Intel 320028-001 manual Thermal Solution Requirements, Thermal Solution Characterization

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Core™ 2 Duo Mobile Processors—Thermal Solution Requirements

5.0Thermal Solution Requirements

5.1Thermal Solution Characterization

The thermal characterization parameter, Ψ (“psi”), is used to characterize thermal solution performance, as well as compare thermal solutions in identical situations (i.e., heating source, local ambient conditions, etc.). It is defined by the following equation:

Equation 1. Junction-to-Local Ambient Thermal Characterization Parameter (ΨJA)

Ψ = TJ − TA JA TDP

ΨJA = Junction-to-local ambient thermal characterization parameter (°C/W) TJUNCTION MAX = Maximum allowed device temperature (°C)

TA = Local ambient temperature near the device (°C) (see Section 7.0, “Thermal Metrology” for measurement guidelines)

TDP = Thermal Design Power (W)

The thermal characterization parameter assumes that all package power dissipation is through the thermal solution (heatsink), and is equal to TDP. A small percentage of the die power (< 5%) is dissipated through the package/socket/motherboard stack to the environment, and should not be considered to be a means of thermal control.

The junction-to-local ambient thermal characterization parameter, ΨJA, is comprised of ΨJS, which includes the thermal interface material thermal characterization parameter, and of ΨSA, the sink-to- local ambient thermal characterization parameter:

Equation 2. Junction-to-Local Ambient Thermal Characterization Parameter

ΨJA = ΨJS + ΨSA

Where:

ΨJS = Thermal characterization parameter from junction-to-sink, this also includes thermal resistance of the thermal interface material (ΨTIM) (°C/W).

ΨSA = Thermal characterization parameter from sink-to-local ambient (°C/W)

ΨSA is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air. ΨSA is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink. Figure 5 illustrates the combination of the different thermal characterization parameters.

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

 

TDG

June 2008

15

Order Number: 320028-001

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Contents June Thermal Design GuideTDG Contents Tables FiguresFirst Public release Revision HistoryDesign Flow IntroductionDefinition of Terms Sheet 1 Definition of TermsReference Documents Thermal Design Tool AvailabilityDefinition of Terms Sheet 2 Package Information Thermal Specifications for the Intel Core2 Duo processor Thermal SpecificationsThermal Design Power Maximum Allowed Component TemperatureBoard Level Keep Out Zone Requirements Mechanical SpecificationsPackage Mechanical Requirements Package Keep Out Zones RequirementsPrimary Side Keep Out Zone Requirements- Micro-FCPGA Primary Side Keep Out Zone Requirements- Micro-FCBGA Secondary Side Keep Out Zone Requirements Thermal Solution Characterization Thermal Solution RequirementsEquation 4. Required Performance of the Heatsink Equation 3. Maximum Allowable ResistanceTDP Required Heatsink Thermal Performance Ψ JAAtca Reference Thermal Solution Reference Thermal SolutionsKeep Out Zone Requirements Thermal Performance1U+ Reference Heatsink Keep Out Zone Requirements Compact PCI Reference Heatsink Heatsink Thermal Performance vs. Volumetric Airflow RateThermal Interface Material TIM Heatsink Fastener AssemblyHeatsink Orientation Relative to Airflow Direction Heatsink OrientationLocal Ambient Temperature Measurement Guidelines Die Temperature MeasurementsPower Simulation Software Additional Thermal FeaturesActive Heatsink Measurements Measuring TLA with an Active Heatsink Measuring TLA with a Passive Heatsink Reliability Requirements Reliability GuidelinesReference Heatsink Appendix a Thermal Solution Component SuppliersMechanical Drawings Appendix B Mechanical DrawingsCore 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors AdvancedTCA* Reference Heatsink Assembly AdvancedTCA* Reference Heatsink Core 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors CompactPCI* Reference Heatsink Assembly CompactPCI* Reference Heatsink Reference Heatsink PCB Keep Out Requirements Sheet 1 Reference Heatsink PCB Keep Out Requirements Sheet 2 Reference Heatsink Assembly Reference Heatsink

320028-001 specifications

The Intel 320028-001 is a robust processor designed to meet the demands of both consumers and professionals. Built on Intel's advanced microarchitecture, this model showcases a blend of high performance, energy efficiency, and cutting-edge technology.

One of the standout features of the Intel 320028-001 is its impressive clock speed, which ensures rapid data processing capabilities. This processor is designed with multiple cores, allowing it to handle several tasks simultaneously without compromising performance. This multi-core architecture is particularly beneficial for applications that require heavy multitasking or resource-intensive activities such as gaming, video editing, and 3D rendering.

In terms of technology, the Intel 320028-001 leverages Intel’s Turbo Boost technology, which dynamically increases the processor's clock speed to optimize performance based on current workload demands. This results in an efficient balance between performance and power consumption, providing users with the necessary speed when needed while conserving energy during lighter tasks.

Another key characteristic of the Intel 320028-001 is its compatibility with Intel Hyper-Threading technology. This allows each core to handle two threads simultaneously, resulting in improved multitasking capabilities and enhanced performance for threaded applications. This feature is particularly advantageous for applications that can utilize parallel processing, significantly enhancing overall system responsiveness.

Additionally, the Intel 320028-001 utilizes Intel’s Smart Cache technology. This shared cache allows for quicker data access and efficient memory usage, further optimizing execution speeds and minimizing latency. The processor is also designed to work seamlessly with the latest in memory technologies, supporting DDR4 memory for increased bandwidth and improved overall system performance.

Security features in the Intel 320028-001 include Intel Software Guard Extensions (SGX), which provide hardware-based safeguards for sensitive information, an essential component for business applications and personal data protection.

Overall, the Intel 320028-001 stands out with a combination of high-performance specs, advanced features, and energy-efficient operation, making it an excellent choice for a wide range of computing needs. Whether for gaming, professional applications, or daily use, this processor offers the reliability and performance that users expect from Intel.
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