Intel BX80633I74960X, CM8064601466200, CM8064601466003, BX80637I73770K manual continued, AU20

Page 116
AU20
December 2013 Order No.: 328897-004

 

 

 

 

Processor—Processor Ball and Signal Information

 

 

 

 

 

 

 

 

 

Signal Name

Ball #

 

Signal Name

 

Ball #

 

Signal Name

Ball #

 

 

 

 

 

 

 

 

 

VCC

L28

 

VDDQ

 

AU20

 

VSS

AC34

 

 

 

 

 

 

 

 

 

VCC

L29

 

VDDQ

 

AU24

 

VSS

AC35

 

 

 

 

 

 

 

 

 

VCC

L30

 

VDDQ

 

AV10

 

VSS

AC36

 

 

 

 

 

 

 

 

 

VCC

L31

 

VDDQ

 

AV11

 

VSS

AC37

 

 

 

 

 

 

 

 

 

VCC

L32

 

VDDQ

 

AV13

 

VSS

AC38

 

 

 

 

 

 

 

 

 

VCC

L33

 

VDDQ

 

AV18

 

VSS

AC39

 

 

 

 

 

 

 

 

 

VCC

L34

 

VDDQ

 

AV23

 

VSS

AC40

 

 

 

 

 

 

 

 

 

VCC

M13

 

VDDQ

 

AV8

 

VSS

AC6

 

 

 

 

 

 

 

 

 

VCC

M15

 

VDDQ

 

AW16

 

VSS

AC7

 

 

 

 

 

 

 

 

 

VCC

M17

 

VDDQ

 

AY12

 

VSS

AD1

 

 

 

 

 

 

 

 

 

VCC

M19

 

VDDQ

 

AY14

 

VSS

AD2

 

 

 

 

 

 

 

 

 

VCC

M21

 

VDDQ

 

AY9

 

VSS

AD3

 

 

 

 

 

 

 

 

 

VCC

M23

 

VIDALERT#

 

B37

 

VSS

AD33

 

 

 

 

 

 

 

 

 

VCC

M25

 

VIDSCLK

 

C38

 

VSS

AD36

 

 

 

 

 

 

 

 

 

VCC

M27

 

VIDSOUT

 

C37

 

VSS

AD4

 

 

 

 

 

 

 

 

 

VCC

M29

 

VSS

 

A11

 

VSS

AD5

 

 

 

 

 

 

 

 

 

VCC

M33

 

VSS

 

A13

 

VSS

AD6

 

 

 

 

 

 

 

 

 

VCC

M8

 

VSS

 

A15

 

VSS

AD7

 

 

 

 

 

 

 

 

 

VCC

P8

 

VSS

 

A17

 

VSS

AD8

 

 

 

 

 

 

 

 

 

VCC_SENSE

E40

 

VSS

 

A23

 

VSS

AE33

 

 

 

 

 

 

 

 

 

VCCIO_OUT

L40

 

VSS

 

A5

 

VSS

AE36

 

 

 

 

 

 

 

 

 

VCOMP_OUT

P4

 

VSS

 

A7

 

VSS

AE37

 

 

 

 

 

 

 

 

 

VDDQ

AJ12

 

VSS

 

AA3

 

VSS

AE40

 

 

 

 

 

 

 

 

 

VDDQ

AJ13

 

VSS

 

AA33

 

VSS

AE5

 

 

 

 

 

 

 

 

 

VDDQ

AJ15

 

VSS

 

AA35

 

VSS

AE8

 

 

 

 

 

 

 

 

 

VDDQ

AJ17

 

VSS

 

AA38

 

VSS

AF1

 

 

 

 

 

 

 

 

 

VDDQ

AJ20

 

VSS

 

AA6

 

VSS

AF33

 

 

 

 

 

 

 

 

 

VDDQ

AJ21

 

VSS

 

AA7

 

VSS

AF36

 

 

 

 

 

 

 

 

 

VDDQ

AJ24

 

VSS

 

AA8

 

VSS

AF4

 

 

 

 

 

 

 

 

 

VDDQ

AJ25

 

VSS

 

AB34

 

VSS

AF5

 

 

 

 

 

 

 

 

 

VDDQ

AJ28

 

VSS

 

AB37

 

VSS

AF8

 

 

 

 

 

 

 

 

 

VDDQ

AJ29

 

VSS

 

AB5

 

VSS

AG33

 

 

 

 

 

 

 

 

 

VDDQ

AJ9

 

VSS

 

AB6

 

VSS

AG36

 

 

 

 

 

 

 

 

 

VDDQ

AT17

 

VSS

 

AB7

 

VSS

AG37

 

 

 

 

 

 

 

 

 

VDDQ

AT22

 

VSS

 

AC3

 

VSS

AG38

 

 

 

 

 

 

 

 

 

VDDQ

AU15

 

VSS

 

AC33

 

VSS

AG39

 

 

 

 

 

 

 

 

 

 

continued...

