Intel 320028-001 manual Thermal Metrology, Die Temperature Measurements, Power Simulation Software

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Thermal Metrology—Core™ 2 Duo Mobile Processors

7.0Thermal Metrology

The system designer must make temperature measurements to accurately determine the performance of the thermal solution. Validation of the processor’s thermal solution should be done using a thermal test vehicle (TTV). The TTV allows for an accurate junction temperature measurement as well as input power control. For more information, contact your Intel field sales representative.

In addition, the processor’s heatsink should be verified in a system environment. Intel has established guidelines for techniques to measure the component temperature. Section 7.1, “Die Temperature Measurements” provides guidelines on how to accurately measure the component temperature. Section 7.2, “Power Simulation Software” contains information on running an application program that will emulate anticipated maximum thermal design power.

7.1Die Temperature Measurements

The component TJUNCTION must be maintained at or below the maximum temperature specification as noted in Section 3.2, “Maximum Allowed Component Temperature” . The best way to measure die temperature is to use the Digital Thermal Sensor as described in the processor’s datasheet. Refer to the processor datasheet for more information on the DTS.

The legacy on-board thermal diode is not recommended for performing heatsink validation. The thermal diode is suitable for long term trending data, but is not a reliable indicator of the processor’s temperature.

7.2Power Simulation Software

The power simulation software is a utility designed to dissipate the thermal design power on a processor. To assess the thermal performance of the processor thermal solution under “worst-case realistic application” conditions, Intel is developing a software utility that operates the processor at near worst-case power dissipation.

The power simulation software should only be used to test customer thermal solutions at or near the thermal design power. For power supply current, please refer to each component’s datasheet for the ICC (Max Power Supply Current) specification. For information on how to obtain the maximum power program, contact your Intel field sales representative.

7.3Additional Thermal Features

The Intel Core 2 Duo processor supports other thermal features including the Intel® Thermal Monitor, PROCHOT#, FORCEPR#, and THERMTRIP# signal pins. Details for using these features are contained in the processor datasheet.

7.4Local Ambient Temperature Measurement Guidelines

The local ambient temperature (TLA) is the temperature of the ambient air surrounding the processor. For a passive heatsink, TA is defined as the heatsink approach air temperature; for an actively cooled heatsink, it is the temperature of inlet air to the active cooling fan.

 

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008

TDG

Order Number: 320028-001

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Contents Thermal Design Guide JuneTDG Contents Figures TablesRevision History First Public releaseIntroduction Design FlowDefinition of Terms Definition of Terms Sheet 1Reference Documents Thermal Design Tool AvailabilityDefinition of Terms Sheet 2 Package Information Thermal Specifications Thermal Design PowerMaximum Allowed Component Temperature Thermal Specifications for the Intel Core2 Duo processorMechanical Specifications Package Mechanical RequirementsPackage Keep Out Zones Requirements Board Level Keep Out Zone RequirementsPrimary Side Keep Out Zone Requirements- Micro-FCPGA Primary Side Keep Out Zone Requirements- Micro-FCBGA Secondary Side Keep Out Zone Requirements Thermal Solution Requirements Thermal Solution CharacterizationEquation 3. Maximum Allowable Resistance Equation 4. Required Performance of the HeatsinkRequired Heatsink Thermal Performance Ψ JA TDPReference Thermal Solutions Atca Reference Thermal SolutionKeep Out Zone Requirements Thermal Performance1U+ Reference Heatsink Keep Out Zone Requirements Heatsink Thermal Performance vs. Volumetric Airflow Rate Compact PCI Reference HeatsinkHeatsink Fastener Assembly Thermal Interface Material TIMHeatsink Orientation Heatsink Orientation Relative to Airflow DirectionDie Temperature Measurements Power Simulation SoftwareAdditional Thermal Features Local Ambient Temperature Measurement GuidelinesActive Heatsink Measurements Measuring TLA with an Active Heatsink Measuring TLA with a Passive Heatsink Reliability Guidelines Reliability RequirementsAppendix a Thermal Solution Component Suppliers Reference HeatsinkAppendix B Mechanical Drawings Mechanical DrawingsCore 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors AdvancedTCA* Reference Heatsink Assembly AdvancedTCA* Reference Heatsink Core 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors CompactPCI* Reference Heatsink Assembly CompactPCI* Reference Heatsink Reference Heatsink PCB Keep Out Requirements Sheet 1 Reference Heatsink PCB Keep Out Requirements Sheet 2 Reference Heatsink Assembly Reference Heatsink

320028-001 specifications

The Intel 320028-001 is a robust processor designed to meet the demands of both consumers and professionals. Built on Intel's advanced microarchitecture, this model showcases a blend of high performance, energy efficiency, and cutting-edge technology.

One of the standout features of the Intel 320028-001 is its impressive clock speed, which ensures rapid data processing capabilities. This processor is designed with multiple cores, allowing it to handle several tasks simultaneously without compromising performance. This multi-core architecture is particularly beneficial for applications that require heavy multitasking or resource-intensive activities such as gaming, video editing, and 3D rendering.

In terms of technology, the Intel 320028-001 leverages Intel’s Turbo Boost technology, which dynamically increases the processor's clock speed to optimize performance based on current workload demands. This results in an efficient balance between performance and power consumption, providing users with the necessary speed when needed while conserving energy during lighter tasks.

Another key characteristic of the Intel 320028-001 is its compatibility with Intel Hyper-Threading technology. This allows each core to handle two threads simultaneously, resulting in improved multitasking capabilities and enhanced performance for threaded applications. This feature is particularly advantageous for applications that can utilize parallel processing, significantly enhancing overall system responsiveness.

Additionally, the Intel 320028-001 utilizes Intel’s Smart Cache technology. This shared cache allows for quicker data access and efficient memory usage, further optimizing execution speeds and minimizing latency. The processor is also designed to work seamlessly with the latest in memory technologies, supporting DDR4 memory for increased bandwidth and improved overall system performance.

Security features in the Intel 320028-001 include Intel Software Guard Extensions (SGX), which provide hardware-based safeguards for sensitive information, an essential component for business applications and personal data protection.

Overall, the Intel 320028-001 stands out with a combination of high-performance specs, advanced features, and energy-efficient operation, making it an excellent choice for a wide range of computing needs. Whether for gaming, professional applications, or daily use, this processor offers the reliability and performance that users expect from Intel.
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