Intel BX80646I74770K, CM8064601466200, CM8064601466003 manual Signal Name, Ball #, continued

Page 113
Manual background

Processor Ball and Signal Information—Processor

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Signal Name

Ball #

 

Signal Name

Ball #

 

Signal Name

Ball #

 

 

 

 

 

 

 

 

 

 

SA_DQ53

AL3

 

SA_ECC_CB3

AV31

 

SB_CKE1

AY29

 

 

 

 

 

 

 

 

 

 

SA_DQ54

AJ2

 

SA_ECC_CB4

AT33

 

SB_CKE2

AU28

 

 

 

 

 

 

 

 

 

 

SA_DQ55

AJ1

 

SA_ECC_CB5

AU33

 

SB_CKE3

AU29

 

 

 

 

 

 

 

 

 

 

SA_DQ56

AG1

 

SA_ECC_CB6

AT31

 

SB_CKN0

AM21

 

 

 

 

 

 

 

 

 

 

SA_DQ57

AG4

 

SA_ECC_CB7

AW31

 

SB_CKN1

AP21

 

 

 

 

 

 

 

 

 

 

SA_DQ58

AE3

 

SA_MA0

AU13

 

SB_CKN2

AN21

 

 

 

 

 

 

 

 

 

 

SA_DQ59

AE4

 

SA_MA1

AV16

 

SB_CKN3

AP20

 

 

 

 

 

 

 

 

 

 

SA_DQ6

AF37

 

SA_MA10

AW11

 

SB_CS#0

AP17

 

 

 

 

 

 

 

 

 

 

SA_DQ60

AG2

 

SA_MA11

AV19

 

SB_CS#1

AN15

 

 

 

 

 

 

 

 

 

 

SA_DQ61

AG3

 

SA_MA12

AU19

 

SB_CS#2

AN17

 

 

 

 

 

 

 

 

 

 

SA_DQ62

AE2

 

SA_MA13

AY10

 

SB_CS#3

AL15

 

 

 

 

 

 

 

 

 

 

SA_DQ63

AE1

 

SA_MA14

AT20

 

SB_DIMM_VREF

AB40

 

 

 

 

 

 

 

DQ

 

 

SA_DQ7

AF40

 

SA_MA15

AU21

 

 

 

 

 

 

 

 

 

SB_DQ0

AE34

 

 

 

 

 

 

 

 

SA_DQ8

AH40

 

SA_MA2

AU16

 

 

 

 

 

 

 

 

SB_DQ1

AE35

 

 

 

 

 

 

 

 

SA_DQ9

AH39

 

SA_MA3

AW17

 

 

 

 

 

 

 

 

SB_DQ10

AK31

 

 

 

 

 

 

 

 

SA_DQSN0

AE38

 

SA_MA4

AU17

 

 

 

 

 

 

 

 

SB_DQ11

AL31

 

 

 

 

 

 

 

 

SA_DQSN1

AJ38

 

SA_MA5

AW18

 

 

 

 

 

 

 

 

SB_DQ12

AK34

 

 

 

 

 

 

 

 

SA_DQSN2

AN38

 

SA_MA6

AV17

 

 

 

 

 

 

 

 

SB_DQ13

AK35

 

 

 

 

 

 

 

 

SA_DQSN3

AU36

 

SA_MA7

AT18

 

 

 

 

 

 

 

 

SB_DQ14

AK32

 

 

 

 

 

 

 

 

SA_DQSN4

AW5

 

SA_MA8

AU18

 

 

 

 

 

 

 

 

SB_DQ15

AL32

 

 

 

 

 

 

 

 

SA_DQSN5

AP2

 

SA_MA9

AT19

 

 

 

 

 

 

 

 

SB_DQ16

AN34

 

 

 

 

 

 

 

 

SA_DQSN6

AK2

 

SA_ODT0

AW10

 

 

 

 

 

 

 

 

SB_DQ17

AP34

 

 

 

 

 

 

 

 

SA_DQSN7

AF2

 

SA_ODT1

AY8

 

 

 

 

 

 

