intel i5-3470 features Intel's HD Graphics 2500, which offers decent graphics performance for everyday tasks and casual gaming. This integrated graphics solution is capable of delivering high-definition visuals and supports DirectX 11, making it suitable for lightweight gaming experiences without the need for an additional dedicated graphics card.

Another standout characteristic of the BX80637I53470 is its support for Intel Smart Cache, which is an advanced caching technology. It provides a shared cache pool that enhances performance by reducing the time it takes to access frequently used data. This feature, coupled with Intel's instruction set architecture, allows for improved processing agility and efficiency across applications.

The processor is built on a 22nm manufacturing process, which results in reduced power consumption and heat generation compared to its predecessors. It has a thermal design power (TDP) of 77 watts, making it energy efficient while still delivering robust performance. Additionally, the Core i5-3470 supports DDR3 memory, with speeds up to 1600 MHz, enabling quick data retrieval and improved system responsiveness.

Security is another important aspect of the Intel i5-3470, featuring Intel Secure Key and Intel AES New Instructions (AES-NI), which protect sensitive data and enhance encryption performance.

In conclusion, the Intel CM8063701159502, or BX80637I53470, encapsulates modern computing technology with its powerful quad-core performance, integrated graphics, energy efficiency, and robust security features, making it a versatile choice for a wide range of computing tasks. Whether users are engaging in casual gaming, productivity tasks, or multimedia consumption, this processor demonstrates a solid balance of performance and efficiency, providing an excellent computing experience overall.
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