Intel 320028-001 manual Definition of Terms Sheet 1

Page 7

Core™ 2 Duo Mobile Processors—Introduction

Figure 1. Thermal Design Process

Step 1: Thermal Simulation

 

 

 

 

•

Package Level Thermal Models

Step 2: Heatsink Design

 

 

•

Thermal Model User’s Guide

 

 

 

 

and Selection

 

 

 

 

•

Reference Heatsinks

 

 

 

 

•

Reference Mounting Hardware

Step 3: Thermal Validation

 

 

•

Vendor Contacts

 

 

 

 

 

 

 

 

•

Thermal Testing Software

 

 

 

 

•

Thermal Test Vehicle

 

 

 

 

•

User Guides

1.2Definition of Terms

Table 1.

Definition of Terms (Sheet 1 of 2)

 

 

 

 

Term

Definition

 

 

 

 

FCPGA

Flip Chip Pin Grid Array. A pin grid array packaging technology where the die is

 

exposed on the package substrate.

 

 

 

 

 

 

FCBGA

Flip Chip Ball Grid Array. A ball grid array packaging technology where the die is

 

exposed on the package substrate.

 

 

 

 

 

 

TJUNCTION-MAX

Maximum allowed component (junction) temperature. Also referred to as TJ-MAX

 

TDP

Thermal Design Power. Thermal solutions should be designed to dissipate this

 

target power level.

 

 

 

 

 

 

TLA

Local ambient temperature. This is the temperature measured inside the chassis,

 

approximately 1 inch upstream of a component heatsink. Also referred to as TA.

 

 

 

 

Junction-to-ambient thermal characterization parameter. A measure of heatsink

 

ΨJA

thermal performance using the total package power. Defined as (T JUNCTION – TLA) /

 

 

Total Package Power

 

 

 

 

 

Thermal interface material thermal characterization parameter. A measure of

 

ΨTIM

thermal interface material performance using total package power. Defined as (T

 

 

CASE – T JUNCTION)/ Total Package Power. Also referred to as ΨJS.

 

 

Sink-to-ambient thermal characterization parameter. A measure of heatsink

 

ΨSA

thermal performance using total package power. Defined as (T SINK – T JUNCTION)/

 

 

Total Package Power.

 

 

 

 

°C

Degrees in Celsius

 

 

 

 

CFM

Volumetric airflow rate in cubic feet per minute

 

 

 

 

in.

Inches

 

 

 

 

LFM

Airflow velocity in linear feet per minute

 

 

 

 

PCB

Printed circuit board

 

 

 

 

TSINK

Heatsink temperature measured on the underside of the heatsink base.

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

 

TDG

June 2008

7

Order Number: 320028-001

Page 6 Page 8
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Contents June Thermal Design GuideTDG Contents Tables FiguresFirst Public release Revision HistoryDesign Flow IntroductionDefinition of Terms Sheet 1 Definition of TermsThermal Design Tool Availability Reference DocumentsDefinition of Terms Sheet 2 Package Information Thermal Specifications for the Intel Core2 Duo processor Thermal SpecificationsThermal Design Power Maximum Allowed Component TemperatureBoard Level Keep Out Zone Requirements Mechanical SpecificationsPackage Mechanical Requirements Package Keep Out Zones RequirementsPrimary Side Keep Out Zone Requirements- Micro-FCPGA Primary Side Keep Out Zone Requirements- Micro-FCBGA Secondary Side Keep Out Zone Requirements Thermal Solution Characterization Thermal Solution RequirementsEquation 4. Required Performance of the Heatsink Equation 3. Maximum Allowable ResistanceTDP Required Heatsink Thermal Performance Ψ JAAtca Reference Thermal Solution Reference Thermal SolutionsThermal Performance Keep Out Zone Requirements1U+ Reference Heatsink Keep Out Zone Requirements Compact PCI Reference Heatsink Heatsink Thermal Performance vs. Volumetric Airflow RateThermal Interface Material TIM Heatsink Fastener AssemblyHeatsink Orientation Relative to Airflow Direction Heatsink OrientationLocal Ambient Temperature Measurement Guidelines Die Temperature MeasurementsPower Simulation Software Additional Thermal FeaturesActive Heatsink Measurements Measuring TLA with an Active Heatsink Measuring TLA with a Passive Heatsink Reliability Requirements Reliability GuidelinesReference Heatsink Appendix a Thermal Solution Component SuppliersMechanical Drawings Appendix B Mechanical DrawingsCore 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors AdvancedTCA* Reference Heatsink Assembly AdvancedTCA* Reference Heatsink Core 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors CompactPCI* Reference Heatsink Assembly CompactPCI* Reference Heatsink Reference Heatsink PCB Keep Out Requirements Sheet 1 Reference Heatsink PCB Keep Out Requirements Sheet 2 Reference Heatsink Assembly Reference Heatsink

320028-001 specifications

The Intel 320028-001 is a robust processor designed to meet the demands of both consumers and professionals. Built on Intel's advanced microarchitecture, this model showcases a blend of high performance, energy efficiency, and cutting-edge technology.

One of the standout features of the Intel 320028-001 is its impressive clock speed, which ensures rapid data processing capabilities. This processor is designed with multiple cores, allowing it to handle several tasks simultaneously without compromising performance. This multi-core architecture is particularly beneficial for applications that require heavy multitasking or resource-intensive activities such as gaming, video editing, and 3D rendering.

In terms of technology, the Intel 320028-001 leverages Intel’s Turbo Boost technology, which dynamically increases the processor's clock speed to optimize performance based on current workload demands. This results in an efficient balance between performance and power consumption, providing users with the necessary speed when needed while conserving energy during lighter tasks.

Another key characteristic of the Intel 320028-001 is its compatibility with Intel Hyper-Threading technology. This allows each core to handle two threads simultaneously, resulting in improved multitasking capabilities and enhanced performance for threaded applications. This feature is particularly advantageous for applications that can utilize parallel processing, significantly enhancing overall system responsiveness.

Additionally, the Intel 320028-001 utilizes Intel’s Smart Cache technology. This shared cache allows for quicker data access and efficient memory usage, further optimizing execution speeds and minimizing latency. The processor is also designed to work seamlessly with the latest in memory technologies, supporting DDR4 memory for increased bandwidth and improved overall system performance.

Security features in the Intel 320028-001 include Intel Software Guard Extensions (SGX), which provide hardware-based safeguards for sensitive information, an essential component for business applications and personal data protection.

Overall, the Intel 320028-001 stands out with a combination of high-performance specs, advanced features, and energy-efficient operation, making it an excellent choice for a wide range of computing needs. Whether for gaming, professional applications, or daily use, this processor offers the reliability and performance that users expect from Intel.
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