 

 

SB_DQ18

AN31

 

 

 

 

 

 

 

 

SA_DQSN8

AU32

 

SA_ODT2

AW9

 

 

 

 

 

 

 

 

SB_DQ19

AP31

 

 

 

 

 

 

 

 

SA_DQSP0

AE39

 

SA_ODT3

AU8

 

 

 

 

 

 

 

 

SB_DQ2

AG35

 

 

 

 

 

 

 

 

SA_DQSP1

AJ39

 

SA_RAS#

AU12

 

 

 

 

 

 

 

 

SB_DQ20

AN35

 

 

 

 

 

 

 

 

SA_DQSP2

AN39

 

SA_WE#

AU11

 

 

 

 

 

 

 

 

SB_DQ21

AP35

 

 

 

 

 

 

 

 

SA_DQSP3

AV36

 

SB_BS0

AK17

 

 

 

 

 

 

 

 

SB_DQ22

AN32

 

 

 

 

 

 

 

 

SA_DQSP4

AV5

 

SB_BS1

AL18

 

 

 

 

 

 

 

 

SB_DQ23

AP32

 

 

 

 

 

 

 

 

SA_DQSP5

AP3

 

SB_BS2

AW28

 

 

 

 

 

 

 

 

SB_DQ24

AM29

 

 

 

 

 

 

 

 

SA_DQSP6

AK3

 

SB_CAS#

AP16

 

 

 

 

 

 

 

 

SB_DQ25

AM28

 

 

 

 

 

 

 

 

SA_DQSP7

AF3

 

SB_CK0

AM20

 

 

 

 

 

 

 

 

SB_DQ26

AR29

 

 

 

 

 

 

 

 

SA_DQSP8

AV32

 

SB_CK1

AP22

 

 

 

 

 

 

 

 

SB_DQ27

AR28

 

 

 

 

 

 

 

 

SA_ECC_CB0

AW33

 

SB_CK2

AN20

 

 

 

 

 

 

 

 

SB_DQ28

AL29

 

 

 

 

 

 

 

 

SA_ECC_CB1

AV33

 

SB_CK3

AP19

 

 

 

 

 

 

 

 

SB_DQ29

AL28

 

 

 

 

 

 

 

 

SA_ECC_CB2

AU31

 

SB_CKE0

AW29

 

 

 

 

 

 

 

 

 

continued...

 

 

 

 

 

 

 

 

 

 

continued...

 

 

continued...

 

 

 

Desktop 4th Generation Intel® CoreProcessor Family, Desktop Intel® Pentium® Processor Family, and Desktop Intel® Celeron® Processor Family

