Intel 320028-001 manual Reliability Guidelines, Reliability Requirements

Page 28

Reliability Guidelines—Core™ 2 Duo Mobile Processors

8.0Reliability Guidelines

Each motherboard, heatsink, and attach combination may vary the mechanical loading of the component. The user should carefully evaluate the reliability of the completed assembly prior to use in high volume. Some general recommendations are shown in Table 4.

Table 4.

Reliability Requirements

 

 

 

 

 

 

Test1

Requirement

Pass/Fail Criteria2

 

Mechanical Shock

50 g, board level, 11 msec, 3 shocks/axis

Visual Check and Electrical

 

Functional Test

 

 

 

 

 

 

 

 

Random Vibration

7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz

Visual Check and Electrical

 

Functional Test

 

 

 

 

 

 

 

 

Temperature Life

85 °C, 2000 hours total, checkpoints at 168, 500,

Visual Check

 

1000, and 2000 hours

 

 

 

 

 

 

 

 

Thermal Cycling

-5 °C to +70 °C, 500 cycles

Visual Check

 

 

 

 

 

Humidity

85% relative humidity, 55 °C, 1000 hours

Visual Check

 

 

 

 

Notes:

1.The above tests should be performed on a sample size of at least 12 assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

 

Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications

June 2008

TDG

Order Number: 320028-001

28

Page 27 Page 29
Image 28
Page 27 Page 29
Contents Thermal Design Guide JuneTDG Contents Figures TablesRevision History First Public releaseIntroduction Design FlowDefinition of Terms Definition of Terms Sheet 1Thermal Design Tool Availability Reference DocumentsDefinition of Terms Sheet 2 Package Information Thermal Specifications Thermal Design PowerMaximum Allowed Component Temperature Thermal Specifications for the Intel Core2 Duo processorMechanical Specifications Package Mechanical RequirementsPackage Keep Out Zones Requirements Board Level Keep Out Zone RequirementsPrimary Side Keep Out Zone Requirements- Micro-FCPGA Primary Side Keep Out Zone Requirements- Micro-FCBGA Secondary Side Keep Out Zone Requirements Thermal Solution Requirements Thermal Solution CharacterizationEquation 3. Maximum Allowable Resistance Equation 4. Required Performance of the HeatsinkRequired Heatsink Thermal Performance Ψ JA TDPReference Thermal Solutions Atca Reference Thermal SolutionThermal Performance Keep Out Zone Requirements1U+ Reference Heatsink Keep Out Zone Requirements Heatsink Thermal Performance vs. Volumetric Airflow Rate Compact PCI Reference HeatsinkHeatsink Fastener Assembly Thermal Interface Material TIMHeatsink Orientation Heatsink Orientation Relative to Airflow DirectionDie Temperature Measurements Power Simulation SoftwareAdditional Thermal Features Local Ambient Temperature Measurement GuidelinesActive Heatsink Measurements Measuring TLA with an Active Heatsink Measuring TLA with a Passive Heatsink Reliability Guidelines Reliability RequirementsAppendix a Thermal Solution Component Suppliers Reference HeatsinkAppendix B Mechanical Drawings Mechanical DrawingsCore 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors AdvancedTCA* Reference Heatsink Assembly AdvancedTCA* Reference Heatsink Core 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors CompactPCI* Reference Heatsink Assembly CompactPCI* Reference Heatsink Reference Heatsink PCB Keep Out Requirements Sheet 1 Reference Heatsink PCB Keep Out Requirements Sheet 2 Reference Heatsink Assembly Reference Heatsink

320028-001 specifications

The Intel 320028-001 is a robust processor designed to meet the demands of both consumers and professionals. Built on Intel's advanced microarchitecture, this model showcases a blend of high performance, energy efficiency, and cutting-edge technology.

One of the standout features of the Intel 320028-001 is its impressive clock speed, which ensures rapid data processing capabilities. This processor is designed with multiple cores, allowing it to handle several tasks simultaneously without compromising performance. This multi-core architecture is particularly beneficial for applications that require heavy multitasking or resource-intensive activities such as gaming, video editing, and 3D rendering.

In terms of technology, the Intel 320028-001 leverages Intel’s Turbo Boost technology, which dynamically increases the processor's clock speed to optimize performance based on current workload demands. This results in an efficient balance between performance and power consumption, providing users with the necessary speed when needed while conserving energy during lighter tasks.

Another key characteristic of the Intel 320028-001 is its compatibility with Intel Hyper-Threading technology. This allows each core to handle two threads simultaneously, resulting in improved multitasking capabilities and enhanced performance for threaded applications. This feature is particularly advantageous for applications that can utilize parallel processing, significantly enhancing overall system responsiveness.

Additionally, the Intel 320028-001 utilizes Intel’s Smart Cache technology. This shared cache allows for quicker data access and efficient memory usage, further optimizing execution speeds and minimizing latency. The processor is also designed to work seamlessly with the latest in memory technologies, supporting DDR4 memory for increased bandwidth and improved overall system performance.

Security features in the Intel 320028-001 include Intel Software Guard Extensions (SGX), which provide hardware-based safeguards for sensitive information, an essential component for business applications and personal data protection.

Overall, the Intel 320028-001 stands out with a combination of high-performance specs, advanced features, and energy-efficient operation, making it an excellent choice for a wide range of computing needs. Whether for gaming, professional applications, or daily use, this processor offers the reliability and performance that users expect from Intel.
Top Page Image Contents