Intel 320028-001 manual Package Information

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Core™ 2 Duo Mobile Processors—Package Information

2.0Package Information

The Intel® Core™2 Duo Processor (XE and SV) is available in 478-pin Micro-FCPGA packages as well as 479-ball Micro-FCBGA packages. The Intel® Core™2 Duo Processor SFF processor (LV and ULV) is available in 956-ball Micro-FCBGA packages. The package mechanical dimensions can be found in the product’s datasheet.

The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors are electrically conductive. Care should be taken to prevent the capacitors from contacting any other electrically conductive materials. Doing so may short the capacitors and possibly damage the device or render it inactive.

The processor package has mechanical load limits that are specified in the processor datasheet. These load limits should not be exceeded during heatsink installation, removal, mechanical stress testing, or standard shipping conditions. The heatsink mass can also add additional dynamic compressive load to the package during a mechanical shock event. Amplification factors due to the impact force during shock must be taken into account in dynamic load calculations. The total combination of dynamic and static compressive load should not then exceed the processor datasheet compressive dynamic load specification during a vertical shock. It is not recommended to use any portion of the processor substrate as a mechanical reference or load bearing surface in either static or dynamic compressive load conditions.

Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide

 

TDG

June 2008

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Order Number: 320028-001

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Contents June Thermal Design GuideTDG Contents Tables FiguresFirst Public release Revision HistoryDesign Flow IntroductionDefinition of Terms Sheet 1 Definition of TermsReference Documents Thermal Design Tool AvailabilityDefinition of Terms Sheet 2 Package Information Thermal Design Power Thermal SpecificationsMaximum Allowed Component Temperature Thermal Specifications for the Intel Core2 Duo processorPackage Mechanical Requirements Mechanical SpecificationsPackage Keep Out Zones Requirements Board Level Keep Out Zone RequirementsPrimary Side Keep Out Zone Requirements- Micro-FCPGA Primary Side Keep Out Zone Requirements- Micro-FCBGA Secondary Side Keep Out Zone Requirements Thermal Solution Characterization Thermal Solution RequirementsEquation 4. Required Performance of the Heatsink Equation 3. Maximum Allowable ResistanceTDP Required Heatsink Thermal Performance Ψ JAAtca Reference Thermal Solution Reference Thermal SolutionsKeep Out Zone Requirements Thermal Performance1U+ Reference Heatsink Keep Out Zone Requirements Compact PCI Reference Heatsink Heatsink Thermal Performance vs. Volumetric Airflow RateThermal Interface Material TIM Heatsink Fastener AssemblyHeatsink Orientation Relative to Airflow Direction Heatsink OrientationPower Simulation Software Die Temperature MeasurementsAdditional Thermal Features Local Ambient Temperature Measurement GuidelinesActive Heatsink Measurements Measuring TLA with an Active Heatsink Measuring TLA with a Passive Heatsink Reliability Requirements Reliability GuidelinesReference Heatsink Appendix a Thermal Solution Component SuppliersMechanical Drawings Appendix B Mechanical DrawingsCore 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors AdvancedTCA* Reference Heatsink Assembly AdvancedTCA* Reference Heatsink Core 2 Duo Mobile Processors-Mechanical Drawings Mechanical Drawings-Core 2 Duo Mobile Processors CompactPCI* Reference Heatsink Assembly CompactPCI* Reference Heatsink Reference Heatsink PCB Keep Out Requirements Sheet 1 Reference Heatsink PCB Keep Out Requirements Sheet 2 Reference Heatsink Assembly Reference Heatsink

320028-001 specifications

The Intel 320028-001 is a robust processor designed to meet the demands of both consumers and professionals. Built on Intel's advanced microarchitecture, this model showcases a blend of high performance, energy efficiency, and cutting-edge technology.

One of the standout features of the Intel 320028-001 is its impressive clock speed, which ensures rapid data processing capabilities. This processor is designed with multiple cores, allowing it to handle several tasks simultaneously without compromising performance. This multi-core architecture is particularly beneficial for applications that require heavy multitasking or resource-intensive activities such as gaming, video editing, and 3D rendering.

In terms of technology, the Intel 320028-001 leverages Intel’s Turbo Boost technology, which dynamically increases the processor's clock speed to optimize performance based on current workload demands. This results in an efficient balance between performance and power consumption, providing users with the necessary speed when needed while conserving energy during lighter tasks.

Another key characteristic of the Intel 320028-001 is its compatibility with Intel Hyper-Threading technology. This allows each core to handle two threads simultaneously, resulting in improved multitasking capabilities and enhanced performance for threaded applications. This feature is particularly advantageous for applications that can utilize parallel processing, significantly enhancing overall system responsiveness.

Additionally, the Intel 320028-001 utilizes Intel’s Smart Cache technology. This shared cache allows for quicker data access and efficient memory usage, further optimizing execution speeds and minimizing latency. The processor is also designed to work seamlessly with the latest in memory technologies, supporting DDR4 memory for increased bandwidth and improved overall system performance.

Security features in the Intel 320028-001 include Intel Software Guard Extensions (SGX), which provide hardware-based safeguards for sensitive information, an essential component for business applications and personal data protection.

Overall, the Intel 320028-001 stands out with a combination of high-performance specs, advanced features, and energy-efficient operation, making it an excellent choice for a wide range of computing needs. Whether for gaming, professional applications, or daily use, this processor offers the reliability and performance that users expect from Intel.