Intel 320028-001 manual Contents

			Core™ 2 Duo Mobile Processors—Contents
Contents
1.0	Introduction		6
	1.1	Design Flow	6
	1.2	Definition of Terms	7
	1.3	Reference Documents	8
	1.4	Thermal Design Tool Availability	8
2.0	Package Information		9
3.0	Thermal Specifications		10
	3.1	Thermal Design Power	10
	3.2	Maximum Allowed Component Temperature	10
4.0	Mechanical Specifications		11
	4.1	Package Mechanical Requirements	11
		4.1.1 Die Pressure/Load Upper Limit	11
		4.1.2 Die Pressure/Load Lower Limit	11
	4.2	Package Keep Out Zones Requirements	11
	4.3	Board Level Keep Out Zone Requirements	11
5.0	Thermal Solution Requirements		15
	5.1	Thermal Solution Characterization	15

5.1.1Calculating the Required Thermal Performance for the Intel® Core™2 Duo

			processor	16
6.0	Reference Thermal Solutions			18
	6.1	ATCA Reference Thermal Solution		18
	6.2	Keep Out Zone Requirements		19
	6.3	Thermal Performance		19
	6.4	1U+ Reference Heatsink		19
		6.4.1 Keep Out Zone Requirements		20
		6.4.2	Thermal Performance	20
	6.5	Compact PCI Reference Heatsink		21
		6.5.1 Keep Out Zone Requirements		22
		6.5.2	Thermal Performance	22
	6.6	Heatsink Fastener Assembly		22
	6.7	Thermal Interface Material (TIM)		22
	6.8	Heatsink Orientation		23
7.0	Thermal Metrology			24
	7.1	Die Temperature Measurements		24
	7.2	Power Simulation Software		24
	7.3	Additional Thermal Features		24
	7.4	Local Ambient Temperature Measurement Guidelines		24
		7.4.1	Active Heatsink Measurements	25
		7.4.2	Passive Heatsink Measurements	25
8.0	Reliability Guidelines			28
A	Thermal Solution Component Suppliers			29
B	Mechanical Drawings			30

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG	June 2008
3	Order Number: 320028-001