 

 

 

continued...

 

 

continued...

Desktop 4th Generation Intel® CoreProcessor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

Datasheet – Volume 1 of 2 116

Image 116
Contents Datasheet - Volume 1 of DecemberDatasheet - Volume 1 of 2 Contents 4.0 Power ManagementRevision History 1.0 Introduction5.0 Thermal Management 6.0 Signal DescriptionProcessor-Contents 7.0 Electrical Specifications 8.0 Package Mechanical Specifications9.0 Processor Ball and Signal Information 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsFigures Tables Tables-ProcessorProcessor-Tables Revision History Revision History-Processor1.0 Introduction Processor-IntroductionFigure 1. Platform Block Diagram 1.1 Supported TechnologiesProcessor Platform Controller Hub PCH1.3 Power Management Support 1.2 InterfacesProcessor Core System1.4 Thermal Management Support 1.5 Package Support1.6 Terminology Terminologywith Virtual Machine Monitor software, enables multiple, robust independent software Introduction-Processor 1.7 Related Documents Related DocumentsDocument Number / Locationspecifications httpproducts/processor manuals/index.htm2.0 Interfaces 2.1 System Memory InterfaceProcessor DIMM Support by Product Supported UDIMM Module Configurations2.1.1 System Memory Technology Supported DDR3 / DDR3L System Memory Timing Support Supported SO-DIMM Module Configurations AIO Only2.1.2 System Memory Timing Support 2.1.3 System Memory Organization Modes Single-Channel ModeDual-Channel Mode - Intel Flex Memory Technology Mode Figure 2. Intel Flex Memory Technology Operations2.1.3.2 Intel Fast Memory Access Intel FMA Technology Enhancements Just-in-Time Command SchedulingCommand Overlap 2.1.3.1 System Memory FrequencyTable 7. PCI Express* Supported Configurations in Desktop Products 2.2 PCI Express* Interface2.2.1 PCI Express* Support 2.1.3.3 Data Scrambling2.2.3 PCI Express* Configuration Mechanism 2.2.2 PCI Express* ArchitecturePCI Express* Lanes Connection PCI Express* Related Register Structures in the ProcessorPCI Express* Port 2.3 Direct Media Interface DMI Figure 4. PCI Express* Typical Operation 16 Lanes Mapping1 X 4 Controller 1 X 8 ControllerDMI Error Flow DMI Link Down2.4 Processor Graphics 2.5 Processor Graphics Controller GTFigure 5. Processor Graphics Controller Unit Block Diagram 2.5.1 3D and Video Engines for Graphics Processing3D Pipeline 3D Engine Execution UnitsVertex Shader VS Stage Geometry Shader GS StageClip Stage Strips and Fans SF StageLogical 128-Bit Fixed BLT and 256 Fill Engine 2.6 Digital Display Interface DDI2.5.2 Multi Graphics Controllers Multi-Monitor Support Figure 6. Processor Display Architecture Source Device Sink DeviceDisplayPort Figure 7. DisplayPort* OverviewHDMI Source HDMI SinkFigure 8. HDMI* Overview HDMI TxMultiple Display Configurations embedded DisplayPortIntegrated Audio Table 8. Processor Supported Audio Formats over HDMI*and DisplayPortValid Three Display Configurations through the Processor High-bandwidth Digital Content Protection HDCP2.8.1 PECI Bus Architecture 2.7 Intel Flexible Display Interface Intel FDI2.8 Platform Environmental Control Interface PECI Figure 9. PECI Host-Clients Connection Example PECIHost / Originator PECI Client3.0 Technologies 3.1 Intel Virtualization Technology Intel VTIntel VT-x Objectives ing=VTIntel VT-x Features Intel VT-d Objectives Intel VT-d Features Figure 10. Device to Domain Mapping Structures3.2 Intel Trusted Execution Technology Intel TXT 3.3 Intel Hyper-Threading Technology Intel HT Technology Intel Turbo Boost Technology 2.0 Frequency 3.4 Intel Turbo Boost Technology3.5 Intel Advanced Vector Extensions 2.0 Intel AVX2 Intel Secure Key 3.6 Intel Advanced Encryption Standard New Instructions Intel AES-NIPCLMULQDQ Instruction 3.8 Intel 64 Architecture x2APIC 3.11 Supervisor Mode Execution Protection SMEP 3.9 Power Aware Interrupt Routing PAIR3.10 Execute Disable Bit 4.0 Power Management Figure 11. Processor Power StatesNote Power states availability may vary between the different SKUs S0 - Processor Fully powered on full on mode / connected standby mode4.1 Advanced Configuration and Power Interface ACPI States Supported System StatesProcessor Core / Package State Support Integrated Memory Controller States4.2 Processor Core Power Management 4.2.1 Enhanced Intel SpeedStep Technology Key FeaturesDirect Media Interface DMI States G, S, and C Interface State Combinations4.2.2 Low-Power Idle States Figure 12. Idle Power Management Breakdown of the Processor CoresThread Core 0 StateFigure 13. Thread and Core C-State Entry and Exit 4.2.3 Requesting Low-Power Idle StatesCoordination of Thread Power States at the Core Level 4.2.4 Core C-State Rules Core C0 StateCore C1/C1E State Core C3 State4.2.5 Package C-States Core C6 StateCore C7 State C-State Auto-DemotionCoordination of Core Power States at the Package Level Package C1/C1E State Figure 14. Package C-State Entry and ExitPackage C0 State Package C2 State Package C3 StatePackage C6 State Package C7 State4.2.6 