December 2013

Datasheet – Volume 1 of 2

Order No.: 328897-004

113

Image 113
Contents December Datasheet - Volume 1 ofDatasheet - Volume 1 of 2 4.0 Power Management ContentsRevision History 1.0 Introduction5.0 Thermal Management 6.0 Signal DescriptionProcessor-Contents 8.0 Package Mechanical Specifications 7.0 Electrical Specifications9.0 Processor Ball and Signal Information 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsFigures Tables-Processor TablesProcessor-Tables Revision History-Processor Revision HistoryProcessor-Introduction 1.0 Introduction1.1 Supported Technologies Figure 1. Platform Block DiagramProcessor Platform Controller Hub PCH1.2 Interfaces 1.3 Power Management SupportProcessor Core System1.5 Package Support 1.4 Thermal Management Support1.6 Terminology Terminologywith Virtual Machine Monitor software, enables multiple, robust independent software Term Related Documents 1.7 Related DocumentsDocument Number / Locationhttp specificationsproducts/processor manuals/index.htm2.1 System Memory Interface 2.0 InterfacesProcessor DIMM Support by Product Supported UDIMM Module Configurations2.1.1 System Memory Technology Supported DDR3 / DDR3L System Memory Timing Support Supported SO-DIMM Module Configurations AIO Only2.1.2 System Memory Timing Support Single-Channel Mode 2.1.3 System Memory Organization ModesDual-Channel Mode - Intel Flex Memory Technology Mode Figure 2. Intel Flex Memory Technology OperationsJust-in-Time Command Scheduling 2.1.3.2 Intel Fast Memory Access Intel FMA Technology EnhancementsCommand Overlap 2.1.3.1 System Memory Frequency2.2 PCI Express* Interface Table 7. PCI Express* Supported Configurations in Desktop Products2.2.1 PCI Express* Support 2.1.3.3 Data Scrambling2.2.2 PCI Express* Architecture 2.2.3 PCI Express* Configuration MechanismPCI Express* Lanes Connection PCI Express* Related Register Structures in the ProcessorPCI Express* Port Figure 4. PCI Express* Typical Operation 16 Lanes Mapping 2.3 Direct Media Interface DMI1 X 4 Controller 1 X 8 ControllerDMI Link Down DMI Error Flow2.5 Processor Graphics Controller GT 2.4 Processor Graphics2.5.1 3D and Video Engines for Graphics Processing Figure 5. Processor Graphics Controller Unit Block Diagram3D Pipeline 3D Engine Execution UnitsGeometry Shader GS Stage Vertex Shader VS StageClip Stage Strips and Fans SF StageLogical 128-Bit Fixed BLT and 256 Fill Engine 2.6 Digital Display Interface DDI2.5.2 Multi Graphics Controllers Multi-Monitor Support Figure 6. Processor Display Architecture Sink Device Source DeviceDisplayPort Figure 7. DisplayPort* OverviewHDMI Sink HDMI SourceFigure 8. HDMI* Overview HDMI Txembedded DisplayPort Multiple Display ConfigurationsIntegrated Audio Table 8. Processor Supported Audio Formats over HDMI*and DisplayPortHigh-bandwidth Digital Content Protection HDCP Valid Three Display Configurations through the Processor2.8.1 PECI Bus Architecture 2.7 Intel Flexible Display Interface Intel FDI2.8 Platform Environmental Control Interface PECI PECI Figure 9. PECI Host-Clients Connection ExampleHost / Originator PECI Client3.1 Intel Virtualization Technology Intel VT 3.0 TechnologiesIntel VT-x Objectives ing=VTIntel VT-x Features Intel VT-d Objectives Figure 10. Device to Domain Mapping Structures Intel VT-d Features3.2 Intel Trusted Execution Technology Intel TXT 3.3 Intel Hyper-Threading Technology Intel HT Technology Intel Turbo Boost Technology 2.0 Frequency 3.4 Intel Turbo Boost Technology3.5 Intel Advanced Vector Extensions 2.0 Intel AVX2 Intel Secure Key 3.6 Intel Advanced Encryption Standard New Instructions Intel AES-NIPCLMULQDQ Instruction 3.8 Intel 64 Architecture x2APIC 3.11 Supervisor Mode Execution Protection SMEP 3.9 Power Aware Interrupt Routing PAIR3.10 Execute Disable Bit Figure 11. Processor Power States 4.0 Power ManagementNote Power states availability may vary between the different SKUs S0 - Processor Fully powered on full on mode / connected standby modeSystem States 4.1 Advanced Configuration and Power Interface ACPI States SupportedProcessor Core / Package State Support Integrated Memory Controller States4.2.1 Enhanced Intel SpeedStep Technology Key Features 4.2 Processor Core Power ManagementDirect Media Interface DMI States G, S, and C Interface State CombinationsFigure 12. Idle Power Management Breakdown of the Processor Cores 4.2.2 Low-Power Idle StatesThread Core 0 StateFigure 13. Thread and Core C-State Entry and Exit 4.2.3 Requesting Low-Power Idle StatesCoordination of Thread Power States at the Core Level Core C0 State 4.2.4 Core C-State RulesCore C1/C1E State Core C3 StateCore C6 State 4.2.5 Package C-StatesCore C7 State C-State Auto-DemotionCoordination of Core Power States at the Package Level Package C1/C1E State Figure 14. Package C-State Entry and ExitPackage C0 State Package C3 State Package C2 StatePackage C6 State Package C7 StateDeepest Package C-State Available 4.2.6 Package C-States and Display