Intel BX80646I34130 manual Intel Flexible Display Interface Intel FDI, PECI Bus Architecture

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2.7Intel® Flexible Display Interface (Intel® FDI)

Interfaces—Processor

2.7Intel® Flexible Display Interface (Intel® FDI)

•The Intel Flexible Display Interface (Intel FDI) passes display data from the processor (source) to the PCH (sink) for display through a display interface on the PCH.

•Intel FDI supports 2 lanes at 2.7 GT/s fixed frequency. This can be configured to 1 or 2 lanes depending on the bandwidth requirements.

•Intel FDI supports 8 bits per color only.

•Side band sync pin (FDI_CSYNC).

•Side band interrupt pin (DISP_INT). This carries combined interrupt for HPDs of all the ports, AUX and I2C completion events, and so on.

•Intel FDI is not encrypted as it drives only VGA and content protection is not supported on VGA.

2.8Platform Environmental Control Interface (PECI)

PECI is an Intel proprietary interface that provides a communication channel between Intel processors and external components, like Super I/O (SIO) and Embedded Controllers (EC), to provide processor temperature, Turbo, TDP, and memory throttling control mechanisms and many other services. PECI is used for platform thermal management and real time control and configuration of processor features and performance.

2.8.1PECI Bus Architecture

The PECI architecture is based on a wired-OR bus that the clients (as processor PECI) can pull up high (with strong drive).

The idle state on the bus is near zero.

The following figure demonstrates PECI design and connectivity. While the host/ originator can be a third party PECI host, one of the PECI clients is a processor PECI device.