Package C-States and Display Resolutions Deepest Package C-State Available4.3 Integrated Memory Controller IMC Power Management 4.3.1 Disabling Unused System Memory Outputs4.3.2 DRAM Power Management and Initialization No power-down CKE disable4.3.2.2 Conditional Self-Refresh 4.3.2.3 Dynamic Power-Down4.3.2.1 Initialization Role of CKE 4.4 PCI Express* Power Management 4.5 Direct Media Interface DMI Power Management4.3.3 DRAM Running Average Power Limitation RAPL 4.3.4 DDR Electrical Power Gating EPG4.6 Graphics Power Management 4.6.1 Intel Rapid Memory Power Management Intel RMPM4.6.2 Graphics Render C-State 4.6.3 Intel Graphics Dynamic Frequency5.0 Thermal Management Thermal Management-ProcessorDesktop Processor Thermal Specifications 5.1 Desktop Processor Thermal ProfilesProcessor-Thermal Management Profile5.1.1 Processor PCG 2013D Thermal Profile TCASE = 0.33 * Power +TTV Power W Case5.1.2 Processor PCG 2013C Thermal Profile 5.1.3 Processor PCG 2013B Thermal Profile 5.1.4 Processor PCG 2013A Thermal Profile 5.2 Thermal Metrology 5.3 Fan Speed Control Scheme with Digital Thermal Sensor DTSMeasure TCASE at the geometric center of the package 37.5 37.5Figure 20. Digital Thermal Sensor DTS 1.1 Definition Points ΨCA = TCASE-MAX - TAMBIENT-TARGET / TDP5.4 Fan Speed Control Scheme with Digital Thermal Sensor DTS Thermal Margin Slope 5.5 Processor TemperatureFigure 21. Digital Thermal Sensor DTS Thermal Profile Definition 5.6 Adaptive Thermal Monitor Frequency ControlCritical Temperature Flag Clock ModulationImmediate Transition to Combined TM1 and TM2 PROCHOT# Signal 5.7 THERMTRIP# Signal 5.8 Digital Thermal Sensor5.8.1 Digital Thermal Sensor Accuracy Taccuracy 5.9.1 Intel Turbo Boost Technology Power Control and Reporting5.9 Intel Turbo Boost Technology Thermal Considerations 5.9.2 Package Power Control Intel Turbo Boost Technology 2.0 Package Power Control SettingsFigure 22. Package Power Control 5.9.3 Turbo Time Parameter6.0 Signal Description 6.1 System Memory Interface SignalsSignal Description Buffer Types Memory Channel A SignalsMemory Channel B Signals Signal Description-Processor6.2 Memory Reference and Compensation Signals Memory Reference and Compensation SignalsDDR3/DDR3L Reference Voltage This signal is used as System Memory Impedance Compensation6.3 Reset and Miscellaneous Signals Reset and Miscellaneous SignalsCFG3 MSR Privacy Bit Feature CFG65 PCI Express* Bifurcation6.4 PCI Express*-Based Interface Signals 6.5 Display Interface SignalsPCI Express* Graphics Interface Signals Display Interface Signals6.7 Phase Locked Loop PLL Signals 6.8 Testability SignalsPhase Locked Loop PLL Signals Testability Signals6.9 Error and Thermal Protection Signals 6.10 Power Sequencing SignalsError and Thermal Protection Signals Power Sequencing Signals6.11 Processor Power Signals 6.12 Sense Signals6.13 Ground and Non-Critical to Function NCTF Signals Processor Power Signals7.0 Electrical Specifications 7.2 Power and Ground Lands7.1 Integrated Voltage Regulator 7.3 VCC Voltage Identification VIDTable 45. Voltage Regulator VR 12.5 Voltage Identification Electrical Specifications-Processorcontinued Processor-Electrical Specificationscontinued continued Electrical Specifications-Processorcontinued Processor-Electrical Specifications Signal Groups 7.4 Reserved or Unused Signals7.5 Signal Groups DDR3 / DDR3L Data Signals DDR3 / DDR3L Reference Voltage SignalsPower / Ground / Other DDR3 / DDR3L Compensation7.6 Test Access Port TAP Connection 7.7 DC SpecificationsPCI Express* Graphics Digital Media Interface DMI7.8 Voltage and Current Specifications Electrical Specifications-Processor DDR3 / DDR3L Signal Group DC Specifications VCCIOOUT, VCOMPOUT, and VCCIOTERMDigital Display Interface Group DC Specifications GTL Signal Group and Open Drain Signal Group DC Specifications embedded DisplayPort* eDP* Group DC SpecificationsCMOS Signal Group DC Specifications 7.8.1 Platform Environment Control Interface PECI DC Characteristics PCI Express* DC Specifications7.8.2 Input Device Hysteresis Figure 23. Input Device Hysteresis8.0 Package Mechanical Specifications 8.2 Package Loading SpecificationsFigure 24. Processor Package Assembly Sketch 8.1 Processor Component Keep-Out Zone8.4 Package Insertion Specifications 8.5 Processor Mass SpecificationProcessor Loading Specifications 8.3 Package Handling Guidelines8.7 Processor Markings 8.8 Processor Land CoordinatesProcessor Materials Figure 25. Processor Top-Side MarkingsFigure 26. Processor Package Land Coordinates 8.9 Processor Storage SpecificationsProcessor Storage Specifications RHsustained storage TIMEsustained storage9.0 Processor Ball and Signal Information Processor Ball List by Signal NameProcessor Ball and Signal Information-Processor Processor-Processor Ball and Signal Information Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name AU20 Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #
Related manuals
Manual 1 pages 13.56 Kb Manual 2 pages 53.21 Kb Manual 1 pages 5.02 Kb