Resolutions4.3.1 Disabling Unused System Memory Outputs 4.3 Integrated Memory Controller IMC Power ManagementNo power-down CKE disable 4.3.2 DRAM Power Management and Initialization4.3.2.2 Conditional Self-Refresh 4.3.2.3 Dynamic Power-Down4.3.2.1 Initialization Role of CKE 4.5 Direct Media Interface DMI Power Management 4.4 PCI Express* Power Management4.3.3 DRAM Running Average Power Limitation RAPL 4.3.4 DDR Electrical Power Gating EPG4.6.1 Intel Rapid Memory Power Management Intel RMPM 4.6 Graphics Power Management4.6.2 Graphics Render C-State 4.6.3 Intel Graphics Dynamic FrequencyThermal Management-Processor 5.0 Thermal Management5.1 Desktop Processor Thermal Profiles Desktop Processor Thermal SpecificationsProcessor-Thermal Management ProfileTCASE = 0.33 * Power + 5.1.1 Processor PCG 2013D Thermal ProfileTTV Power W Case5.1.2 Processor PCG 2013C Thermal Profile 5.1.3 Processor PCG 2013B Thermal Profile 5.1.4 Processor PCG 2013A Thermal Profile 5.3 Fan Speed Control Scheme with Digital Thermal Sensor DTS 5.2 Thermal MetrologyMeasure TCASE at the geometric center of the package 37.5 37.5ΨCA = TCASE-MAX - TAMBIENT-TARGET / TDP Figure 20. Digital Thermal Sensor DTS 1.1 Definition Points5.4 Fan Speed Control Scheme with Digital Thermal Sensor DTS Thermal Margin Slope 5.5 Processor TemperatureFigure 21. Digital Thermal Sensor DTS Thermal Profile Definition Frequency Control 5.6 Adaptive Thermal MonitorCritical Temperature Flag Clock ModulationImmediate Transition to Combined TM1 and TM2 PROCHOT# Signal 5.8 Digital Thermal Sensor 5.7 THERMTRIP# Signal5.8.1 Digital Thermal Sensor Accuracy Taccuracy 5.9.1 Intel Turbo Boost Technology Power Control and Reporting5.9 Intel Turbo Boost Technology Thermal Considerations Intel Turbo Boost Technology 2.0 Package Power Control Settings 5.9.2 Package Power Control5.9.3 Turbo Time Parameter Figure 22. Package Power Control6.1 System Memory Interface Signals 6.0 Signal DescriptionSignal Description Buffer Types Memory Channel A SignalsSignal Description-Processor Memory Channel B SignalsMemory Reference and Compensation Signals 6.2 Memory Reference and Compensation SignalsDDR3/DDR3L Reference Voltage This signal is used as System Memory Impedance CompensationReset and Miscellaneous Signals 6.3 Reset and Miscellaneous SignalsCFG3 MSR Privacy Bit Feature CFG65 PCI Express* Bifurcation6.5 Display Interface Signals 6.4 PCI Express*-Based Interface SignalsPCI Express* Graphics Interface Signals Display Interface Signals6.8 Testability Signals 6.7 Phase Locked Loop PLL SignalsPhase Locked Loop PLL Signals Testability Signals6.10 Power Sequencing Signals 6.9 Error and Thermal Protection SignalsError and Thermal Protection Signals Power Sequencing Signals6.12 Sense Signals 6.11 Processor Power Signals6.13 Ground and Non-Critical to Function NCTF Signals Processor Power Signals7.2 Power and Ground Lands 7.0 Electrical Specifications7.1 Integrated Voltage Regulator 7.3 VCC Voltage Identification VIDElectrical Specifications-Processor Table 45. Voltage Regulator VR 12.5 Voltage Identificationcontinued Processor-Electrical Specificationscontinued continued Electrical Specifications-Processorcontinued continued Signal Groups 7.4 Reserved or Unused Signals7.5 Signal Groups DDR3 / DDR3L Reference Voltage Signals DDR3 / DDR3L Data SignalsPower / Ground / Other DDR3 / DDR3L Compensation7.7 DC Specifications 7.6 Test Access Port TAP ConnectionPCI Express* Graphics Digital Media Interface DMI7.8 Voltage and Current Specifications Electrical Specifications-Processor VCCIOOUT, VCOMPOUT, and VCCIOTERM DDR3 / DDR3L Signal Group DC SpecificationsDigital Display Interface Group DC Specifications GTL Signal Group and Open Drain Signal Group DC Specifications embedded DisplayPort* eDP* Group DC SpecificationsCMOS Signal Group DC Specifications PCI Express* DC Specifications 7.8.1 Platform Environment Control Interface PECI DC CharacteristicsFigure 23. Input Device Hysteresis 7.8.2 Input Device Hysteresis8.2 Package Loading Specifications 8.0 Package Mechanical SpecificationsFigure 24. Processor Package Assembly Sketch 8.1 Processor Component Keep-Out Zone8.5 Processor Mass Specification 8.4 Package Insertion SpecificationsProcessor Loading Specifications 8.3 Package Handling Guidelines8.8 Processor Land Coordinates 8.7 Processor MarkingsProcessor Materials Figure 25. Processor Top-Side MarkingsFigure 26. Processor Package Land Coordinates 8.9 Processor Storage SpecificationsProcessor Storage Specifications TIMEsustained storage RHsustained storageProcessor Ball List by Signal Name 9.0 Processor Ball and Signal InformationProcessor Ball and Signal Information-Processor Processor-Processor Ball and Signal Information Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name AU20 Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #Signal Name Signal NameSignal Name Ball #
Related manuals
Manual 1 pages 13.56 Kb Manual 2 pages 53.21 Kb Manual 1 pages 5.02 Kb

