Intel 320028-001 manual Keep Out Zone Requirements

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Reference Thermal Solutions—Core™ 2 Duo Mobile Processors

Figure 8. 1U Reference Heatsink Assembly

6.4.1Keep Out Zone Requirements

The keep out zone requirements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawings”. Because it extends beyond the footprint of the device, it is critical for board designers to allocate space for the heatsink.

6.4.2Thermal Performance

The 1U reference heatsink employs a thick copper (C1100) base with aluminum (Al 1050) stamped fins, soldered to the base. The heatsink has been tested at flow rates from 10 CFM to 25 CFM. For a 40 °C external ambient and 35 W TDP, the heatsink is expected to meet the thermal performance needed when the air flow rate is greater than 10 CFM. If the external ambient is 55 °C, this heatsink will be suitable if the air flow rate is approximately 12 CFM or greater.

	Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008	TDG
Order Number: 320028-001	20

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Contents Thermal Design Guide JuneTDG Contents Figures TablesRevision History First Public releaseIntroduction Design FlowDefinition of Terms Definition of Terms Sheet 1Definition of Terms Sheet 2 Reference DocumentsThermal Design Tool Availability Package Information Thermal Specifications Thermal Design PowerMaximum Allowed Component Temperature Thermal Specifications for the Intel Core2 Duo processorMechanical Specifications Package Mechanical RequirementsPackage Keep Out Zones Requirements Board Level Keep Out Zone RequirementsPrimary Side Keep Out Zone Requirements- Micro-FCPGA Primary Side Keep Out Zone Requirements- Micro-FCBGA Secondary Side Keep Out Zone Requirements Thermal Solution Requirements Thermal Solution CharacterizationEquation 3. Maximum Allowable Resistance Equation 4. Required Performance of the HeatsinkRequired Heatsink Thermal Performance Ψ JA TDPReference Thermal Solutions Atca Reference Thermal Solution1U+ Reference Heatsink Keep Out Zone RequirementsThermal Performance Keep Out Zone Requirements Heatsink Thermal Performance vs. Volumetric Airflow Rate Compact PCI Reference HeatsinkHeatsink Fastener Assembly Thermal Interface Material TIMHeatsink Orientation Heatsink Orientation Relative to Airflow DirectionDie Temperature Measurements Power Simulation SoftwareAdditional Thermal Features Local Ambient Temperature Measurement GuidelinesActive Heatsink Measurements Measuring TLA with an Active Heatsink Measuring TLA with a Passive Heatsink Reliability Guidelines Reliability RequirementsAppendix a Thermal Solution Component Suppliers Reference HeatsinkAppendix B Mechanical Drawings Mechanical DrawingsCore 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors AdvancedTCA* Reference Heatsink Assembly AdvancedTCA* Reference Heatsink Core 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors CompactPCI* Reference Heatsink Assembly CompactPCI* Reference Heatsink Reference Heatsink PCB Keep Out Requirements Sheet 1 Reference Heatsink PCB Keep Out Requirements Sheet 2 Reference Heatsink Assembly Reference Heatsink

320028-001 specifications

The Intel 320028-001 is a robust processor designed to meet the demands of both consumers and professionals. Built on Intel's advanced microarchitecture, this model showcases a blend of high performance, energy efficiency, and cutting-edge technology.

One of the standout features of the Intel 320028-001 is its impressive clock speed, which ensures rapid data processing capabilities. This processor is designed with multiple cores, allowing it to handle several tasks simultaneously without compromising performance. This multi-core architecture is particularly beneficial for applications that require heavy multitasking or resource-intensive activities such as gaming, video editing, and 3D rendering.

In terms of technology, the Intel 320028-001 leverages Intel’s Turbo Boost technology, which dynamically increases the processor's clock speed to optimize performance based on current workload demands. This results in an efficient balance between performance and power consumption, providing users with the necessary speed when needed while conserving energy during lighter tasks.

Another key characteristic of the Intel 320028-001 is its compatibility with Intel Hyper-Threading technology. This allows each core to handle two threads simultaneously, resulting in improved multitasking capabilities and enhanced performance for threaded applications. This feature is particularly advantageous for applications that can utilize parallel processing, significantly enhancing overall system responsiveness.

Additionally, the Intel 320028-001 utilizes Intel’s Smart Cache technology. This shared cache allows for quicker data access and efficient memory usage, further optimizing execution speeds and minimizing latency. The processor is also designed to work seamlessly with the latest in memory technologies, supporting DDR4 memory for increased bandwidth and improved overall system performance.

Security features in the Intel 320028-001 include Intel Software Guard Extensions (SGX), which provide hardware-based safeguards for sensitive information, an essential component for business applications and personal data protection.

Overall, the Intel 320028-001 stands out with a combination of high-performance specs, advanced features, and energy-efficient operation, making it an excellent choice for a wide range of computing needs. Whether for gaming, professional applications, or daily use, this processor offers the reliability and performance that users expect from Intel.