BX80633I74960X, BX80646I34130, BX80646I54430, BX80646I74770K, BX80646I74770 specifications

The Intel CM8063701159502, or BX80637I53470, is a powerful CPU designed for modern computing needs. This processor belongs to Intel's 4th generation of Core i5 processors, commonly known as "Haswell". It showcases Intel's commitment to enhancing performance, increasing energy efficiency, and delivering an enriching user experience.

One of the main features of the Intel Core i5-3470 is its quad-core architecture. This allows the processor to handle multiple threads simultaneously, making it adept at multitasking and running demanding applications efficiently. With a base clock speed of 3.2 GHz, it can boost up to 3.6 GHz using Intel’s Turbo Boost technology, providing additional power when needed for intensive tasks like gaming or video editing.

The Intel i5-3470 features Intel's HD Graphics 2500, which offers decent graphics performance for everyday tasks and casual gaming. This integrated graphics solution is capable of delivering high-definition visuals and supports DirectX 11, making it suitable for lightweight gaming experiences without the need for an additional dedicated graphics card.

Another standout characteristic of the BX80637I53470 is its support for Intel Smart Cache, which is an advanced caching technology. It provides a shared cache pool that enhances performance by reducing the time it takes to access frequently used data. This feature, coupled with Intel's instruction set architecture, allows for improved processing agility and efficiency across applications.

The processor is built on a 22nm manufacturing process, which results in reduced power consumption and heat generation compared to its predecessors. It has a thermal design power (TDP) of 77 watts, making it energy efficient while still delivering robust performance. Additionally, the Core i5-3470 supports DDR3 memory, with speeds up to 1600 MHz, enabling quick data retrieval and improved system responsiveness.

Security is another important aspect of the Intel i5-3470, featuring Intel Secure Key and Intel AES New Instructions (AES-NI), which protect sensitive data and enhance encryption performance.

In conclusion, the Intel CM8063701159502, or BX80637I53470, encapsulates modern computing technology with its powerful quad-core performance, integrated graphics, energy efficiency, and robust security features, making it a versatile choice for a wide range of computing tasks. Whether users are engaging in casual gaming, productivity tasks, or multimedia consumption, this processor demonstrates a solid balance of performance and efficiency, providing an excellent computing experience overall.