Desktop 4th Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

December 2013

Datasheet – Volume 1 of 2

Order No.: 328897-004

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Contents December Datasheet - Volume 1 ofDatasheet - Volume 1 of 2 4.0 Power Management ContentsRevision History 1.0 IntroductionProcessor-Contents 6.0 Signal Description5.0 Thermal Management 8.0 Package Mechanical Specifications 7.0 Electrical Specifications9.0 Processor Ball and Signal Information 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsFigures Tables-Processor TablesProcessor-Tables Revision History-Processor Revision HistoryProcessor-Introduction 1.0 Introduction1.1 Supported Technologies Figure 1. Platform Block DiagramProcessor Platform Controller Hub PCH1.2 Interfaces 1.3 Power Management SupportProcessor Core System1.5 Package Support 1.4 Thermal Management Support1.6 Terminology Terminologywith Virtual Machine Monitor software, enables multiple, robust independent software Term Related Documents 1.7 Related DocumentsDocument Number / Locationhttp specificationsproducts/processor manuals/index.htm2.1 System Memory Interface 2.0 Interfaces2.1.1 System Memory Technology Supported Supported UDIMM Module ConfigurationsProcessor DIMM Support by Product 2.1.2 System Memory Timing Support Supported SO-DIMM Module Configurations AIO OnlyDDR3 / DDR3L System Memory Timing Support Single-Channel Mode 2.1.3 System Memory Organization ModesDual-Channel Mode - Intel Flex Memory Technology Mode Figure 2. Intel Flex Memory Technology OperationsJust-in-Time Command Scheduling 2.1.3.2 Intel Fast Memory Access Intel FMA Technology EnhancementsCommand Overlap 2.1.3.1 System Memory Frequency2.2 PCI Express* Interface Table 7. PCI Express* Supported Configurations in Desktop Products2.2.1 PCI Express* Support 2.1.3.3 Data Scrambling2.2.2 PCI Express* Architecture 2.2.3 PCI Express* Configuration MechanismPCI Express* Port PCI Express* Related Register Structures in the ProcessorPCI Express* Lanes Connection Figure 4. PCI Express* Typical Operation 16 Lanes Mapping 2.3 Direct Media Interface DMI1 X 4 Controller 1 X 8 ControllerDMI Link Down DMI Error Flow2.5 Processor Graphics Controller GT 2.4 Processor Graphics2.5.1 3D and Video Engines for Graphics Processing Figure 5. Processor Graphics Controller Unit Block Diagram3D Pipeline 3D Engine Execution UnitsGeometry Shader GS Stage Vertex Shader VS StageClip Stage Strips and Fans SF Stage2.5.2 Multi Graphics Controllers Multi-Monitor Support 2.6 Digital Display Interface DDILogical 128-Bit Fixed BLT and 256 Fill Engine Figure 6. Processor Display Architecture Sink Device Source DeviceDisplayPort Figure 7. DisplayPort* OverviewHDMI Sink HDMI SourceFigure 8. HDMI* Overview HDMI Txembedded DisplayPort Multiple Display ConfigurationsIntegrated Audio Table 8. Processor Supported Audio Formats over HDMI*and DisplayPortHigh-bandwidth Digital Content Protection HDCP Valid Three Display Configurations through the Processor2.8 Platform Environmental Control Interface PECI 2.7 Intel Flexible Display Interface Intel FDI2.8.1 PECI Bus Architecture PECI Figure 9. PECI Host-Clients Connection ExampleHost / Originator PECI Client3.1 Intel Virtualization Technology Intel VT 3.0 TechnologiesIntel VT-x Objectives ing=VTIntel VT-x Features Intel VT-d Objectives Figure 10. Device to Domain Mapping Structures Intel VT-d Features3.2 Intel Trusted Execution Technology Intel TXT 3.3 Intel Hyper-Threading Technology Intel HT Technology 3.5 Intel Advanced Vector Extensions 2.0 Intel AVX2 3.4 Intel Turbo Boost TechnologyIntel Turbo Boost Technology 2.0 Frequency PCLMULQDQ Instruction 3.6 Intel Advanced Encryption Standard New Instructions Intel AES-NIIntel Secure Key 3.8 Intel 64 Architecture x2APIC 3.10 Execute Disable Bit 3.9 Power Aware Interrupt Routing PAIR3.11 Supervisor Mode Execution Protection SMEP Figure 11. Processor Power States 4.0 Power ManagementNote Power states availability may vary between the different SKUs S0 - Processor Fully powered on full on mode / connected standby modeSystem States 4.1 Advanced Configuration and Power Interface ACPI States SupportedProcessor Core / Package State Support Integrated Memory Controller States4.2.1 Enhanced Intel SpeedStep Technology Key Features 4.2 Processor Core Power ManagementDirect Media Interface DMI States G, S, and C Interface State CombinationsFigure 12. Idle Power Management Breakdown of the Processor Cores 4.2.2 Low-Power Idle StatesThread Core 0 StateCoordination of Thread Power States at the Core Level 4.2.3 Requesting Low-Power Idle StatesFigure 13. Thread and Core C-State Entry and Exit Core C0 State 4.2.4 Core C-State RulesCore C1/C1E State Core C3 StateCore C6 State 4.2.5 Package C-StatesCore C7 State C-State Auto-DemotionCoordination of Core Power States at the Package Level Package C0 State Figure 14. Package C-State Entry and ExitPackage C1/C1E State Package C3 State Package C2 StatePackage C6 State Package C7 StateDeepest Package C-State Available 4.2.6 Package C-States and Display Resolutions4.3.1 Disabling Unused System Memory Outputs 4.3 Integrated Memory Controller IMC Power ManagementNo power-down CKE disable 4.3.2 DRAM Power Management and Initialization4.3.2.1 Initialization Role of CKE 4.3.2.3 Dynamic Power-Down4.3.2.2 Conditional Self-Refresh 4.5 Direct Media Interface DMI Power Management 4.4 PCI Express* Power Management4.3.3 DRAM Running Average Power Limitation RAPL 4.3.4 DDR Electrical Power Gating EPG4.6.1 Intel Rapid Memory Power Management Intel RMPM 4.6 Graphics Power Management4.6.2 Graphics Render C-State 4.6.3 Intel Graphics Dynamic FrequencyThermal Management-Processor 5.0 Thermal Management5.1 Desktop Processor Thermal Profiles Desktop Processor Thermal SpecificationsProcessor-Thermal Management ProfileTCASE = 0.33 * Power + 5.1.1 Processor PCG 2013D Thermal ProfileTTV Power W Case5.1.2 Processor PCG 2013C Thermal Profile 5.1.3 Processor PCG 2013B Thermal Profile 5.1.4 Processor PCG 2013A Thermal Profile 5.3 Fan Speed Control Scheme with Digital Thermal Sensor DTS 5.2 Thermal MetrologyMeasure TCASE at the geometric center of the package 37.5 37.5ΨCA = TCASE-MAX - TAMBIENT-TARGET / TDP Figure 20. Digital Thermal Sensor DTS 1.1 Definition Points5.4 Fan Speed Control Scheme with Digital Thermal Sensor DTS Figure 21. Digital Thermal Sensor DTS Thermal Profile Definition 5.5 Processor TemperatureThermal Margin Slope Frequency Control 5.6 Adaptive Thermal MonitorImmediate Transition to Combined TM1 and TM2 Clock ModulationCritical Temperature Flag PROCHOT# Signal 5.8 Digital Thermal Sensor 5.7 THERMTRIP# Signal5.9 Intel Turbo Boost Technology Thermal Considerations 5.9.1 Intel Turbo Boost Technology Power Control and Reporting5.8.1 Digital Thermal Sensor Accuracy Taccuracy Intel Turbo Boost Technology 2.0 Package Power Control Settings 5.9.2 Package Power Control5.9.3 Turbo Time Parameter Figure 22. Package Power Control6.1 System Memory Interface Signals 6.0 Signal DescriptionSignal Description Buffer Types Memory Channel A SignalsSignal Description-Processor Memory Channel B SignalsMemory Reference and Compensation Signals 6.2 Memory Reference and Compensation SignalsDDR3/DDR3L Reference Voltage This signal is used as System Memory Impedance CompensationReset and Miscellaneous Signals 6.3 Reset and Miscellaneous SignalsCFG3 MSR Privacy Bit Feature CFG65 PCI Express* Bifurcation6.5 Display Interface Signals 6.4 PCI Express*-Based Interface SignalsPCI Express* Graphics Interface Signals Display Interface Signals6.8 Testability Signals 6.7 Phase Locked Loop PLL SignalsPhase Locked Loop PLL Signals Testability Signals6.10 Power Sequencing Signals 6.9 Error and Thermal Protection SignalsError and Thermal Protection Signals Power Sequencing Signals6.12 Sense Signals 6.11 Processor Power Signals6.13 Ground and Non-Critical to Function NCTF Signals Processor Power Signals7.2 Power and Ground Lands 7.0 Electrical Specifications7.1 Integrated Voltage Regulator 7.3 VCC Voltage Identification VIDElectrical Specifications-Processor Table 45. Voltage Regulator VR 12.5 Voltage Identificationcontinued Processor-Electrical Specificationscontinued continued Electrical Specifications-Processorcontinued continued 7.5 Signal Groups 7.4 Reserved or Unused SignalsSignal Groups DDR3 / DDR3L Reference Voltage Signals DDR3 / DDR3L Data SignalsPower / Ground / Other DDR3 / DDR3L Compensation7.7 DC Specifications 7.6 Test Access Port TAP ConnectionPCI Express* Graphics Digital Media Interface DMI7.8 Voltage and Current Specifications Electrical Specifications-Processor VCCIOOUT, VCOMPOUT, and VCCIOTERM DDR3 / DDR3L Signal Group DC SpecificationsDigital Display Interface Group DC Specifications CMOS Signal Group DC Specifications embedded DisplayPort* eDP* Group DC SpecificationsGTL Signal Group and Open Drain Signal Group DC Specifications PCI Express* DC Specifications 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsFigure 23. Input Device Hysteresis 7.8.2 Input Device Hysteresis8.2 Package Loading Specifications 8.0 Package Mechanical SpecificationsFigure 24. Processor Package Assembly Sketch 8.1 Processor Component Keep-Out Zone8.5 Processor Mass Specification 8.4 Package Insertion SpecificationsProcessor Loading Specifications 8.3 Package Handling Guidelines8.8 Processor Land Coordinates 8.7 Processor MarkingsProcessor Materials Figure 25. Processor Top-Side MarkingsProcessor Storage Specifications 8.9 Processor Storage SpecificationsFigure 26. Processor Package Land Coordinates TIMEsustained storage RHsustained storageProcessor Ball List by Signal Name 9.0 Processor Ball and Signal InformationProcessor Ball and Signal Information-Processor Processor-Processor Ball and Signal Information Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name AU20 Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #
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BX80633I74960X, BX80646I34130, BX80646I54430, BX80646I74770K, BX80646I74770 specifications

