Intel 320028-001 manual Required Heatsink Thermal Performance Ψ JA, Tdp

Core™ 2 Duo Mobile Processors—Thermal Solution Requirements

It is evident from the above calculations that a reduction in the local ambient temperature can have a significant effect on the junction-to-ambient thermal resistance requirement. This effect can contribute to a more reasonable thermal solution including reduced cost, heatsink size, heatsink weight, or a lower system airflow rate.

Table 3 summarizes the thermal budget required to adequately cool the Intel® Core™ 2 Duo Mobile Processors on 45-nm process. Since the data is based on air data at sea level, a correction factor would be required to estimate the thermal performance at other altitudes.

Table 3.	Required Heatsink Thermal Performance (ΨJA)
	CPU	Processor SKU	TDP	Ψ JA (ºC/W)	Ψ JA (ºC/W)
			(W)	at TA = 40 ºC	at TA = 55 ºC
		Standard Voltage
		(Core 2 Duo-6M,	35	1.86	1.42
		Celeron-2M)
	Intel® Core™ 2 Duo	Low Voltage	17	3.82	2.94
		(Core 2 Duo -3M)
	Mobile Processors on 45-
	nm process
		Ultra Low Voltage
		(Core 2 Duo -2M,	10	6.5	5.0
		Celeron)

Notes:

1.TA is defined as the local (internal) ambient temperature measured approximately 1 inch upstream from the device.

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG	June 2008
17	Order Number: 320028-001