BX80633I74960X, BX80646I34130, BX80646I54430, BX80646I74770K, BX80646I74770 specifications

The Intel CM8063701159502, or BX80637I53470, is a powerful CPU designed for modern computing needs. This processor belongs to Intel's 4th generation of Core i5 processors, commonly known as "Haswell". It showcases Intel's commitment to enhancing performance, increasing energy efficiency, and delivering an enriching user experience.

One of the main features of the Intel Core i5-3470 is its quad-core architecture. This allows the processor to handle multiple threads simultaneously, making it adept at multitasking and running demanding applications efficiently. With a base clock speed of 3.2 GHz, it can boost up to 3.6 GHz using Intel’s Turbo Boost technology, providing additional power when needed for intensive tasks like gaming or video editing.

The Intel i5-3470 features Intel's HD Graphics 2500, which offers decent graphics performance for everyday tasks and casual gaming. This integrated graphics solution is capable of delivering high-definition visuals and supports DirectX 11, making it suitable for lightweight gaming experiences without the need for an additional dedicated graphics card.

Another standout characteristic of the BX80637I53470 is its support for Intel Smart Cache, which is an advanced caching technology. It provides a shared cache pool that enhances performance by reducing the time it takes to access frequently used data. This feature, coupled with Intel's instruction set architecture, allows for improved processing agility and efficiency across applications.

The processor is built on a 22nm manufacturing process, which results in reduced power consumption and heat generation compared to its predecessors. It has a thermal design power (TDP) of 77 watts, making it energy efficient while still delivering robust performance. Additionally, the Core i5-3470 supports DDR3 memory, with speeds up to 1600 MHz, enabling quick data retrieval and improved system responsiveness.

Security is another important aspect of the Intel i5-3470, featuring Intel Secure Key and Intel AES New Instructions (AES-NI), which protect sensitive data and enhance encryption performance.

In conclusion, the Intel CM8063701159502, or BX80637I53470, encapsulates modern computing technology with its powerful quad-core performance, integrated graphics, energy efficiency, and robust security features, making it a versatile choice for a wide range of computing tasks. Whether users are engaging in casual gaming, productivity tasks, or multimedia consumption, this processor demonstrates a solid balance of performance and efficiency, providing an excellent computing experience overall.