Intel 320028-001 manual Mechanical Specifications, Package Mechanical Requirements

Page 11

Core™ 2 Duo Mobile Processors—Mechanical Specifications

4.0Mechanical Specifications

4.1Package Mechanical Requirements

4.1.1Die Pressure/Load Upper Limit

From a die mechanical integrity standpoint, the maximum allowable normal die load is the lesser of 15 lbs or 100 psi. Considering the 15 lbs load limit and the nominal die area of 1.45 cm2 (0.22 in.2), this equates to a die pressure of 66.7 psi (below 100 psi specification). Considering the maximum pressure specification, the die load at this pressure would be 22.4 lbs, exceeding the 15 lbs. load limit. Thus, the heatsink clamping mechanism (spring loaded fasteners, spring clips, etc.) should not exceed 15 lbs.

4.1.2Die Pressure/Load Lower Limit

From a TIM performance standpoint, a minimum die pressure is required to ensure consistent and minimal TIM thermal resistance. This lower value is a function of the TIM used. For the phase-change TIM specified for thermal solutions mentioned later, die pressure should not be lower than approximately 138 kPa (20 psi). This will keep TIM resistance better than approximately

0.30 oC-cm2/W.

4.2Package Keep Out Zones Requirements

The heatsink must not touch the package in the areas shown in Figure 2 and Figure 4. The heatsink should include a means to prevent the heatsink from forming an electrical short with the capacitors placed on the top side of the package. The reference thermal solutions include z-stops machined into the base of the heatsink. The z-stops prevent the heatsink from inadvertently tilting when installed. Other methods are suitable including using electrically insulated gasket material at the base of the heatsink.

4.3Board Level Keep Out Zone Requirements

A general description of the keep-out zones and mounting hole pattern for the reference thermal solutions are shown in Figure 2 and Figure 3. Detailed drawings for the PCB keep out zones are in Appendix B.

Components placed between the underside of the heatsink and motherboard cannot exceed 4.75 mm in height when using heatsinks that extend beyond the socket envelope shown in Figure 2 for the micro-FCPGA package.

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

 

TDG

June 2008

11

Order Number: 320028-001

Page 10 Page 12
Image 11
Page 10 Page 12
Contents June Thermal Design GuideTDG Contents Tables FiguresFirst Public release Revision HistoryDesign Flow IntroductionDefinition of Terms Sheet 1 Definition of TermsDefinition of Terms Sheet 2 Reference DocumentsThermal Design Tool Availability Package Information Thermal Specifications for the Intel Core2 Duo processor Thermal SpecificationsThermal Design Power Maximum Allowed Component TemperatureBoard Level Keep Out Zone Requirements Mechanical SpecificationsPackage Mechanical Requirements Package Keep Out Zones RequirementsPrimary Side Keep Out Zone Requirements- Micro-FCPGA Primary Side Keep Out Zone Requirements- Micro-FCBGA Secondary Side Keep Out Zone Requirements Thermal Solution Characterization Thermal Solution RequirementsEquation 4. Required Performance of the Heatsink Equation 3. Maximum Allowable ResistanceTDP Required Heatsink Thermal Performance Ψ JAAtca Reference Thermal Solution Reference Thermal Solutions1U+ Reference Heatsink Keep Out Zone RequirementsThermal Performance Keep Out Zone Requirements Compact PCI Reference Heatsink Heatsink Thermal Performance vs. Volumetric Airflow RateThermal Interface Material TIM Heatsink Fastener AssemblyHeatsink Orientation Relative to Airflow Direction Heatsink OrientationLocal Ambient Temperature Measurement Guidelines Die Temperature MeasurementsPower Simulation Software Additional Thermal FeaturesActive Heatsink Measurements Measuring TLA with an Active Heatsink Measuring TLA with a Passive Heatsink Reliability Requirements Reliability GuidelinesReference Heatsink Appendix a Thermal Solution Component SuppliersMechanical Drawings Appendix B Mechanical DrawingsCore 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors AdvancedTCA* Reference Heatsink Assembly AdvancedTCA* Reference Heatsink Core 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors CompactPCI* Reference Heatsink Assembly CompactPCI* Reference Heatsink Reference Heatsink PCB Keep Out Requirements Sheet 1 Reference Heatsink PCB Keep Out Requirements Sheet 2 Reference Heatsink Assembly Reference Heatsink

320028-001 specifications

The Intel 320028-001 is a robust processor designed to meet the demands of both consumers and professionals. Built on Intel's advanced microarchitecture, this model showcases a blend of high performance, energy efficiency, and cutting-edge technology.

One of the standout features of the Intel 320028-001 is its impressive clock speed, which ensures rapid data processing capabilities. This processor is designed with multiple cores, allowing it to handle several tasks simultaneously without compromising performance. This multi-core architecture is particularly beneficial for applications that require heavy multitasking or resource-intensive activities such as gaming, video editing, and 3D rendering.

In terms of technology, the Intel 320028-001 leverages Intel’s Turbo Boost technology, which dynamically increases the processor's clock speed to optimize performance based on current workload demands. This results in an efficient balance between performance and power consumption, providing users with the necessary speed when needed while conserving energy during lighter tasks.

Another key characteristic of the Intel 320028-001 is its compatibility with Intel Hyper-Threading technology. This allows each core to handle two threads simultaneously, resulting in improved multitasking capabilities and enhanced performance for threaded applications. This feature is particularly advantageous for applications that can utilize parallel processing, significantly enhancing overall system responsiveness.

Additionally, the Intel 320028-001 utilizes Intel’s Smart Cache technology. This shared cache allows for quicker data access and efficient memory usage, further optimizing execution speeds and minimizing latency. The processor is also designed to work seamlessly with the latest in memory technologies, supporting DDR4 memory for increased bandwidth and improved overall system performance.

Security features in the Intel 320028-001 include Intel Software Guard Extensions (SGX), which provide hardware-based safeguards for sensitive information, an essential component for business applications and personal data protection.

Overall, the Intel 320028-001 stands out with a combination of high-performance specs, advanced features, and energy-efficient operation, making it an excellent choice for a wide range of computing needs. Whether for gaming, professional applications, or daily use, this processor offers the reliability and performance that users expect from Intel.
Top Page Image Contents