The Intel CM8063701159502, or BX80637I53470, is a powerful CPU designed for modern computing needs. This processor belongs to Intel's 4th generation of Core i5 processors, commonly known as "Haswell". It showcases Intel's commitment to enhancing performance, increasing energy efficiency, and delivering an enriching user experience.

One of the main features of the Intel Core i5-3470 is its quad-core architecture. This allows the processor to handle multiple threads simultaneously, making it adept at multitasking and running demanding applications efficiently. With a base clock speed of 3.2 GHz, it can boost up to 3.6 GHz using Intel’s Turbo Boost technology, providing additional power when needed for intensive tasks like gaming or video editing.

The Intel i5-3470 features Intel's HD Graphics 2500, which offers decent graphics performance for everyday tasks and casual gaming. This integrated graphics solution is capable of delivering high-definition visuals and supports DirectX 11, making it suitable for lightweight gaming experiences without the need for an additional dedicated graphics card.

Another standout characteristic of the BX80637I53470 is its support for Intel Smart Cache, which is an advanced caching technology. It provides a shared cache pool that enhances performance by reducing the time it takes to access frequently used data. This feature, coupled with Intel's instruction set architecture, allows for improved processing agility and efficiency across applications.

The processor is built on a 22nm manufacturing process, which results in reduced power consumption and heat generation compared to its predecessors. It has a thermal design power (TDP) of 77 watts, making it energy efficient while still delivering robust performance. Additionally, the Core i5-3470 supports DDR3 memory, with speeds up to 1600 MHz, enabling quick data retrieval and improved system responsiveness.

Security is another important aspect of the Intel i5-3470, featuring Intel Secure Key and Intel AES New Instructions (AES-NI), which protect sensitive data and enhance encryption performance.

In conclusion, the Intel CM8063701159502, or BX80637I53470, encapsulates modern computing technology with its powerful quad-core performance, integrated graphics, energy efficiency, and robust security features, making it a versatile choice for a wide range of computing tasks. Whether users are engaging in casual gaming, productivity tasks, or multimedia consumption, this processor demonstrates a solid balance of performance and efficiency, providing an excellent computing experience overall.
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